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公开(公告)号：US08044306B2
公开(公告)日：2011-10-25
申请号：US12111256
申请日：2008-04-29
申请人： Michimasa Takahashi
发明人： Michimasa Takahashi
IPC分类号： H05K1/11
CPC分类号： H05K3/4602 , H05K1/0366 , H05K3/4652 , H05K2201/09536 , H05K2201/0959 , Y10T29/4913 , Y10T29/49165 , Y10T156/1062
摘要： A wiring board has a base substrate, a conductive pattern formed on the base substrate, an insulation layer formed on the conductive pattern and the base substrate and including a resin-impregnated inorganic cloth, a conductive pattern formed on the insulating layer, a via formed in the insulation layer and connecting the conductive pattern formed on the base substrate and the conductive pattern formed on the insulating layer, and a through-hole connected to the conductive pattern formed on the base substrate, penetrating through the base substrate and having a hole diameter in a range of 10 μm to 150 μm.
摘要翻译： 布线板具有基底基板，形成在基底基板上的导电图案，形成在导电图案和基底基板上的绝缘层，并且包括树脂浸渍的无机布，形成在绝缘层上的导电图案，形成的通孔 在所述绝缘层中并且连接形成在所述基底基板上的导电图案和形成在所述绝缘层上的导电图案，以及连接到形成在所述基底基板上的所述导电图案的通孔，穿过所述基底基板，并具有孔直径 在10μm至150μm的范围内。
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公开(公告)号：US20110220407A1
公开(公告)日：2011-09-15
申请号：US13112016
申请日：2011-05-20
CPC分类号： H05K3/4691 , H05K1/0218 , H05K3/0035 , H05K3/4069 , H05K3/4602 , H05K3/4652 , H05K3/4664 , H05K2201/0187 , H05K2201/0715 , H05K2201/09127 , H05K2201/09509 , H05K2201/096 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer including an inorganic material and covering the flexible board and the non-flexible substrate, the insulating layer exposing at least one portion of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.
摘要翻译： 弹性刚性布线板包括柔性基板，该柔性基板包括柔性基板和形成在柔性基板上的导体图案，邻近柔性基板设置的非柔性基板，包括无机材料并覆盖柔性基板的绝缘层和 非柔性基板，绝缘层暴露柔性板的至少一部分，形成在绝缘层上的导体图案，以及将柔性基板的导体图案与导体图案连接在绝缘层上的镀层。
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公开(公告)号：US20110194262A1
公开(公告)日：2011-08-11
申请号：US12949078
申请日：2010-11-18
IPC分类号： H05K1/00
CPC分类号： H05K3/4691 , H05K2201/09827 , H05K2201/09845 , Y10T29/49124 , Y10T29/49128
摘要： A flex-rigid wiring board including an insulative substrate, a flexible wiring board positioned beside the insulative substrate, an insulation layer positioned over the insulative substrate and the flexible wiring board and exposing a portion of the flexible wiring board, and a wiring layer made of a conductor and formed on the insulation layer. The insulation layer has a tapered portion which becomes thinner toward an end surface of the insulation layer in the direction of the portion of the flexible wiring board exposed by the insulation layer. The wiring layer has a sloping portion formed on the tapered portion of the insulation layer.
摘要翻译： 一种柔性刚性布线板，包括绝缘基板，位于绝缘基板旁边的柔性布线板，位于绝缘基板和柔性布线板之上的绝缘层，并使柔性布线板的一部分露出，并且布线层由 导体，形成在绝缘层上。 绝缘层具有锥形部分，其在由绝缘层暴露的柔性线路板的部分的方向上朝向绝缘层的端面变薄。 布线层具有形成在绝缘层的锥形部分上的倾斜部分。
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公开(公告)号：US20110180908A1
公开(公告)日：2011-07-28
申请号：US12895126
申请日：2010-09-30
CPC分类号： H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/5383 , H05K1/0298 , H05K1/092 , H05K1/116 , H05K1/18 , H05K3/0011 , H05K3/0094 , H05K3/4069 , H05K3/4611 , H05K3/4623 , H05K2201/09545 , H05K2201/09563 , H05K2201/096 , H05K2201/09854 , Y10T156/1056
摘要： A wiring board includes a laminated body having first and second surfaces and including first, second and third insulation layers in the order of the first, second and third insulation layers from the first surface toward the second surface. The first insulation layer has a first hole which penetrates through the first insulation layer and includes a first conductor made of a plating in the first hole. The second insulation layer has a second hole which penetrates through the second insulation layer and includes a second conductor made of a conductive paste in the second hole. The third insulation layer has a third hole which penetrates through the third insulation layer and includes a third conductor made of a plating in the third hole. The first, second and third conductors are positioned along the same axis and are electrically continuous with each other.
摘要翻译： 布线板包括具有第一表面和第二表面并且包括第一，第二和第三绝缘层从第一表面朝向第二表面的顺序的层叠体。 第一绝缘层具有穿过第一绝缘层的第一孔，并且包括在第一孔中由电镀制成的第一导体。 第二绝缘层具有穿过第二绝缘层的第二孔，并且包括在第二孔中由导电膏制成的第二导体。 第三绝缘层具有穿过第三绝缘层的第三孔，并且包括在第三孔中由电镀制成的第三导体。 第一，第二和第三导体沿着相同的轴定位并且彼此电连续。
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公开(公告)号：US07759582B2
公开(公告)日：2010-07-20
申请号：US11480851
申请日：2006-07-06
CPC分类号： H05K3/421 , H05K1/115 , H05K3/423 , H05K3/4602 , H05K3/4652 , H05K2201/0394 , H05K2201/09563 , H05K2201/096 , H05K2201/09709 , H05K2201/09863 , H05K2203/0733 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T428/31511
摘要： A multilayer printed wiring board comprises insulating layers and conductor layers being stacked alternately on each other. The conductor layers are electrically connected to each other through viaholes formed in the insulating layers. Each of the viaholes is formed to bulge in a direction generally orthogonal to the direction of thickness of the insulating layer. The multilayer printed wiring board is to have electronic components such as a capacitor, IC and the like mounted on the surface layer thereof.
摘要翻译： 多层印刷布线板包括彼此交替堆叠的绝缘层和导体层。 导体层通过形成在绝缘层中的通孔彼此电连接。 每个通孔形成为沿与绝缘层的厚度方向大致正交的方向凸出。 该多层印刷线路板具有安装在其表面层上的诸如电容器，IC等的电子部件。
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公开(公告)号：US20090255111A1
公开(公告)日：2009-10-15
申请号：US12488638
申请日：2009-06-22
IPC分类号： H05K3/00
CPC分类号： H05K3/421 , H05K1/115 , H05K3/423 , H05K3/4602 , H05K3/4652 , H05K2201/0394 , H05K2201/09563 , H05K2201/096 , H05K2201/09709 , H05K2201/09863 , H05K2203/0733 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T428/31511
摘要： A method of forming a circuit board which includes generating laser light with a carbon dioxide laser and making a hole through an insulating substrate by irradiating the insulating substrate with the laser light. The hole includes a top opening in a top surface of the insulating substrate, a bottom opening in a bottom surface of the insulating substrate, and an inner wall extending from the top opening to the bottom opening along a thickness direction of the insulating substrate, the inner wall including a bulge which extends in a direction generally orthogonal to the thickness direction. A via hole is formed in the insulating substrate by providing metal in the hole such that the metal extends from the top opening to the bottom opening along the inner wall, and completely closes each of the top and bottom openings.
摘要翻译： 一种形成电路板的方法，其包括用二氧化碳激光器产生激光并通过用激光照射绝缘基板使绝缘基板形成孔。 所述孔包括在所述绝缘基板的上表面中的顶部开口，所述绝缘基板的底表面中的底部开口以及沿着所述绝缘基板的厚度方向从所述顶部开口延伸到所述底部开口的内壁， 内壁包括在大致正交于厚度方向的方向上延伸的凸起。 通过在孔中提供金属使得金属沿着内壁从顶部开口延伸到底部开口，并且完全封闭每个顶部和底部开口，在绝缘基板中形成通孔。
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公开(公告)号：US20090107708A1
公开(公告)日：2009-04-30
申请号：US11923509
申请日：2007-10-24
申请人： Michimasa Takahashi , Ian Timms
发明人： Michimasa Takahashi , Ian Timms
CPC分类号： H05K3/4652 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05155 , H01L2224/05568 , H01L2224/05644 , H01L2224/16227 , H01L2924/15153 , H01L2924/1533 , H05K1/183 , H05K3/0035 , H05K3/4697 , H05K2201/09127 , H05K2203/063 , Y10T29/49156 , Y10T29/49165 , H01L2924/00014
摘要： An electronic parts substrate includes a base substrate, a plurality of insulating resin layers provided on the base substrate, at least one conductive circuit, and at least one filled via provided in the plurality of insulating resin layers. The at least one conductive circuit is sandwiched between the plurality of insulating resin layers and/or between the base substrate and the plurality of insulating resin layers. At least one opening is formed in at least one of the plurality of insulating resin layers.
摘要翻译： 电子部件基板包括基底基板，设置在基底基板上的多个绝缘树脂层，至少一个导电电路和设置在多个绝缘树脂层中的至少一个填充通孔。 所述至少一个导电电路夹在所述多个绝缘树脂层之间和/或所述基底基板与所述多个绝缘树脂层之间。 至少一个开口形成在所述多个绝缘树脂层中的至少一个中。
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公开(公告)号：US20090020317A1
公开(公告)日：2009-01-22
申请号：US12144691
申请日：2008-06-24
CPC分类号： H05K3/4691 , H05K1/0366 , H05K1/0373 , H05K3/0035 , H05K3/0052 , H05K3/4652 , H05K2201/0187 , H05K2201/0209 , H05K2201/096 , H05K2201/09845 , H05K2203/1536 , Y10T29/49124 , Y10T29/49126 , Y10T29/49165
摘要： A wiring board and method of forming a wiring board. The wiring board includes a first substrate and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond at least one edge of the second substrate. At least one of the base substrate, the first substrate or the second substrate comprises pliable resin, and at least one other of the base substrate, the first substrate or the second substrate comprises an inorganic filler.
摘要翻译： 布线基板及布线基板的形成方法。 布线板包括第一基板和具有比第一基板的安装面积小的安装面积的第二基板。 基底衬底层压在第一衬底和第二衬底之间，使得第一衬底延伸超过第二衬底的至少一个边缘。 基底衬底，第一衬底或第二衬底中的至少一个包括柔韧树脂，并且基底衬底，第一衬底或第二衬底中的至少一个包括无机填料。
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公开(公告)号：US20090014207A1
公开(公告)日：2009-01-15
申请号：US12111256
申请日：2008-04-29
申请人： Michimasa TAKAHASHI
发明人： Michimasa TAKAHASHI
CPC分类号： H05K3/4602 , H05K1/0366 , H05K3/4652 , H05K2201/09536 , H05K2201/0959 , Y10T29/4913 , Y10T29/49165 , Y10T156/1062
摘要： A wiring board has a base substrate, a conductive pattern formed on the base substrate, an insulation layer formed on the conductive pattern and the base substrate and including a resin-impregnated inorganic cloth, a conductive pattern formed on the insulating layer, a via formed in the insulation layer and connecting the conductive pattern formed on the base substrate and the conductive pattern formed on the insulating layer, and a through-hole connected to the conductive pattern formed on the base substrate, penetrating through the base substrate and having a hole diameter in a range of 10 μm to 150 μm.
摘要翻译： 布线板具有基底基板，形成在基底基板上的导电图案，形成在导电图案和基底基板上的绝缘层，并且包括树脂浸渍的无机布，形成在绝缘层上的导电图案，形成的通孔 在所述绝缘层中并且连接形成在所述基底基板上的导电图案和形成在所述绝缘层上的导电图案，以及连接到形成在所述基底基板上的所述导电图案的通孔，穿过所述基底基板，并具有孔直径 在10个到150个妈妈的范围内。
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公开(公告)号：US20080007927A1
公开(公告)日：2008-01-10
申请号：US11611538
申请日：2006-12-15
申请人： Sotaro Ito , Michimasa Takahashi , Yukinobu Mikado
发明人： Sotaro Ito , Michimasa Takahashi , Yukinobu Mikado
CPC分类号： H05K1/0218 , H01L23/49822 , H01L23/5389 , H01L23/552 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/12105 , H01L2224/2402 , H01L2224/73267 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15157 , H01L2924/1517 , H01L2924/15331 , H01L2924/15788 , H01L2924/3025 , H01L2924/3511 , H05K1/183 , H05K1/185 , H05K3/4652 , H05K2201/09981 , H05K2203/0733 , Y10T29/49155 , H01L2924/00
摘要： A multilayer printed circuit board, wherein, on a resin-insulating layer that houses a semiconductor element, another resin-insulating layer and a conductor circuit are formed with conductor circuits electrically connected through a via hole, wherein a electromagnetic shielding layer is formed on a resin-insulating layer surrounding a concave portion for housing a semiconductor element or on the inner wall surface of the concave portion, and the semiconductor element is embedded in the concave portion.
摘要翻译： 一种多层印刷电路板，其中，在容纳半导体元件的树脂绝缘层，另一树脂绝缘层和导体电路上形成有通过通孔电连接的导体电路，其中电磁屏蔽层形成在 环绕用于容纳半导体元件的凹部或凹部的内壁面的树脂绝缘层，并且半导体元件嵌入在凹部中。
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