公开(公告)号：US20100013108A1

公开(公告)日：2010-01-21

申请号：US12551807

申请日：2009-09-01

Applicant: David Gibson ,  Andy Stavros

Inventor： David Gibson ,  Andy Stavros

IPC: H01L23/50

CPC classification number: H01L25/10 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/14 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/1437 ,  H01L2924/15311 ,  H05K1/112 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/10378 ,  H05K2201/10515 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A microelectronic assembly includes units superposed on one another to form at least one stack having a vertical direction. Each unit includes one or more microelectronic devices and has top and bottom surfaces. Top unit terminals are exposed at the top surfaces and bottom unit terminals are exposed at the bottom surfaces. The top and bottom unit terminals are provided at a set of ordered column positions. Each top unit terminal of the set, except the top unit terminals at the highest ordered column position, is connected to a respective bottom unit terminal of the same unit at a next higher ordered column position. Each bottom unit terminal of the set, except the bottom unit terminals of the lowest unit in the stack, is connected to a respective upper unit terminal of the next lower unit in the stack at the same column position.

Abstract translation: 微电子组件包括彼此叠置以形成具有垂直方向的至少一个堆叠的单元。 每个单元包括一个或多个微电子器件，并且具有顶表面和底表面。 顶部单元端子在顶部表面露出，底部单元端子暴露在底部表面。 顶部和底部单元端子设置在一组有序列位置。 除了在最高有序列位置的顶部单元端子之外，组件的每个顶部单元端子在下一个更高排序的列位置处连接到同一单元的相应底部单元端子。 除了堆叠中最低单元的底部单元端子之外，组件的每个底部单元端子连接到堆叠中的下一个下部单元的相应上部单元端子处于相同的列位置。

公开(公告)号：US20080141243A1

公开(公告)日：2008-06-12

申请号：US11635906

申请日：2006-12-08

Applicant: Robert F. Sheppard ,  Stuart De Wavrin ,  David Gibson ,  Drew Dubber

Inventor： Robert F. Sheppard ,  Stuart De Wavrin ,  David Gibson ,  Drew Dubber

IPC: G06F9/445

CPC classification number: G06F8/61

Abstract: A system, method, and computer program product for generating a distributable software package, including loading a template/profile; loading at least one module; receiving configuration options over a network connection; and assembling a distributable software package according to the profile, template(s), modules, and the configuration options.

Abstract translation: 一种用于生成可分发软件包的系统，方法和计算机程序产品，包括加载模板/简档; 加载至少一个模块; 通过网络连接接收配置选项; 并根据配置文件，模板，模块和配置选项组装可分发的软件包。

公开(公告)号：US20070290316A1

公开(公告)日：2007-12-20

申请号：US11710752

申请日：2007-02-26

Applicant: David Gibson ,  Andy Stavros

Inventor： David Gibson ,  Andy Stavros

IPC: H01L23/02

CPC classification number: H01L25/10 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/14 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/1437 ,  H01L2924/15311 ,  H05K1/112 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/10378 ,  H05K2201/10515 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A microelectronic assembly includes units superposed on one another to form at least one stack having a vertical direction. Each unit includes one or more microelectronic devices and has top and bottom surfaces. Top unit terminals are exposed at the top surfaces and bottom unit terminals are exposed at the bottom surfaces. The top and bottom unit terminals are provided at a set of ordered column positions. Each top unit terminal of the set, except the top unit terminals at the highest ordered column position, is connected to a respective bottom unit terminal of the same unit at a next higher ordered column position. Each bottom unit terminal of the set, except the bottom unit terminals of the lowest unit in the stack, is connected to a respective upper unit terminal of the next lower unit in the stack at the same column position.

Abstract translation: 微电子组件包括彼此叠置以形成具有垂直方向的至少一个堆叠的单元。 每个单元包括一个或多个微电子器件，并且具有顶表面和底表面。 顶部单元端子在顶部表面露出，底部单元端子暴露在底部表面。 顶部和底部单元端子设置在一组有序列位置。 除了在最高有序列位置的顶部单元端子之外，组件的每个顶部单元端子在下一个更高排序的列位置处连接到同一单元的相应底部单元端子。 除了堆叠中最低单元的底部单元端子之外，组合的每个底部单元端子连接到堆叠中的下一个下部单元的相应的上部单元端子处于相同的列位置。

公开(公告)号：US20070257069A1

公开(公告)日：2007-11-08

申请号：US10597800

申请日：2005-02-09

Applicant: David Gibson ,  Geoffrey Seymour

Inventor： David Gibson ,  Geoffrey Seymour

IPC: B65D47/00 ,  B65D41/17

CPC classification number: B65D47/123 ,  B65D41/17 ,  B65D47/128

Abstract: A dispensing nozzle having: (i) an elongate nozzle body having a base portion and a dispensing end; (ii) an internal conduit in the nozzle body for delivering product from the base portion to the dispensing end; (iii) engaging formations on the nozzle for inter-engaging with co-operating engaging formations on a cap, to hold said cap in a position over-fitting the nozzle; and (iv) an external ramp on the nozzle body and against which a co-operating portion on the cap may act, to provide sufficient relative separation force between the cap and the nozzle body, to separate the engaging formations on the cap and the nozzle from an inter-engaged position. A cap for overfitting a dispensing nozzle is also provided having: (i) a first closed end; (ii) a housing for receiving an elongate nozzle body and defining a second open end; (iii) engaging formations on the cap for inter-engaging with co-operating engaging formations on the nozzle, to hold said cap in a position over-fitting the nozzle; and (iii) a mouth about the open end; at least one co-operating portion on the cap arranged to act on a ramping surface of the nozzle when overfitted on the nozzle so as to provide sufficient relative separation force between the cap and the nozzle body, to separate the engaging formations on the cap and the nozzle from an inter-engaged position. The cap and nozzle when inter-engaged are easily separated by substantially less than one 360° turn and provide a strong separating force which can overcome fouling or bonding caused by curing of dispensed product.

Abstract translation: 一种分配喷嘴，其具有：（i）具有基部和分配端的细长喷嘴体; （ii）喷嘴主体中的内部导管，用于将产品从基部输送到分配端; （iii）在喷嘴上接合结构，以与盖上的配合接合结构相互接合，以将所述盖保持在与喷嘴相配合的位置上; 和（iv）喷嘴主体上的外部斜坡，帽子上的配合部分可与其作用，以在盖和喷嘴主体之间提供足够的相对分离力，以分离盖子和喷嘴上的接合结构 从一个互动的位置。 还提供了用于过度配合分配喷嘴的盖，其具有：（i）第一封闭端; （ii）用于容纳细长喷嘴体并限定第二开口端的壳体; （iii）接合盖上的结构，以与喷嘴上的配合接合结构相互接合，以将所述盖保持在与喷嘴相配合的位置; 和（iii）关于开放端的嘴; 所述盖上的至少一个配合部分设置成当过度配合在所述喷嘴上时作用在所述喷嘴的斜坡表面上，以便在所述盖和所述喷嘴体之间提供足够的相对分离力，以分离所述盖上的接合结构， 喷嘴从相互接合的位置。 相互接合时的盖和喷嘴容易分离大致小于一个360°的转角，并且提供强大的分离力，其可以克服由分散产物的固化引起的结垢或粘合。

公开(公告)号：US20070051325A1

公开(公告)日：2007-03-08

申请号：US10563735

申请日：2004-07-07

Applicant: David Gibson

Inventor： David Gibson

IPC: A01K21/00

CPC classification number: A61D7/00

Abstract: An apparatus for positioning an item in or near a natural orifice of a non-human animal, includes at least one resilient rod (2) having a first portion adapted to the shape of part of the animal's body spaced from the orifice and a second portion adapted to extend to or beyond the part of the animal's body in the region of the orifice. An achoring arrangement 1 anchors the rod(s) (2) to the part of the animal's body spaced from the orifice. A transverse cross member (4) is adapted in use to be biased into contact with the animal's body in the region of the natural orifice as a result of the resilience of the rod(s) (2).

Abstract translation: 一种用于将物品定位在非人类动物的自然孔中或附近的装置，包括至少一个弹性杆（2），其具有适于与所述孔间隔开的所述动物体的一部分的形状的第一部分，以及第二部分 适于在孔口的区域中延伸到或超出动物身体的部分。 锚定装置1将杆（2）锚定到与孔口间隔开的动物体的部分。 横向横向构件（4）适用于由于杆（2）的弹性而在天然孔的区域中被偏压成与动物的身体接触。

公开(公告)号：US20060278997A1

公开(公告)日：2006-12-14

申请号：US11284289

申请日：2005-11-21

Applicant: David Gibson ,  Giles Humpston ,  Belgacem Haba

Inventor： David Gibson ,  Giles Humpston ,  Belgacem Haba

IPC: H01L23/48

CPC classification number: H01L25/105 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/73204 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K3/3436 ,  H05K2201/09827 ,  H05K2201/10674 ,  H05K2203/0455 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A microelectronic element is mounted to a substrate using solder elements disposed at least partially within vias of the substrate. The vias have tapering walls. During reflow of the solder, the microelectronic element may move toward the substrate. Such movement may be impelled, for example, by interfacial tension between the solder and the tapering via wall. This movement reduces the height of the completed assembly.

Abstract translation: 使用至少部分地设置在衬底的通孔内的焊料元件将微电子元件安装到衬底上。 通孔有逐渐变细的墙壁。 在焊料回流期间，微电子元件可以朝向衬底移动。 这种移动可以例如通过焊料和锥形通孔壁之间的界面张力而被推动。 该运动减少了完成组件的高度。

公开(公告)号：US20060278962A1

公开(公告)日：2006-12-14

申请号：US11321378

申请日：2005-12-29

Applicant: David Gibson

Inventor： David Gibson

IPC: H01L23/495

CPC classification number: H01L25/16 ,  H01L23/4985 ,  H01L23/5387 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2225/06579 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic package including a dielectric element having a fold, a first run and a second run. The dielectric element also includes a first region on the first run, and a second region on the second run. The first and second runs define a cavity which has a first microelectronic device disposed within the cavity. The microelectronic package further includes a plurality of traces disposed on the dielectric element, wherein at least some of the traces are composite traces. The composite traces include a first portion extending in the first region and having a first connection point in the first region, and a second portion extending in the second region and having a second connection point in the second region, with the connection points being outside of the fold. The first connection points are connected to the second connection points to form the composite traces.

Abstract translation: 一种微电子封装，包括具有折叠，第一次运行和第二次运行的介电元件。 电介质元件还包括第一次运行的第一区域和第二次运行的第二区域。 第一和第二行程限定了具有设置在空腔内的第一微电子器件的空腔。 微电子封装还包括设置在电介质元件上的多个迹线，其中至少一些迹线是复合迹线。 复合迹线包括在第一区域中延伸并且具有第一区域中的第一连接点的第一部分和在第二区域中延伸并且在第二区域中具有第二连接点的第二部分，连接点在 折叠。 第一连接点连接到第二连接点以形成复合迹线。

公开(公告)号：US20050173796A1

公开(公告)日：2005-08-11

申请号：US11062413

申请日：2005-02-22

Applicant: L. Pflughaupt ,  David Gibson ,  Young-Gon Kim ,  Craig Mitchell ,  Wael Zohni ,  Ilyas Mohammed

Inventor： L. Pflughaupt ,  David Gibson ,  Young-Gon Kim ,  Craig Mitchell ,  Wael Zohni ,  Ilyas Mohammed

IPC: H01L21/44 ,  H01L23/485 ,  H01L23/50 ,  H01L23/66 ,  H05K1/02

CPC classification number: H01L23/50 ,  H01L23/528 ,  H01L23/66 ,  H01L24/10 ,  H01L24/13 ,  H01L24/14 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14505 ,  H01L2224/16 ,  H01L2224/4824 ,  H01L2224/78301 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/023 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic assembly and a fabrication method are provided which includes a microelectronic element such as a chip or element of a package. A plurality of surface-mountable contacts are arranged in an array exposed at a major surface of the microelectronic element. One or more passive elements, e.g., a resistor, inductor, capacitor, or combination of the same are mounted to the microelectronic element, with an inner terminal of the passive element conductively mounted to an exposed surface of one contact and an outer terminal displaced vertically from the major surface of the microelectronic element.

Abstract translation: 提供了一种微电子组件和制造方法，其包括诸如封装的芯片或元件的微电子元件。 多个可表面安装的触点以暴露于微电子元件的主表面的阵列布置。 将一个或多个无源元件（例如电阻器，电感器，电容器或其组合）安装到微电子元件，其中无源元件的内部端子导电地安装到一个触点的暴露表面，并且外部端子垂直移位 从微电子元件的主表面。

公开(公告)号：US20050170188A1

公开(公告)日：2005-08-04

申请号：US11096160

申请日：2005-04-01

Applicant: John Campbell ,  Slawomir Rubinsztajn ,  David Gibson ,  Sandeep Tonapi ,  Ryan Mills ,  Ananth Prabhakumar

Inventor： John Campbell ,  Slawomir Rubinsztajn ,  David Gibson ,  Sandeep Tonapi ,  Ryan Mills ,  Ananth Prabhakumar

IPC: B32B27/38

CPC classification number: C08G59/3218 ,  C08G59/24 ,  C08G59/4215 ,  C08G59/68 ,  C08K3/36 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  Y10T428/31511 ,  C08L63/00 ,  H01L2924/00

Abstract: A composition comprises a first curable resin composition that includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds, combinations thereof, and mixtures thereof. The composition can include a separate second curable fluxing composition that comprises at least one epoxy resin. The first curable resin or the combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.

Abstract translation: 组合物包含第一可固化树脂组合物，其包含至少一种与溶剂组合的芳族环氧树脂，官能化胶态二氧化硅分散体和至少一种选自脂环族单体，脂族环氧单体，羟基芳族化合物 化合物，其组合，及其混合物。 组合物可以包括单独的第二可固化助熔组合物，其包含至少一种环氧树脂。 第一可固化树脂或两种树脂组合物的组合可用于生产底部填充材料，并且适合用作电子芯片的密封剂。

公开(公告)号：US06897565B2

公开(公告)日：2005-05-24

申请号：US10267450

申请日：2002-10-09

Applicant: L. Elliott Pflughaupt ,  David Gibson ,  Young-Gon Kim ,  Craig S. Mitchell

Inventor： L. Elliott Pflughaupt ,  David Gibson ,  Young-Gon Kim ,  Craig S. Mitchell

IPC: H01L25/18 ,  H01L21/31 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/02 ,  H01L23/48 ,  H01L23/528 ,  H01L25/065 ,  H01L25/10 ,  H01L25/11 ,  H01L31/0336

CPC classification number: H01L23/528 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A stacked chip assembly includes individual units having chips mounted on dielectric layers and traces on the dielectric layers interconnecting the contacts of the chips with terminals disposed in peripheral regions of the dielectric layers. At least some of the traces are multi-branched traces which connect chip select contacts to chip select terminals. The units are stacked one above the other with corresponding terminals of the different units being connected to one another by solder balls or other conductive elements so as to form vertical buses. Prior to stacking, the multi-branched traces of the individual units are selectively interrupted, as by breaking the individual branches, so as to leave chip select contacts of chips in different units connected to different chip select terminals and thereby connect these chips to different vertical buses. The individual units desirably are thin and directly abut one another so as to provide a low-height assembly with good heat transfer from chips within the stack.