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61.发明授权Method for filling high aspect ratio via holes in electronic substrates and the resulting holes 失效用于通过电子基板中的孔填充高纵横比的方法和由此产生的孔公开(公告)号：US06452117B2
公开(公告)日：2002-09-17
申请号：US09871555
申请日：2001-05-31
申请人： Brian Eugene Curcio , Peter Alfred Gruber , Frederic Maurer , Konstantinos I. Papathomas , Mark David Poliks
发明人： Brian Eugene Curcio , Peter Alfred Gruber , Frederic Maurer , Konstantinos I. Papathomas , Mark David Poliks
IPC分类号： H01R1204
CPC分类号： H05K3/4069 , H01L21/486 , H01L23/49827 , H01L23/49833 , H01L2924/0002 , H05K3/0094 , H05K3/246 , H05K3/4602 , H05K2201/0305 , H05K2201/0347 , H05K2201/09509 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/09827 , H05K2201/09863 , H05K2203/0126 , H05K2203/085 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T29/53191 , H01L2924/00
摘要： High aspect ratio (5:1-30:1) and small (5 &mgr;m-125 &mgr;m) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling such holes using pressure and vacuum. In certain embodiments, the holes are lined with conductive material and/or capped with a conductive material. The invention also contemplates a chip carrier formed by such material.
摘要翻译： 提供介电基片中的高纵横比（5：1-30：1）和小（5毫米-125毫米）直径的孔，填充有凝固的导电材料，以及使用压力填充这些孔的方法 和真空。 在某些实施例中，孔用导电材料衬里和/或用导电材料封盖。 本发明还考虑由这种材料形成的芯片载体。
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公开(公告)号：US6099959A
公开(公告)日：2000-08-08
申请号：US108598
申请日：1998-07-01
CPC分类号： H05K3/282 , H01L23/49894 , H01L2924/0002 , H01L2924/12044 , H05K3/28 , H05K3/305 , Y10S428/901 , Y10T428/12889 , Y10T428/265
摘要： In accordance with the present invention, a method of treating the surface of an organic substrate, particularly a circuitized surface of an organic substrate, which method reduces the spread of adhesive resin that is subsequently deposited on the surface, is provided. This method comprises the steps of applying a treatment solution comprising a fatty acid compound, an alkalizing agent, and a solvent comprising water and from about 5% to about 90% by volume of an organic solvent selected from the group consisting of an alcohol, a glycol ether, and combinations thereof to the surface; and then removing substantially all of the solvent from the solution to provide a thin film on the surface of said substrate. The film comprises the fatty acids that were present in the treatment solution. In a preferred embodiment the treatment solution further comprises a chelating agent. The present invention also relates to a treatment solution for reducing adhesive resin bleed on the surface of a circuitized organic substrate. The present invention also relates to a circuitized organic substrate that is resistant to resin bleed. Such substrate has a film comprising a fatty acid compound disposed on the circuitized surface thereto.
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63.发明授权
公开(公告)号：US5422184A
公开(公告)日：1995-06-06
申请号：US197814
申请日：1994-02-18
CPC分类号： C08G73/0655 , H05K1/0346 , Y10T428/31504
摘要： Trisphenol PA tricyanate, prepolymers and crosslinked polymers thereof are provided. Blends of trifunctional cyanates and fluorinated or non-fluorinated difunctional cyanate are provided. The crosslinked polymers exhibit low dielectric loss properties and high glass transition temperatures and are suitable as the matrix material for structural composites including printed circuit boards.
摘要翻译： 提供了三酚PA三氯氰酸酯，其预聚物和交联聚合物。 提供三官能氰酸酯和氟化或非氟化双官能氰酸酯的共混物。 交联聚合物表现出低介电损耗特性和高玻璃化转变温度，并且适合作为包括印刷电路板的结构复合材料的基体材料。
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64.发明授权Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof 失效用于提供刚性柔性电路板结构的复合材料及其制造方法
公开(公告)号：US5378306A
公开(公告)日：1995-01-03
申请号：US192736
申请日：1994-02-07
申请人： Michael J. Cibulsky , Konstantinos I. Papathomas , William J. Summa , David W. Wang , Patrick R. Zippetelli
发明人： Michael J. Cibulsky , Konstantinos I. Papathomas , William J. Summa , David W. Wang , Patrick R. Zippetelli
CPC分类号： H05K3/4691 , H05K1/0366 , H05K2201/0355 , H05K2203/308 , Y10S428/901 , Y10T428/24851 , Y10T428/2486 , Y10T428/24917 , Y10T428/31522 , Y10T428/31678 , Y10T428/31721
摘要： A rigid-flexible circuit board is fabricated by providing a core having a dielectric substrate and conductive layer thereon. A sub-composite comprising a polyimide and rigid dielectric substrate adjacent the conductive layer and in both the rigid and flexible segments of the board is provided. A release layer corresponding to the flexible segment of the board is provided. A rigid bonding layer is provided at rigid segments of the board but not at the flexible segments. A composite is formed by providing a second conductive layer adjacent the rigid bonding layer. The composite is laminated. Portions of the second conductive layer corresponding to the flexible segment and release layer are removed.
摘要翻译： 通过在其上提供具有电介质基板和导电层的芯体来制造刚性柔性电路板。 提供了包括邻近导电层并且在板的刚性和柔性段中的聚酰亚胺和刚性电介质基板的亚复合材料。 提供了对应于板的柔性段的释放层。 刚性粘合层设置在板的刚性部分，但不在柔性部分。 通过提供邻近刚性粘合层的第二导电层形成复合材料。 复合材料层压。 除去对应于柔性段和释放层的第二导电层的部分。
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公开(公告)号：US5312887A
公开(公告)日：1994-05-17
申请号：US987605
申请日：1992-12-09
CPC分类号： C08G73/0655 , H05K1/0346 , Y10T428/31547 , Y10T428/31601
摘要： Amorphous prepolymers from composition containing bisphenol P dicyanate and bisphenol M dicyanate as well as the cured polymers therefrom are prepared. The prepolymers are especially useful for circuit boards and structural composites.
摘要翻译： 制备含有双酚P二氰酸酯和双酚M双氰酸酯的组合物以及其固化的聚合物的无定型预聚物。 预聚物特别适用于电路板和结构复合材料。
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公开(公告)号：US07384682B2
公开(公告)日：2008-06-10
申请号：US11861806
申请日：2007-09-26
CPC分类号： H01L23/3185 , H01L21/563 , H01L23/295 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01025 , H01L2924/01087 , H01L2924/10253 , Y10T428/24826 , Y10T428/24926 , H01L2924/00 , H01L2224/0401
摘要： An encapsulant composition and an electronic package. The composition includes a resin, a flexibilizing agent, and a filler material. The electronic package includes a substrate, a semiconductor chip, and a material. The semiconductor chip is mounted on an upper surface of the substrate and electrically coupled to the substrate. The material is positioned on the upper surface of the substrate and against an edge surface of the semiconductor chip. The edge surface of the semiconductor chip is substantially perpendicular to a bottom surface of the semiconductor chip. The material is the encapsulant composition.
摘要翻译： 密封剂组合物和电子包装。 组合物包括树脂，增韧剂和填料。 电子封装包括基板，半导体芯片和材料。 半导体芯片安装在基板的上表面上并电耦合到基板。 该材料位于基板的上表面上并且抵靠半导体芯片的边缘表面。 半导体芯片的边缘表面基本上垂直于半导体芯片的底表面。 该材料是密封剂组合物。
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公开(公告)号：US06734569B2
公开(公告)日：2004-05-11
申请号：US10316267
申请日：2002-12-12
IPC分类号： H01L2348
CPC分类号： H01L24/83 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/2919 , H01L2224/32225 , H01L2224/4809 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/49052 , H01L2224/73265 , H01L2224/8319 , H01L2224/8385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01014 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01038 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01043 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/19043 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： An organic chip carrier having metallic circuitry and wire bond pads thereon is bonded to an integrated circuit die by a photocurable adhesive and is electrically connected therewith by wire bonding to the wire bond pads.
摘要翻译： 具有金属电路和其上的引线接合焊盘的有机芯片载体通过光固化粘合剂结合到集成电路管芯，并通过引线键合与引线接合焊盘电连接。
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公开(公告)号：US06455139B2
公开(公告)日：2002-09-24
申请号：US09917701
申请日：2001-07-31
IPC分类号： B32B300
CPC分类号： C23C18/1651 , C23C18/1844 , H05K3/184 , H05K3/244 , H05K3/26 , H05K2201/0761 , H05K2203/0796 , Y10T428/24917
摘要： Printed circuit boards, cards and chip carriers are fabricated by treating an already circuitized substrate with a swelling agent, then treating the circuitized substrate with a composition containing an alkaline permanganate, a chromate and/or chlorite and then applying a metal layer to coat the circuitized portion of the substrate.
摘要翻译： 印刷电路板，卡片和芯片载体通过用溶胀剂处理已经电路化的基底，然后用含有碱性高锰酸盐，铬酸盐和/或亚氯酸盐的组合物处理电路化基底，然后施加金属层以涂覆电路化 部分基板。
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公开(公告)号：USRE37840E1
公开(公告)日：2002-09-17
申请号：US09159360
申请日：1998-09-23
申请人： Anilkumar C. Bhatt , Roy H. Magnuson , Voya R. Markovich , Konstantinos I. Papathomas , Douglas O. Powell
发明人： Anilkumar C. Bhatt , Roy H. Magnuson , Voya R. Markovich , Konstantinos I. Papathomas , Douglas O. Powell
IPC分类号： H01K316
CPC分类号： H05K3/0094 , H01L23/5384 , H01L2224/16 , H01L2224/16225 , H01L2924/01004 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K1/112 , H05K3/0023 , H05K3/429 , H05K3/4602 , H05K2201/092 , H05K2201/09472 , H05K2201/09509 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/09845 , H05K2201/10734 , H05K2203/0191 , H05K2203/0278 , Y10T29/49126 , Y10T29/49165
摘要： Disclosed is a printed circuit board and a method of preparing the printed circuit board. The printed circuit board has two types of plated through holes. The first type of plated through holes extend to and through an exterior surface of the printed circuit board for receipt of a pin-in-through-hole module or component pin. The second type of plated through holes are for surface mount technology and terminate below the exterior surfaces of the printed circuit board. These plated through holes contain a bill composition.
摘要翻译： 公开了印刷电路板和制备印刷电路板的方法。 印刷电路板有两种电镀通孔。 第一类型的电镀通孔延伸到印刷电路板的外表面并通过印刷电路板的外表面，用于接收针式通孔模块或部件销。 第二种类型的电镀通孔用于表面贴装技术，并终止在印刷电路板的外表面之下。 这些电镀通孔包含纸币组合物。
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公开(公告)号：US06432182B1
公开(公告)日：2002-08-13
申请号：US09588459
申请日：2000-06-06
IPC分类号： C09D538
CPC分类号： H05K3/282 , H01L23/49894 , H01L2924/0002 , H01L2924/12044 , H05K3/28 , H05K3/305 , Y10S428/901 , Y10T428/12889 , Y10T428/265 , H01L2924/00
摘要： In accordance with the present invention, a method of treating the surface of an organic substrate, particularly a circuitized surface of an organic substrate, which method reduces the spread of adhesive resin that is subsequently deposited on the surface, is provided. This method comprises the steps of applying a treatment solution comprising a fatty acid compound, an alkalizing agent, and a solvent comprising water and from about 5% to about 90% by volume of an organic solvent selected from the group consisting of an alcohol, a glycol ether, and combinations thereof to the surface; and then removing substantially all of the solvent from the solution to provide a thin film on the surface of said substrate. The film comprises the fatty acids that were present in the treatment solution. In a preferred embodiment the treatment solution further comprises a chelating agent. The present invention also relates to a treatment solution for reducing adhesive resin bleed on the surface of a circuitized organic substrate. The present invention also relates to a circuitized organic substrate that is resistant to resin bleed. Such substrate has a film comprising a fatty acid compound disposed on the circuitized surface thereto.
摘要翻译： 根据本发明，提供了一种处理有机基板的表面，特别是有机基板的电路化表面的方法，该方法减少随后沉积在表面上的粘合剂树脂的扩散。 该方法包括以下步骤：施加包含脂肪酸化合物，碱化剂和包含水的溶剂和约5体积％至约90体积％的选自以下的有机溶剂的处理溶液：醇， 乙二醇醚及其组合; 然后从溶液中基本上除去所有溶剂，以在所述基材的表面上提供薄膜。 该膜包含存在于处理溶液中的脂肪酸。 在优选的实施方案中，处理溶液还包含螯合剂。 本发明还涉及一种用于在电路化的有机基底的表面上减少粘合剂树脂渗出的处理溶液。 本发明还涉及耐树脂流出的电路化有机基材。 这种基材具有包含设置在其电路化表面上的脂肪酸化合物的膜。
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