摘要:
An electrostatic discharge (“ESD”) protection device, which includes a thyristor circuit, in the ESD case increases a resistance of the ESD protection device in comparison with a non-ESD case, by means of a switch. An ESD protection arrangement may include a ESD protection device to protects circuits with multiple voltage potentials. An ESD protection system may also include an ESD protection arrangement, to which an ESD signal is fed via a bus of the ESD protection system. The ESD protection device and ESD protection arrangement, and thus the ESD protection system, can be provided in a compact semiconductor arrangement.
摘要:
An electrostatic discharge (ESD) protective apparatus for a semiconductor circuit has at least one ESD protective element, which is connected between the substrate contact and a ground potential connection, and is electrically connected to the substrate contact. The ESD protective element may be in the form of an ESD protective diode or an ESD protective transistor. It is also possible to connect a resistor or an ESD protective transistor between the substrate contact and the ground potential connection as an ESD protective element, and additionally to connect an ESD protective diode or an ESD protective transistor between the substrate contact and a supply voltage potential connection.
摘要:
A MOS transistor includes a drain zone, a source zone, and a gate electrode. Doping atoms of the first conductivity type are implanted in the region of the drain zone and the source zone by at least two further implantation steps such that a pn junction between the drain zone and a substrate region is vertically shifted and a voltage ratio of the MOS transistor between a lateral breakdown voltage and a vertical breakdown voltage can be set.
摘要:
A three-transistor SRAM memory cell includes a bistable field-effect transistor having a fully depleted floating channel region and a hysteretic gate voltage characteristic curve. The bistable field-effect transistor has a gate to be connected to a first bit line for the purpose of writing to the memory cell and a second channel terminal to be connected to a second bit line for the purpose of reading from the memory cell. The two bit lines can be identical. The connection between the bit lines and the bistable transistor can be effected through first and second respective transistors which are each controlled by a respective word line.
摘要:
A method for manufacturing an electrically conductive tip for field emission cathodes of vacuum electronic components includes forming the tip of doped silicon by molecular beam epitaxy of doped silicon through an opening of a mask and onto a substrate of monocrystalline silicon. The molecular beam epitaxy also produces a doped silicon layer on the surface of the mask.
摘要:
An apparatus comprises a first integrated circuit (IC) die that includes a top layer, a bottom surface, a sidewall surface extending from a top surface of the top layer to the bottom surface, and at least one multi-surface contact pad, a second IC die including a top layer, a bottom surface, a sidewall surface extending from a top surface of the top layer to the bottom surface, and at least one multi-surface contact pad, wherein the second IC die is arranged adjacent to the first IC die, and includes an electrically conductive bond in contact with at least one of the top surface or the side surface of the multi-surface contact pad of the first IC die and the top surface of the multi-surface contact pad of the second IC die.
摘要:
Some embodiments relate to an electrostatic discharge (ESD) protection device. The ESD protection device includes a first electrical path extending between the first and second circuit nodes and including a trigger element. A second electrical path extends between the first and second circuit nodes. The second electrical path includes a shunt element. A switching element is configured to trigger current flow through the shunt element based on both a state of the trigger element and a state of the switching element.
摘要:
Some aspects relate to a FinFET that includes a semiconductor fin disposed over a semiconductor substrate and extending laterally between a source region and a drain region. A shallow trench isolation (STI) region laterally surrounds a lower portion of the semiconductor fin, and an upper portion of the semiconductor fin remains above the STI region. A gate electrode traverses over the semiconductor fin to define a channel region in the semiconductor fin under the conductive gate electrode. A punch-through blocking region can extend between the source region and the channel region in the lower portion of the semiconductor fin. A drain extension region can extend between the drain region and the channel region in the lower portion of the semiconductor fin. Other devices and methods are also disclosed.
摘要:
Embodiments relate to a field-effect transistor that includes a body region, a first source/drain region of a first conductivity type, a second source/drain region of the first conductivity type, and a pocket implant region adjacent to the first source/drain region, the pocket implant region being of a second conductivity type, wherein the second conductivity type is different from the first conductivity type. The body region physically contacts the pocket implant region.
摘要:
An integrated circuit arrangement includes a Shockley diode or a thyristor. An inner region of the diode or of the thyristor is completely or partially shielded during the implantation of a p-type well. This gives rise to a Shockley diode or a thyristor having improved electrical properties, in particular with regard to the use as an ESD protection element.