公开(公告)号：US10472728B2

公开(公告)日：2019-11-12

申请号：US15178620

申请日：2016-06-10

申请人： JX Nippon Mining & Metals Corporation

发明人： Hideta Arai ,  Atsushi Miki

IPC分类号： C23C28/00 ,  C25D15/00 ,  C25D7/06 ,  C25D5/10 ,  C25D5/12 ,  H05K3/38 ,  C25D5/16 ,  H05K1/09 ,  H05K3/20 ,  C25D1/04 ,  C25D3/38 ,  C25D3/56 ,  C25D3/58 ,  C25D9/04

摘要： A copper foil for printed circuits is prepared by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on ternary alloy composed of copper, cobalt and nickel on the primary particle layer. The average particle size of the primary particle layer is 0.25 to 0.45 μm, and the average particle size of the secondary particles layer based on ternary alloy composed of copper, cobalt and nickel is 0.05 to 0.25 μm. Provided is a copper foil for printed circuits, in which powder fall from the copper foil can be reduced and the peeling strength and heat resistance can be improved by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on copper-cobalt-nickel alloy plating on the primary particle layer.

公开(公告)号：US10364506B2

公开(公告)日：2019-07-30

申请号：US15674346

申请日：2017-08-10

申请人： APPLIED Materials, Inc.

发明人： Gregory J. Wilson ,  Paul R. McHugh

IPC分类号： C25D21/12 ,  C25D5/16 ,  C25D17/02 ,  C25D17/00 ,  C25D7/12

摘要： An electro-processing apparatus has a contact ring including a seal which is able to compensate for electric field distortions created by a notch (or other irregularity) on the wafer or work piece. The shape of the contact ring at the notch is changed, to reduce current crowding at the notch. The change in shape changes the resistance of the current path between a thief electrode and the wafer edge to increase thief electrode current drawn from the region of the notch. As a result, the wafer is plated with a film having more uniform thickness.

公开(公告)号：US20190219743A1

公开(公告)日：2019-07-18

申请号：US16156079

申请日：2018-10-10

申请人： 3M INNOVATIVE PROPERTIES COMPANY

发明人： Tri D. Pham ,  Steven H. Kong ,  Haiyan Zhang ,  Joseph T. Aronson ,  Michael R. Leaf ,  Gary T. Boyd ,  Nicholas A. Johnson ,  Qingbing Wang

IPC分类号： G02B5/02 ,  B29C59/02 ,  C25D5/16 ,  C25D3/04 ,  C25D3/38 ,  C25D5/12 ,  F21V8/00

CPC分类号： G02B5/021 ,  B29C59/026 ,  B29L2011/00 ,  C25D3/04 ,  C25D3/38 ,  C25D5/12 ,  C25D5/16 ,  G02B5/0221 ,  G02B5/0268 ,  G02B5/0278 ,  G02B6/0051 ,  G02F1/133606

摘要： Optical diffusing films are made by microreplication from a structured surface tool. The tool is made using a 2-part electroplating process, wherein a first electroplating procedure forms a first metal layer with a first major surface, and a second electroplating procedure forms a second metal layer on the first metal layer, the second metal layer having a second major surface with a smaller average roughness than that of the first major surface. The second major surface can function as the structured surface of the tool. A replica of this surface can then be made in a major surface of an optical film to provide light diffusing properties. The structured surface and/or its constituent structures can be characterized in terms of various parameters such as optical haze, optical clarity, Fourier power spectra of the topography along orthogonal in-plane directions, ridge length per unit area, equivalent circular diameter (ECD), and/or aspect ratio.

公开(公告)号：US10295710B2

公开(公告)日：2019-05-21

申请号：US14443407

申请日：2013-11-19

申请人： 3M INNOVATIVE PROPERTIES COMPANY

发明人： Tri D. Pham ,  Steven H. Kong ,  Haiyan Zhang ,  Joseph T. Aronson ,  Michael R. Leaf ,  Gary T. Boyd ,  Nicholas A. Johnson ,  Qingbing Wang

IPC分类号： G02B5/02 ,  F21V8/00 ,  B29C59/02 ,  C25D3/04 ,  C25D3/38 ,  C25D5/12 ,  C25D5/16 ,  G02F1/1335 ,  B29L11/00

摘要： Optical diffusing films are made by microreplication from a structured surface tool. The tool is made using a 2-part electroplating process, wherein a first electroplating procedure forms a first metal layer with a first major surface, and a second electroplating procedure forms a second metal layer on the first metal layer, the second metal layer having a second major surface with a smaller average roughness than that of the first major surface. The second major surface can function as the structured surface of the tool. A replica of this surface can then be made in a major surface of an optical film to provide light diffusing properties. The structured surface and/or its constituent structures can be characterized in terms of various parameters such as optical haze, optical clarity, Fourier power spectra of the topography along orthogonal in-plane directions, ridge length per unit area, equivalent circular diameter (ECD), and/or aspect ratio.

公开(公告)号：US10163557B2

公开(公告)日：2018-12-25

申请号：US14973115

申请日：2015-12-17

申请人： Intel Corporation

发明人： William J. Lambert ,  Mihir K Roy ,  Mathew J Manusharow ,  Yikang Deng

IPC分类号： H01F5/00 ,  H01F27/28 ,  C25D5/16 ,  C25D5/48 ,  C25D7/00 ,  H01F27/255 ,  H01F41/02 ,  H01F41/04 ,  H01F17/00

摘要： Devices and methods including a though-hole inductor for an electronic package are shown herein. Examples of the through-hole inductor include a substrate including at least one substrate layer. Each substrate layer including a dielectric layer having a first surface and a second surface. An aperture included in the dielectric layer is located from the first surface to the second surface. The aperture includes an aperture wall from the first surface to the second surface. A conductive layer is deposited on the first surface, second surface, and the aperture wall. At least one coil is cut from the conductive layer and located on the aperture wall.

公开(公告)号：US10105734B2

公开(公告)日：2018-10-23

申请号：US14992743

申请日：2016-01-11

申请人： FEI Company

发明人： Tomas Vystavel ,  Aurelien Philippe Jean Maclou Botman

IPC分类号： G01N35/00 ,  B05D5/02 ,  B05C3/10 ,  B05D3/04 ,  B05D5/00 ,  C23C18/16 ,  C25D5/16 ,  C25D7/12 ,  C25D21/04 ,  H01L21/02 ,  H01L21/306 ,  H01L21/3205 ,  H01J37/20 ,  H01J37/317 ,  G01N1/32 ,  G01N1/44

摘要： A method of modifying a sample surface layer in the vacuum chamber of a particle-optical apparatus, the method performed in vacuum, the method comprising: Providing the microscopic sample attached to a manipulator, Providing a first liquid at a first (controlled) temperature, Dipping the sample in the first liquid, thereby causing a sample surface modification, Removing the sample from the first liquid, Providing a second liquid at a second (controlled) temperature, Dipping the sample in the second liquid, and Removing the sample from the second liquid. This enables the wet processing of a sample in-situ, thereby enhancing speed and/or avoiding subsequent alteration/contamination of the sample, such as oxidation, etc. The method is particularly useful for etching a lamella after machining the lamella with a (gallium) FIB to remove the surface layer where gallium implantation occurred, or where the crystal lattice is disturbed.

公开(公告)号：US20180193815A1

公开(公告)日：2018-07-12

申请号：US15615167

申请日：2017-06-06

申请人： IH IP Holdings Limited

发明人： Dennis G. Letts

IPC分类号： B01J19/08 ,  C25D3/48 ,  C25D5/16 ,  C25D3/50 ,  C25D3/56

CPC分类号： C25D3/56 ,  B01J12/002 ,  B01J19/12 ,  B01J37/34 ,  B01J37/341 ,  B01J37/349 ,  B01J2219/00635 ,  B01J2219/0807 ,  B01J2219/0875 ,  B01J2219/0894 ,  B01J2219/0896 ,  B01J2219/0898 ,  C25D5/10 ,  C25D7/04 ,  G21B3/00

摘要： An exothermic reaction of hydrogen/deuterium loaded into a metal or alloy is triggered by controlling the frequency of a hydrogen/deuterium plasma in a reaction chamber. The plasma frequency is controlled by adjusting its electron density, which in turn is controlled by adjusting the pressure within the reaction chamber. An exothermic reaction is generated at certain discrete plasma frequencies, which correspond to the optical phonon modes of D-D, H-D, and H—H bonds within the metal lattice. For example, in palladium metal, the frequencies are 8.5 THz, 15 THz, and 20 THz, respectively.

公开(公告)号：US09938600B2

公开(公告)日：2018-04-10

申请号：US14719532

申请日：2015-05-22

申请人： Muhr und Bender KG

发明人： Thomas Muhr ,  Jorg Dieter Brecht ,  Christoph Schneider ,  Philip Beiter

IPC分类号： C21D8/02 ,  C21D9/52 ,  C21D9/54 ,  C23C2/02 ,  C25D5/34 ,  B32B15/01 ,  C25D17/00 ,  C25D5/02 ,  C25D5/16 ,  C25D5/18 ,  C25D5/36 ,  C25D17/12

CPC分类号： C21D8/0278 ,  B32B15/01 ,  C21D8/02 ,  C21D9/52 ,  C21D9/54 ,  C23C2/02 ,  C25D5/026 ,  C25D5/16 ,  C25D5/18 ,  C25D5/34 ,  C25D5/36 ,  C25D17/00 ,  C25D17/007 ,  C25D17/008 ,  C25D17/12

摘要： A hardened formed part is manufactured with the steps: producing a blank from a hardenable strip material; heating of the blank to an austenitization temperature; forming and hardening of the blank to a hardened formed part; cleaning the hardened formed part; coating the hardened formed part with a metallic coating in an dipping bath with an electrolyte solution, wherein during the coating process, at least one auxiliary element is used in the dipping bath, such, that the deposition of the coating is partially influenced. A plant is used for manufacturing a hardened formed part.

公开(公告)号：US09893354B2

公开(公告)日：2018-02-13

申请号：US15049489

申请日：2016-02-22

申请人： The Trustees of Princeton University

发明人： Daniel A. Steingart ,  Mylad Chamoun ,  Benjamin Hertzberg ,  Greg Davies ,  Andrew G. Hsieh

IPC分类号： H01M4/00 ,  H01M4/42 ,  H01M4/04 ,  H01M4/24 ,  H01M4/29 ,  H01M4/38 ,  H01M4/66 ,  C25D5/00 ,  C25D5/16 ,  C25D3/22 ,  H01M4/02

CPC分类号： H01M4/42 ,  C25D3/22 ,  C25D5/00 ,  C25D5/16 ,  H01M4/0452 ,  H01M4/244 ,  H01M4/29 ,  H01M4/38 ,  H01M4/661 ,  H01M2004/021 ,  H01M2004/027

摘要： Disclosed are hyper-dendritic nanoporous zinc foam electrodes, viz., anodes, methods of producing the same, and methods for their use in electrochemical cells, especially in rechargeable electrical batteries.

公开(公告)号：US09603245B2

公开(公告)日：2017-03-21

申请号：US13976503

申请日：2011-12-27

申请人： Akitoshi Suzuki ,  Kensaku Shinozaki ,  Toshio Tani ,  Hirokazu Sasaki ,  Isamu Futaba ,  Kouji Hataya ,  Shinya Ohtomo ,  Hirokazu Yoshikawa

发明人： Akitoshi Suzuki ,  Kensaku Shinozaki ,  Toshio Tani ,  Hirokazu Sasaki ,  Isamu Futaba ,  Kouji Hataya ,  Shinya Ohtomo ,  Hirokazu Yoshikawa

IPC分类号： H01M4/66 ,  H05K1/09 ,  C22F1/08 ,  C25D3/38 ,  C25D5/48 ,  C25D7/06 ,  H01M4/133 ,  H01M4/134 ,  H01M4/1395 ,  H01M10/0525 ,  C23C22/24 ,  C25D1/04 ,  C25D5/10 ,  C25D5/16 ,  H01M4/04 ,  H01M4/02

CPC分类号： H05K1/09 ,  C22F1/08 ,  C23C22/24 ,  C25D1/04 ,  C25D3/38 ,  C25D5/10 ,  C25D5/16 ,  C25D5/48 ,  C25D7/0614 ,  H01M4/0404 ,  H01M4/043 ,  H01M4/0471 ,  H01M4/133 ,  H01M4/134 ,  H01M4/1395 ,  H01M4/661 ,  H01M4/667 ,  H01M10/0525 ,  H01M2004/021 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/1105 ,  Y02E60/122 ,  Y10T428/12431

摘要： To provide an electrolytic copper foil for a negative electrode for a lithium-ion secondary battery with which it is possible to produce a long-life lithium-ion secondary battery in which there is no decline in the capacity retention ratio even when the charge-discharge cycling is repeated, that has long life, and no deformation of a negative electrode current collector occurs. The electrolytic copper foil constituting the negative electrode current collector for the lithium-ion secondary battery has, after heat treatment at from 200 to 400° C., a 0.2% proof stress of 250 N/mm2 or more, and elongation of 2.5% or more; and the surface on which an active material layer of the electrolytic copper foil is provided has been rust-proofed, or roughened and rust-proofed. As a result of analysis of the depth profile (depth direction) obtained by performing secondary ion mass spectrometry (SIMS) in the thickness direction of the copper foil, the copper foil including: chlorine (Cl), carbon (C), and oxygen (O) each in a concentration of 1017 to 5×1020 atoms/cm3, and sulfur (S) and nitrogen (N) each in a concentration of 1015 to 1019 atoms/cm3.