Die system and method of comparing alignment vectors

    公开(公告)号:US12159392B2

    公开(公告)日:2024-12-03

    申请号:US17753555

    申请日:2020-09-14

    Abstract: Embodiments of the present disclosure include a die system and a method of comparing alignment vectors. The die system includes a plurality of dies arranged in a desired pattern. An alignment vector, such as a die vector, can be determined from edge features of the die. The alignment vectors can be compared to other dies or die patterns in the same system. A method of comparing dies and die patterns includes comparing die vectors and/or pattern vectors. The comparison between alignment vectors allows for fixing the die patterns for the next round of processing. The methods provided allow accurate comparisons between as-deposited edge features, such that accurate stitching of dies can be achieved.

    Method for manufacturing optical device structures

    公开(公告)号:US12158605B2

    公开(公告)日:2024-12-03

    申请号:US18662859

    申请日:2024-05-13

    Abstract: Embodiments described herein provide for methods of forming optical device structures. The methods utilize rotation of a substrate, to have the optical device structures formed thereon, and tunability of etch rates of a patterned resist disposed over the substrate and one of a device layer or the substrate to form the optical device structures without multiple lithographic patterning steps and angled etch steps.

    Method to measure light loss of optical films and optical substrates

    公开(公告)号:US11892367B2

    公开(公告)日:2024-02-06

    申请号:US17692573

    申请日:2022-03-11

    CPC classification number: G01M11/0285 G01M11/0207

    Abstract: A method of optical device metrology is provided. The method includes introducing a first type of light into a first optical device during a first time period, the first optical device including an optical substrate and an optical film disposed on the optical substrate, the first optical device further including a first surface, a second surface, and one or more sides connecting the first surface with the second surface; and measuring, during the first time period, a quantity of the first type of light transmitted from a plurality of locations on the first surface or the second surface during the first time period, wherein the measuring is performed by a detector coupled to one or more fiber heads positioned to collect the light transmitted from the plurality of locations.

    Thin-film electro-optical waveguide modulator device

    公开(公告)号:US11846836B2

    公开(公告)日:2023-12-19

    申请号:US17306853

    申请日:2021-05-03

    CPC classification number: G02F1/035 C30B1/02 C30B29/32

    Abstract: An electro-optical waveguide modulator device includes a seed layer on a substrate, the seed layer having a first crystallographic plane aligned with a surface of the seed layer, an electro-optical channel extending in a first direction on the seed layer and having a second crystallographic plane aligned with the surface of the seed layer, an insulator layer on both sides of the electro-optical channel on the substrate in a second direction perpendicular to the first direction, an electrode barrier layer on the electro-optical channel and the insulator layer, and one or more of electrodes extending in the second direction. The seed layer and the insulator layer each comprise material having a refractive index that is lower than the electro-optical channel.

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