公开(公告)号：US07183661B2

公开(公告)日：2007-02-27

申请号：US10296848

申请日：2001-05-16

申请人： Georg Bogner ,  Herbert Brunner ,  Klaus Hoehn

发明人： Georg Bogner ,  Herbert Brunner ,  Klaus Hoehn

IPC分类号： H01L23/29 ,  B32B27/38

CPC分类号： H01L23/293 ,  C08K5/13 ,  C08K5/3435 ,  H01L24/48 ,  H01L33/56 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0091 ,  Y10T428/31511 ,  C08L63/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099

摘要： Epoxy-resin systems resistant to aging, molded materials and components generated from them, and their utilization.An epoxy-resin system especially suitable in the application of casting-resin methods comprising an epoxide-containing A component based on a glycidyl ether or glycidyl ester and a B component containing anhydride as a hardener is proposed, where a sterically hindered amine is added to the A component as a stabilizer to prevent aging of molded materials. Light-emitting components potted with it exhibit increased aging stability, especially as with respect to light yield over time. The epoxy-resin system can also be used for encapsulants and molding compositions, and can be blended with acrylates, for all applications, particularly in the exterior.

摘要翻译： 耐老化的环氧树脂体系，由它们生成的成型材料和组分及其利用。 提出特别适用于包含含有环氧化物的基于缩水甘油醚或缩水甘油酯的A组分和含有B成分的酸酐作为硬化剂的浇铸树脂方法的环氧树脂体系，其中将空间位阻胺加入到 A组分作为防止模塑材料老化的稳定剂。 与其一起封装的发光元件表现出增加的老化稳定性，特别是对于随时间的光产率。 环氧树脂体系也可用于密封剂和模塑组合物，并且可以与丙烯酸酯共混，用于所有应用，特别是在外部。

公开(公告)号：US20060289878A1

公开(公告)日：2006-12-28

申请号：US10574026

申请日：2004-09-24

申请人： Herbert Brunner ,  Tim Fiedler ,  Frank Jermann ,  Jorg Strauß ,  Martin Zachau

发明人： Herbert Brunner ,  Tim Fiedler ,  Frank Jermann ,  Jorg Strauß ,  Martin Zachau

IPC分类号： H01L33/00

CPC分类号： C09K11/7734 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

摘要： LED with a low color temperature up to 3500 K, comprising a blue-emitting LED with two phosphors in front of it, a first phosphor from the class of the oxynitridosilicates, having a cation M, which is doped with divalent Europium, and has the empirical formula M(1-c)Si2O2N2:Dc, with M=Sr, or M=Sr(1-x-y)BayCax with x+y

摘要翻译： 具有低至3500K的低色温的LED，包括在其前面具有两个荧光体的蓝色发光LED，来自所述一氧化硅硅酸盐的第一荧光体，具有掺杂有二价铕的阳离子M，并且具有 经验公式M（1-c）2 2 N 2 N 2 N 2 N 2 N 2 >，其中使用M = Sr或M = Sr（1-xy）Ba x x y y x x，x + y <0.5， 完全或主要包含高温稳定性改性HT的氧氮化硅酸盐和来自式（Ca，Sr）2 Si 5 N N的硝基硅酸盐的第二种磷 Eu。

公开(公告)号：US20060012015A1

公开(公告)日：2006-01-19

申请号：US11215763

申请日：2005-08-30

申请人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

发明人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

IPC分类号： H01L23/495

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

摘要： In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

公开(公告)号：US06975011B2

公开(公告)日：2005-12-13

申请号：US10819638

申请日：2004-04-06

申请人： Karlheinz Arndt ,  Herbert Brunner ,  Franz Schellhorn ,  Günter Waitl

发明人： Karlheinz Arndt ,  Herbert Brunner ,  Franz Schellhorn ,  Günter Waitl

IPC分类号： H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/024 ,  H01L33/48 ,  H01L33/60 ,  H01L33/64 ,  H01L23/29 ,  H01L33/00 ,  H01L27/14 ,  H01L23/795 ,  G03F7/075

CPC分类号： H01L33/486 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/024 ,  H01L33/60 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.

摘要翻译： 辐射发射和/或辐射接收半导体部件，其中辐射发射和/或辐射接收半导体芯片固定在引线框架的芯片载体部分上。 芯片载体部分在其中固定半导体芯片的区域中形成槽，其中槽的内表面被设计成使得其构成用于由半导体芯片发射和/或接收的辐射的反射器。

公开(公告)号：US20050148110A1

公开(公告)日：2005-07-07

申请号：US10979359

申请日：2004-11-01

申请人： Hubert Ott ,  Stefan Grotsch ,  Herbert Brunner

发明人： Hubert Ott ,  Stefan Grotsch ,  Herbert Brunner

IPC分类号： G21K4/00 ,  H01L21/00 ,  H01L33/50 ,  H01L33/58

CPC分类号： H01L33/58 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A method for producing a luminescence diode chip, in which provision is made of a semiconductor body is provided having an epitaxially grown semiconductor layer sequence having an active zone and a radiation coupling-out area, the active zone emitting an electromagnetic radiation during operation of the luminescence diode, a large part of said electromagnetic radiation being coupled out via the radiation coupling-out area. A luminescence conversion material is arranged downstream of the radiation coupling-out area in an emission direction of the semiconductor body. A radiation-transmissive covering body having a first main area, a second main area opposite to the first main area, and also side areas connecting the first and second main areas. The covering body is applied to the radiation coupling-out area of the semiconductor layer sequence in such a way that the first main area faces the radiation coupling-out area. The application of the covering body is preceded by the application of a first conversion layer, having a luminescence conversion material, to the first main area of the covering body.

摘要翻译： 提供一种制造发光二极管芯片的方法，其中提供具有半导体本体的外延生长的半导体层序列，其具有有源区和辐射耦合区，所述有源区在操作期间发射电磁辐射 发光二极管，所述电磁辐射的大部分经由辐射耦合输出区被耦合输出。 发光转换材料被布置在半导体本体的发射方向上的辐射耦合输出区域的下游。 具有第一主区域，与第一主区域相对的第二主区域以及连接第一主区域和第二主区域的侧面区域的辐射透射覆盖体。 将覆盖体施加到半导体层序列的辐射耦合出区域，使得第一主区域面向辐射耦合输出区域。 覆盖体的应用之前是将具有发光转换材料的第一转换层应用于覆盖体的第一主区域。

公开(公告)号：US4439403A

公开(公告)日：1984-03-27

申请号：US240829

申请日：1981-03-05

申请人： Herbert Brunner ,  Bernhard Christ ,  Wilhelm Henss ,  Werner Pfeifer ,  Klaus Scheuermann

发明人： Herbert Brunner ,  Bernhard Christ ,  Wilhelm Henss ,  Werner Pfeifer ,  Klaus Scheuermann

IPC分类号： G21F9/36 ,  G21F9/22

CPC分类号： G21F9/36

摘要： There is described an apparatus for handling and conditioning biologically injurious waste, especially radioactive waste which consists of a working space or chamber having containers for receiving and dosing the waste, conveying and control devices for the waste and the additions and a filling station for filling the final storage container. It is characterized by the working space having a slanting bottom running into a sump, the containers for receiving and dosing the waste being surrounded by a variable shielding, the cover of the final storage container provided with a stirrer convertable to the stirrer driving mechanism taking place by means of a slidable lift which supports the driving mechanism, a waste supply line, a waste air line, a positioning device and stopping pins, and controlling the sequence of operations by a freely programmable control.

摘要翻译： 描述了一种用于处理和调理生物损伤废物的设备，特别是放射性废物，其包括具有用于接收和计量废物的容器的工作空间或室，用于废物和添加物的输送和控制装置以及用于填充废物的填充站 最终存储容器。 其特征在于工作空间具有流入贮槽的倾斜底部，用于接收和计量废物的容器被可变屏蔽包围，最终存储容器的盖设有可转换到搅拌器驱动机构的搅拌器 通过支撑驱动机构的可滑动升降机，废物供应管线，废气管线，定位装置和停止销，以及通过可自由编程的控制来控制操作顺序。

公开(公告)号：US08853732B2

公开(公告)日：2014-10-07

申请号：US13499622

申请日：2010-08-31

申请人： Klaus Müller ,  Günter Spath ,  Siegfried Herrmann ,  Ewald Karl Michael Günther ,  Herbert Brunner

发明人： Klaus Müller ,  Günter Spath ,  Siegfried Herrmann ,  Ewald Karl Michael Günther ,  Herbert Brunner

IPC分类号： H01L33/62 ,  H01L31/0224

CPC分类号： H01L31/0224 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/0079 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/4554

摘要： The invention relates to an optoelectronic component, having —a carrier (1) comprising a first main surface (Ia), —at least one optoelectronic semiconductor chip (2) having no substrate, and —a contact metallization (3a, 3b), wherein —the carrier (1) is electrically insulating, —the at least one optoelectronic semiconductor chip (2) is fastened to the first main surface (Ia) of the carrier (1) by means of a bonding material (4), particularly a solder material, —the contact metallization (3a, 3b) covers at least one area of the first main surface (Ia) free of the optoelectronic semiconductor chip (2), and —the contact metallization (3a, 3b) is electrically conductively connected to the optoelectronic semiconductor chip (2).

摘要翻译： 本发明涉及一种具有载体（1）的光电子部件，载体（1）包括第一主表面（Ia）， - 至少一个不具有基板的光电子半导体芯片（2）和 - 接触金属化（3a，3b），其中 - 载体（1）是电绝缘的， - 至少一个光电子半导体芯片（2）通过接合材料（4）紧固到载体（1）的第一主表面（1a），特别是焊料 材料， - 接触金属化（3a，3b）覆盖不含光电子半导体芯片（2）的第一主表面（1a）的至少一个区域，并且接触金属化层（3a，3b）导电地连接到 光电半导体芯片（2）。

公开(公告)号：US08716729B2

公开(公告)日：2014-05-06

申请号：US12809729

申请日：2008-12-11

申请人： Burkard Wiesmann ,  Herbert Brunner ,  Joerg Strauss ,  Julius Muschaweck ,  Kirstin Petersen

发明人： Burkard Wiesmann ,  Herbert Brunner ,  Joerg Strauss ,  Julius Muschaweck ,  Kirstin Petersen

IPC分类号： H01L33/00

CPC分类号： H01L33/50 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A lighting device (1) comprises at least one element (2) emitting light which is at least in part visible, and at least one conversion medium (3), which converts at least part of the radiation emitted by the element (2) into radiation of another frequency. In addition, the lighting device (1) comprises at least one filter medium (4) which filters at least part of the radiation, and which is configured such that the quantity of the conversion medium (4) to be used is reduced for at least one predetermined color saturation and/or one predetermined hue. This means that, compared with a light source corresponding to the lighting device (1) apart from the filter medium (4), savings are made in conversion medium (3) while achieving the same color saturation or the same hue. Light of a predetermined color saturation or of a predetermined hue may be efficiently generated by such a lighting device (1) and the lighting device (1) may be inexpensively produced. In operation, it also has high light intensities and a long service life.

摘要翻译： 照明装置（1）包括发射至少部分可见的光的至少一个元件（2）和至少一个转换介质（3），其将由元件（2）发射的辐射的至少一部分转换成 另一个频率的辐射。 此外，照明装置（1）包括至少一个过滤介质（4），其过滤至少部分辐射，并且被配置为使得要使用的转化介质（4）的量至少减少 一个预定的色彩饱和度和/或一个预定色调。 这意味着与对应于照明装置（1）的与过滤介质（4）相对应的光源相比，在转换介质（3）中节省了同样的颜色饱和度或相同的色相。 可以通过这种照明装置（1）有效地生成预定色彩饱和度的光或预定色调的光，并且可以廉价地制造照明装置（1）。 使用寿命长，光线强度高，使用寿命长。

公开(公告)号：US07718451B2

公开(公告)日：2010-05-18

申请号：US11880717

申请日：2007-07-23

申请人： Thomas Höfer ,  Herbert Brunner ,  Frank Möllmer ,  Günter Waitl ,  Rainer Sewald ,  Markus Zeiler

发明人： Thomas Höfer ,  Herbert Brunner ,  Frank Möllmer ,  Günter Waitl ,  Rainer Sewald ,  Markus Zeiler

IPC分类号： H01L21/00

CPC分类号： H01L33/60 ,  B29C45/14639 ,  B29C45/1671 ,  B29C2045/0079 ,  H01L24/48 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for patterned metallization of a plastic-containing body, which comprises the steps of producing the body via a two-component injection-molding process with at least two plastics, one of which is non-metallizable, and metallizing the body in such a way that a metallized region and a non-metallized region are formed, wherein the non-metallized region is determined by the non-metallizable plastic. A method for the patterned metallization of a plastic-containing body in particular a package body for an optoelectronic device is also provided.

摘要翻译： 一种用于含塑料体的图案化金属化的方法，其包括以下步骤：通过具有至少两种塑料的双组分注射成型工艺生产所述主体，其中一种是不可金属化的，并且将所述主体金属化在这种 形成金属化区域和非金属化区域的方式，其中非金属化区域由非金属化塑料确定。 还提供了一种用于含塑料体的图案化金属化的方法，特别是用于光电子器件的封装体。

公开(公告)号：US07675132B2

公开(公告)日：2010-03-09

申请号：US11202424

申请日：2005-08-11

申请人： Günter Waitl ,  Robert Lutz ,  Herbert Brunner

发明人： Günter Waitl ,  Robert Lutz ,  Herbert Brunner

IPC分类号： H01L21/00

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A method for producing a surface mounting optoelectronic component comprises the following steps: readying a base body with the optoelectronic transmitter and/or receiver arranged in a recess of the base body, filling the recess of the base body with a transparent, curable casting compound, and placing the optical device onto the base body, whereby the optical device comes into contact with the casting compound.

摘要翻译： 一种用于制造表面安装光电子部件的方法包括以下步骤：利用布置在基体的凹部中的光电发射器和/或接收器准备基体，用透明的可固化铸塑料填充基体的凹部， 并将光学装置放置在基体上，由此光学装置与铸塑料接触。