-
公开(公告)号：US20080054279A1
公开(公告)日：2008-03-06
申请号：US11839562
申请日：2007-08-16
CPC分类号： H01L33/60 , H01L33/486 , H01L33/508 , H01L33/54 , H01L2224/48091 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： A method of forming an LED lamp with a desired distribution of phosphor is disclosed. The method includes the steps of mixing a plurality of phosphor particles in an uncured polymer resin for which the viscosity can be controlled in response to temperature to form a substantially uniform suspension of the phosphor particles in the resin. The uncured resin is then placed into a defined position adjacent an LED chip and the temperature of the resin is increased to correspondingly decrease its viscosity but to less than the temperature at which the resin would cure unreasonably quickly. The phosphor particles are encouraged to settle in the lowered-viscosity resin to a desired position with respect to the LED chip, and the temperature of the resin is thereafter increased to the point at which it will cured and solidify.
摘要翻译： 公开了一种形成具有所需分布的荧光体的LED灯的方法。 该方法包括以下步骤：在未固化的聚合物树脂中混合多个荧光体颗粒，根据温度可以控制粘度，以形成荧光体颗粒在树脂中的基本上均匀的悬浮液。 然后将未固化的树脂放置在与LED芯片相邻的限定位置，并且增加树脂的温度以相应地降低其粘度，但是小于树脂不合理地固化的温度。 鼓励荧光体颗粒将低粘度树脂沉降到相对于LED芯片的期望位置，然后将树脂的温度升高至其固化和固化的程度。
-
72.发明授权Light emitting diode (LED) arrays including direct die attach and related assemblies 有权发光二极管（LED）阵列，包括直接芯片连接和相关组件公开(公告)号：US09053958B2
公开(公告)日：2015-06-09
申请号：US13463267
申请日：2012-05-03
IPC分类号： H01L33/62 , H01L25/075 , H01L33/20 , H01L33/50 , H01L33/54
CPC分类号： H01L25/0753 , H01L33/20 , H01L33/505 , H01L33/54 , H01L2924/0002 , H01L2924/00
摘要： An electronic device may include a packaging substrate having a packaging face and first and second pluralities of light emitting diodes electrically and mechanically coupled to the packaging face of the packaging substrate. The packaging substrate may include first and second electrically conductive pads on the packaging face. The light emitting diodes of the first plurality of light emitting diodes may be electrically coupled in parallel between the first electrically conductive pad and an interconnection structure on the packaging face. The light emitting diodes of the second plurality of light emitting diodes may be electrically coupled in parallel between the interconnection structure and the second electrically conductive pad.
摘要翻译： 电子设备可以包括具有封装面的封装基板，以及电气和机械耦合到封装基板的封装面的第一和第二多个发光二极管。 包装衬底可以包括在包装面上的第一和第二导电垫。 第一多个发光二极管的发光二极管可以并联在第一导电焊盘和封装面上的互连结构之间电耦合。 第二多个发光二极管的发光二极管可以在互连结构和第二导电焊盘之间并联电耦合。
-
公开(公告)号：US09041285B2
公开(公告)日：2015-05-26
申请号：US13429053
申请日：2012-03-23
IPC分类号： H01J1/70 , F21K99/00 , F21Y101/02
CPC分类号： F21K9/90 , F21Y2115/10 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2933/0041 , H01L2924/00012 , H01L2924/00014
摘要： A method of manufacturing an LED lamp is disclosed. The method includes admixing an uncured curable liquid resin and a phosphor, dispensing the uncured admixture on an LED chip, centrifuging the chip and the admixture to disperse the phosphor particles in the uncured resin, and curing the resin while the phosphor particles remain distributed.
-
74.发明授权High efficacy semiconductor light emitting devices employing remote phosphor configurations 有权采用远程荧光粉配置的高效半导体发光器件公开(公告)号：US08748905B2
公开(公告)日：2014-06-10
申请号：US13278238
申请日：2011-10-21
IPC分类号： H01L27/15
CPC分类号： F21V3/00 , F21K9/61 , F21K9/64 , F21V3/02 , F21V3/049 , F21V3/12 , F21Y2115/10 , G02B5/0236 , G02B5/0278 , G02B6/0003 , G02B6/001 , G02B6/0035 , G02B6/005 , G02B6/0096
摘要： A semiconductor light emitting apparatus a semiconductor light emitting device configured to emit light inside a hollow shell including wavelength conversion material dispersed therein or thereon. A semiconductor light emitting apparatus according to some embodiments is capable of generating in excess of 230 lumens per watt.
摘要翻译： 一种半导体发光装置，其被配置为在包含分散在其中的波长转换材料或其上的中空壳内发光。 根据一些实施例的半导体发光装置能够产生超过每瓦230流明。
-
公开(公告)号：USD706231S1
公开(公告)日：2014-06-03
申请号：US29417220
申请日：2012-03-30
-
公开(公告)号：US08648359B2
公开(公告)日：2014-02-11
申请号：US13227961
申请日：2011-09-08
IPC分类号： H01L23/52
CPC分类号： H01L27/153 , H01L25/0753 , H01L25/167 , H01L33/08 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/49113 , H01L2924/12032 , Y10T29/49117 , H01L2924/00014 , H01L2924/00
摘要： Light emitting devices and methods such as light emitting diodes (LEDs) are disclosed for use in higher voltage applications. Variable arrangements of LEDs are disclosed herein. Arrangements can include one or more LED chips connected in series, parallel, and/or a combination thereof. LED chips can be disposed in a package body having at least one thermal element and one or more electrical components.
摘要翻译： 公开了用于较高电压应用的发光器件和诸如发光二极管（LED）的方法。 这里公开了LED的可变布置。 布置可以包括串联，并联和/或其组合的一个或多个LED芯片。 LED芯片可以设置在具有至少一个热元件和一个或多个电气部件的封装主体中。
-
公开(公告)号：US08598602B2
公开(公告)日：2013-12-03
申请号：US12825075
申请日：2010-06-28
IPC分类号： H01L33/64
CPC分类号： H01L33/647 , H01L25/0753 , H01L33/486 , H01L33/60 , H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2924/09701 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Packages containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed. In one embodiment, LED package can include a thermal element having improved solder reliability to improve heat dissipation capacity of the LED package. LED package can include a molded plastic body having one or more LEDs attached to one or more electrical elements. The LEDs can be connected to an upper surface of the thermal element. The thermal element can include a bottom surface which can extend further away in distance from a body of the LED package than a bottom surface of the electrical element. This configuration can result in an improved connection between the LED package and an external circuitry source, thereby increasing heat transfer ability of the LED package.
-
公开(公告)号：US20130264589A1
公开(公告)日：2013-10-10
申请号：US13608397
申请日：2012-09-10
CPC分类号： H01L25/0756 , H01L24/14 , H01L24/81 , H01L24/94 , H01L33/0079 , H01L33/0095 , H01L33/22 , H01L33/38 , H01L33/486 , H01L33/50 , H01L33/507 , H01L33/62 , H01L2224/13013 , H01L2224/13014 , H01L2224/13147 , H01L2224/13639 , H01L2224/1403 , H01L2224/14051 , H01L2224/1411 , H01L2224/14131 , H01L2224/14155 , H01L2224/14177 , H01L2224/81193 , H01L2224/81203 , H01L2224/81805 , H01L2224/81895 , H01L2224/94 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2933/0033 , H01L2933/0041 , H01L2924/00014 , H01L2924/00
摘要： An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area.
摘要翻译： LED晶片包括LED基板上的LED管芯。 LED晶片和载体晶片接合。 与载体晶片接合的LED晶片成形。 将波长转换材料施加到成形的LED晶片上。 执行单线以提供连接到载体裸片的LED管芯。 单个设备可以安装在LED灯具中，以提供每单位面积的高光输出。
-
79.发明授权Lighting structures including diffuser particles comprising phosphor host materials 有权照明结构包括包含磷光体主体材料的漫射颗粒公开(公告)号：US08547009B2
公开(公告)日：2013-10-01
申请号：US12500679
申请日：2009-07-10
CPC分类号： H01L33/501 , H01L33/56 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： A lighting structure may include a semiconductor light emitting device configured to generate light responsive to an electrical signal applied thereto. In addition, an encapsulating material may be configured to transmit light generated by the semiconductor light emitting device, and the encapsulating material may include yttrium aluminum garnet (YAG) diffuser particles and phosphor particles therein. More particularly, the yttrium aluminum garnet (YAG) diffuser particles and the phosphor particles may have different compositions.
摘要翻译： 照明结构可以包括配置成响应于施加到其上的电信号产生光的半导体发光器件。 此外，封装材料可以被配置为透射由半导体发光器件产生的光，并且封装材料可以包括钇铝石榴石（YAG）漫射体颗粒和其中的荧光体颗粒。 更具体地，钇铝石榴石（YAG）漫射体颗粒和荧光体颗粒可以具有不同的组成。
-
公开(公告)号：US20130141905A1
公开(公告)日：2013-06-06
申请号：US13312508
申请日：2011-12-06
CPC分类号： H01L33/54 , H01L24/49 , H01L33/20 , H01L33/58 , H01L2224/49113 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2933/005 , H01L2933/0058 , Y10T29/49117 , Y10T29/4913 , Y10T29/49169 , H01L2224/45099 , H01L2924/00
摘要： Light emitter devices with improved light extraction and related methods are disclosed. In one embodiment, the light emitter device can include a submount, at least one light emitting chip disposed over the submount, and a lens disposed over the light emitting chip. The lens can include a lens base that can have substantially the same geometry as a geometry of the submount.
摘要翻译： 公开了具有改进的光提取和相关方法的发光器件。 在一个实施例中，发光器件可以包括底座，设置在底座上的至少一个发光芯片和设置在发光芯片上的透镜。 透镜可以包括透镜基座，其可以具有与基座的几何形状基本相同的几何形状。
-
-
-
-
-
-
-
-
-
搜索结果
114 条记录 (耗时 0.038 秒)
