公开(公告)号：US20190103516A1

公开(公告)日：2019-04-04

申请号：US16086828

申请日：2017-03-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jürgen Moosburger ,  Matthias Sabathil ,  Frank Singer

IPC: H01L33/24 ,  H05B33/08 ,  H01L33/50

Abstract: A light-emitting module and a display device including the same are disclosed. In an embodiment a light-emitting module includes a plurality of emission regions configured to emit light, at least one first emission region and at least one second emission region of a first type configured to emit light of a first color locus and at least one first emission region and at least one second emission region of a second type configured to emit light of a second color locus and a control device for supplying the emission regions with current, wherein the emission regions are arranged on a common semiconductor chip, wherein the first color locus is different from the second color locus, wherein the first and second emission regions of the first type are adjacent to one another, and wherein the first and second emission regions of the second type are adjacent to one another.

公开(公告)号：US20180374996A1

公开(公告)日：2018-12-27

申请号：US15775038

申请日：2016-11-10

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Frank Singer ,  Andreas Ploessl

IPC: H01L33/48 ,  H01L25/13 ,  H01L33/62 ,  H01L33/50

Abstract: An assembly includes a carrier including a glass material, including at least one recess, wherein at least one optoelectronic semiconductor component is arranged in the at least one recess of the carrier, and at least one surface of the semiconductor component connects to the carrier via a melted surface including glass.

公开(公告)号：US20180358522A1

公开(公告)日：2018-12-13

申请号：US15771827

申请日：2016-10-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Stefan Listl ,  Björn Hoxhold ,  Frank Singer

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/44 ,  H01L33/48 ,  H01L33/56 ,  H01L33/50 ,  H01L23/00

CPC classification number: H01L33/62 ,  G09F9/3026 ,  G09F9/33 ,  H01L24/48 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/483 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2933/0025 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: An optoelectronic component includes a carrier, and a housing material arranged above a top side of a carrier, wherein a cavity is configured in the housing material, a top side of a first optoelectronic semiconductor chip is arranged in the cavity, the first optoelectronic semiconductor chip has a first electrical connection pad arranged at the top side of the first optoelectronic semiconductor chip, and electrically conductively connects by a bond wire to a first contact pad arranged at the top side of the carrier, a first section of the bond wire is arranged in the cavity and a second section of the bond wire is embedded the housing material, a covering material is arranged in the cavity and covers at least one part of the top side of the first optoelectronic semiconductor chip, and the first section of the bond wire is embedded in the covering material.

公开(公告)号：US20180287022A1

公开(公告)日：2018-10-04

申请号：US15524413

申请日：2015-11-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Wolfgang Moench ,  Frank Singer ,  Thomas Schwarz ,  Jürgen Moosburger ,  Stefan Illek

IPC: H01L33/58 ,  H01L33/50 ,  H01L33/62 ,  H02N1/00

CPC classification number: H01L33/58 ,  H01L33/0095 ,  H01L33/505 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0058 ,  H02N1/006

Abstract: A method of producing an optoelectronic component includes embedding an optoelectronic component part into a molded body such that an upper side of the optoelectronic component part is at least partially exposed on an upper side of the molded body; arranging and structuring a sacrificial layer above the upper side of the optoelectronic component part and the upper side of the molded body; arranging and structuring a layer of an optical material above the sacrificial layer; and removing the sacrificial layer.

公开(公告)号：US20180076370A1

公开(公告)日：2018-03-15

申请号：US15565239

申请日：2016-04-07

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Haushalter ,  Frank Singer ,  Thomas Schwarz ,  Andreas Ploessl

IPC: H01L33/64 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

CPC classification number: H01L33/642 ,  H01L33/005 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light-emitting component includes a light-emitting chip and a housing including a plastic body and a reflector, the reflector includes an electrically conductive layer, the light-emitting chip includes a top side and an underside, the underside of the light-emitting chip is arranged on the plastic body, an electrical terminal on the top side of the light-emitting chip electrically conductively connects to the reflector by a bond wire, the underside of the light-emitting chip and the reflector are electrically insulated from one another, a conduction region is provided within the plastic body, thermal conductivity of the conduction region is greater than thermal conductivity of the plastic body, the conduction region adjoins the underside of the light-emitting chip, and the conduction region extends from the side of the plastic body facing the light-emitting chip as far as the side of the plastic body facing away from the light-emitting chip.

公开(公告)号：US20170338384A1

公开(公告)日：2017-11-23

申请号：US15534155

申请日：2015-12-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Frank Singer

IPC: H01L33/48 ,  H01L23/00 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

CPC classification number: H01L33/486 ,  H01L21/568 ,  H01L24/95 ,  H01L33/0079 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/01 ,  H01L2224/24 ,  H01L2224/82 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/005

Abstract: A semiconductor device and a method for producing a plurality of semiconductor devices are disclosed. In an embodiment an optoelectronic semiconductor device includes a semiconductor chip having a semiconductor layer sequence with an active region, a radiation exit surface arranged parallel to the active region and a plurality of side faces arranged obliquely or perpendicular to the radiation exit surface. The device further includes a contact track electrically connecting the semiconductor chip to a contact surface configured to externally contact the semiconductor device, a molding and a rear side of the semiconductor chip remote from the radiation exit surface, the rear side being free of a material of the molding, wherein one of the side faces is configured as a mounting side face for fastening of the semiconductor device, and wherein the contact track runs on one of the side faces in places.

公开(公告)号：US20170323872A1

公开(公告)日：2017-11-09

申请号：US15523812

申请日：2015-11-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Frank Singer ,  Jürgen Moosburger ,  Matthias Sabathil ,  Matthias Sperl ,  Björn Hoxhold

IPC: H01L25/16 ,  H01L33/48 ,  H01L33/54 ,  H01L33/62 ,  H01L33/50

CPC classification number: H01L25/167 ,  H01L21/565 ,  H01L23/291 ,  H01L23/296 ,  H01L23/3171 ,  H01L23/3185 ,  H01L33/20 ,  H01L33/382 ,  H01L33/385 ,  H01L33/387 ,  H01L33/405 ,  H01L33/44 ,  H01L33/46 ,  H01L33/486 ,  H01L33/502 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0025 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066

Abstract: An optoelectronic component includes a composite body including a molded body; and an optoelectronic semiconductor chip embedded into the molded body, wherein an electrically conductive through contact extends from a top side of the composite body to an underside of the composite body through the molded body, a top side of the optoelectronic semiconductor chip is at least partly not covered by the molded body, the chip includes a first electrical contact on its top side, a first top side metallization is arranged on the top side of the composite body and electrically conductively connects the first electrical contact to the through contact, the optoelectronic component includes an upper insulation layer extending over the first top side metallization, and the optoelectronic component includes a second top side metallization arranged above the upper insulation layer and electrically insulated with respect to the first top side metallization by the upper insulation layer.

公开(公告)号：US09780269B2

公开(公告)日：2017-10-03

申请号：US15022535

申请日：2014-08-25

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Frank Singer ,  Jürgen Moosburger

IPC: H01L33/00 ,  H01L33/54 ,  H01L33/62 ,  H01L33/48 ,  H01L33/52

CPC classification number: H01L33/54 ,  H01L21/568 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/2518 ,  H01L2224/82 ,  H01L2224/96 ,  H01L2924/1815 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066

Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor that is partly embedded into a shaped body, which is formed from a molding compound that at least partly covers at least two lateral faces and the rear surface of the optoelectronic semiconductor chip. A first contact layer and a second contact layer are arranged on the shaped body and are electrically connected to the optoelectronic semiconductor chip. A mounting face is arranged transversely in relation to the radiation passage face and is provided for mounting the optoelectronic semiconductor component.

公开(公告)号：US20160351758A1

公开(公告)日：2016-12-01

申请号：US15117177

申请日：2015-01-21

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Siegfried Herrmann ,  Juergen Moosburger ,  Stefan Illek ,  Frank Singer ,  Norwin Von Malm

IPC: H01L33/50 ,  H01L33/00 ,  H01L33/62 ,  H01L33/40 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L33/505 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/10 ,  H01L33/405 ,  H01L33/46 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/0066 ,  H01L2924/00

Abstract: The invention relates to an optoelectronic semiconductor component (1) comprising:—an optoelectronic semiconductor chip (2), comprising—a growth substrate (21) having a growth surface (21a),—a layer sequence (22) with a semiconductor layer sequence (221, 222, 223) with an active zone (222) grown on the growth surface (21a),—contact points (29) for electrically contacting the semiconductor layer sequence (221, 222, 223) and—and insulation layer (26), which is formed in an electrically insulting manner—a connection carrier (4), which is mounted to the cover surface (2a) of the optoelectronic semiconductor chip facing away from the growth surface (21a), wherein—the semiconductor layer sequence (221, 222, 223) is connected to the connection carrier (4) in an electrically conducting manner and—a conversion layer (5) is applied to a bottom surface (21c) of the growth substrate (21) facing away from the growth surface (21a) and to all side surfaces (21b) of the growth substrate (21).

Abstract translation: 本发明涉及一种光电子半导体元件（1），它包括： - 一个光电半导体芯片（2），包括 - 具有生长表面（21a）的生长衬底（21）， - 具有半导体层序列 （221,222,223），其具有在生长表面（21a）上生长的活性区（222）， - 用于与半导体层序列（221,222,223）和绝缘层（26）电接触的接触点（29） ），其以电绝缘方式形成 - 连接载体（4），其安装到远离生长表面（21a）的光电子半导体芯片的覆盖表面（2a）上，其中半导体层序列 221,222,223）以导电方式连接到连接载体（4），并且将转换层（5）施加到生长衬底（21）的背离生长表面的底表面（21c） （21a）和生长基质的所有侧表面（21b） e（21）。

公开(公告)号：US20160300820A1

公开(公告)日：2016-10-13

申请号：US15100559

申请日：2015-01-13

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Matthias Sabathil ,  Frank Singer ,  Roland Hüttinger

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/00 ,  H01L33/56

CPC classification number: H01L25/0753 ,  F21K9/90 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/502 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32227 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/97 ,  H01L2924/15159 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0091 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2224/83

Abstract: A method for producing optoelectronic semiconductor components and an optoelectronic semiconductor component are disclosed. In an embodiment the method includes: A) creating a blank by pultrusion from a glass melt, B) shaping the blank into a billet-shaped optical element with a longitudinal axis, the optical element having a mounting side and a light outlet side, C) producing conductor tracks on the mounting side, D) mounting a plurality of optoelectronic semiconductor chips on the mounting side of the optical element and connecting them to the conductor tracks and E) separating the optical element into the optoelectronic semiconductor components, wherein each optoelectronic semiconductor component comprises at least two of the semiconductor chips, and wherein at least steps A) to D) are performed in the stated sequence.

Abstract translation: 公开了一种用于制造光电子半导体部件和光电半导体部件的方法。 在一个实施方案中，该方法包括：A）通过拉挤成型从玻璃熔体产生坯料，B）将坯料成型为具有纵向轴线的坯形光学元件，所述光学元件具有安装侧和光出口侧，C ）在安装侧产生导体轨道，D）将多个光电子半导体芯片安装在光学元件的安装侧并将它们连接到导体轨道，以及E）将光学元件分离成光电子半导体部件，其中每个光电子半导体 组件包括至少两个半导体芯片，并且其中至少步骤A）至D）以所述顺序执行。