Abstract:
A power semiconductor device includes power semiconductor elements joined to wiring patterns of a circuit substrate, cylindrical external terminal communication sections, and wiring means for forming electrical connection between, for example, the power semiconductor elements and the cylindrical external terminal communication sections. The power semiconductor elements, the cylindrical external terminal communication sections, and the wiring means are sealed with transfer molding resin. The cylindrical external terminal communication sections are arranged on the wiring patterns so as to be substantially perpendicular to the wiring patterns, such that external terminals are insertable and connectable to the cylindrical external terminal communication sections, and such that a plurality of cylindrical external terminal communication sections among the cylindrical external terminal communication sections are arranged two-dimensionally on each of wiring patterns that act as main circuits.
Abstract:
A power semiconductor module including a contact element. One embodiment provides an electrically conductive contact element extending in a longitudinal direction and having a first end and a second end lying opposite the first end. The contact element has a first flange at its first end. The first flange is embodied such that when the contact element is placed with the first flange ahead onto a plane perpendicular to the longitudinal direction, the first flange has with the plane a number of first contact areas spaced apart from one another.
Abstract:
A connection made between components at a safe temperature for each of the components. A slot made may be provided on one component and a tab provided on the other component. The slot may be filled with an electrically conductive material. The tab may be inserted in the slot before significant curing of the material and kept in the slot throughout the curing period of the material. The curing may be effected at a temperature harmless to the components. For example, the temperature may be room temperature. One example of a temperature-sensitive component may be a thin battery.
Abstract:
A direct attach interconnect includes a housing and spring contacts. The housing has top and bottom sides lying in parallel planes defined by x and y axes. The spring contacts are individually disposed within a passage in the housing such that a top end of the spring contacts extends out through the top housing side and a bottom end of the spring contacts extend out through the bottom housing side. The middle portion of each spring contact includes a connector which movably connects the middle portion of the spring contact to the passage for the spring contact such that the spring contact is movable along the x, y, and z axes. The bottom end of each spring contact includes a solder sphere and a solder pad. The top end of each spring contact is a land grid array or a pin rid array socket connector.
Abstract:
A power supply device (10) includes a case (30), a circuit board (50), a plurality of conductive terminals (60), and a plurality of securing members (40). The case includes a bottom plate (32). Each terminal is embedded in the bottom plate and includes a first end portion (66) extending into the case, and a second end portion (64) extending out of the case. The first end portion includes at least one receiving portion (62) disposed on a distal end thereof. Each securing member is mounted on the circuit board and includes at least one protrusion (48) received in the corresponding receiving portion.
Abstract:
In some example embodiments, an electronic assembly includes a substrate and an electronic package. The substrate includes a hole that extends partially through the substrate. The electronic package includes a pin that extends from the electronic package. The pin is inserted into the hole that extends partially through the substrate. The substrate may be a motherboard that includes an upper surface and a lower surface with one or more conductive paths between the upper surface and the lower surface. The pin may engage at least one of the conductive paths. The pin and the hole may be any size, shape or geometry that permits the electronic package to be bonded to the motherboard. In addition, the hole may extend to any depth through the substrate as long as long the hole extends partially through the substrate and not all of the way through the substrate.
Abstract:
A connecting structure for connecting a busbar base with a printed circuit board, in which the busbar base (11a or 13a) and a busbar (5) fixed to the busbar base (11a or 13a) form an electrical circuit, includes a male terminal (5a) protruding from the busbar (5), and a female terminal (4b) connected to a conductive pattern of the printed circuit board (4). The connecting structure is characterized in that the busbar (5) fixed to the busbar base (11a or 13a) and the conductive pattern of the printed circuit board (4) are electrically and securely connected when the male terminal (5a) is fitted into the female terminal (4b).
Abstract:
An assembly of the present invention has an integrated circuit device electrically and mechanically connected to the substrate. At least one electrically conductive connecting element is on one of the substrate and circuit device and at least one socket is on the other of the substrate and circuit device. The socket receives the at least one connecting element and comprises at least two resilient members. The resilient members are biased against the connecting element so that the circuit device and the substrate are held in electrical and mechanical connection by the biasing force of the resilient members against the connecting element.
Abstract:
A wiring unit 1 with a plurality of printed circuit boards 2 which are successively stacked and pin units 3. The printed circuit boards 2 each has a conductor pattern 7 formed on the surface 6a of an insulating plate 6. The conductor pattern 7 is composed of a first plurality of belt-like conductors 11 and a second plurality of belt-like conductors 12. Through-holes 13 are formed at points 14 where the belt-like conductors 11 and 12 cross each other. The pin units 21 each is composed of a conductive pin 20 and a C-bush 21. The C-bush 21 is provided with a pair of spring segment segments 24. The C-bush 21 is press-fit into the through-hole 13 to sandwich the printed circuit board 2 between the pair of spring segments 24. The C-bush 21 is communicated with the conductor pattern 7. The pin 20 is inserted into the through-hole 13 into which the C-bush 21 is press-fit. The conductive pin 20 is communicated with the C-bush 21. In this configuration, the wiring unit can be minimized in production cost and size.
Abstract:
The data connector of the present invention securably receives at least two distinct types of mating connector plugs having different contact arrangements. The data connector includes a housing having a mating connector receiving cavity partially defined by a rear wall. The data connector further includes a printed circuit board (PCB) positioned within the housing cavity wherein the PCB has a plurality of signal contacts electrically coupled thereto and extending from a top surface thereof. The signal contacts, which are used to frictionally engage mating contacts in the plugs, are desirably arranged in at least two vertically spaced rows to accommodate the distinct plug configurations. Mounted behind a back surface of the PCB, the data connector includes cable termination devices for receiving and terminating individual conductors of a multiconductor cable. The conductors are electrically connected to the signal contacts via an electrical trace on the PCB. In order to change the configuration of the signal contacts to accommodate different mating connectors, the present invention data connector includes a slidable switch device along a top surface of the PCB for selectively electrically connecting the signal contacts to the conductors of the multiconductor cable via the PCB logic. Slidable movement of the switch from its initial position to a second position on the PCB accommodates the contact arrangement of the second mating plug connector, ensuring that the signal contacts are correctly configured for the appropriate mating connector that is currently in use.