公开(公告)号：US20100159297A1

公开(公告)日：2010-06-24

申请号：US12577918

申请日：2009-10-13

Applicant: Doo-hwan LEE ,  Hyun-chul Lee ,  Eun-duck Park ,  Kang-hee Lee ,  Yun-ha Kim ,  Jae-hyun Park

Inventor： Doo-hwan LEE ,  Hyun-chul Lee ,  Eun-duck Park ,  Kang-hee Lee ,  Yun-ha Kim ,  Jae-hyun Park

IPC: H01M8/18 ,  B01J21/06 ,  B01J23/10 ,  B01J23/755 ,  B01J23/88 ,  B01J23/34 ,  B01J23/00

CPC classification number: H01M8/1226 ,  B01J23/83 ,  B01J23/835 ,  B01J23/883 ,  B01J23/888 ,  B01J23/8892 ,  B01J23/8896 ,  B01J37/0201 ,  B01J37/0244 ,  C01B3/40 ,  C01B2203/0283 ,  C01B2203/1058 ,  H01M4/8803 ,  H01M8/0618 ,  H01M8/0625 ,  H01M8/0637 ,  Y02E60/566 ,  Y02P20/52

Abstract: A hydrocarbon reforming catalyst, a method of preparing the hydrocarbon reforming catalyst, and a fuel cell including the hydrocarbon reforming catalyst. The hydrocarbon reforming catalyst includes a nickel active catalyst layer loaded on an oxide carrier, and a metal oxide.

Abstract translation: 烃重整催化剂，烃重整催化剂的制备方法和包含烃重整催化剂的燃料电池。 烃重整催化剂包括负载在氧化物载体上的镍活性催化剂层和金属氧化物。

公开(公告)号：US20100154210A1

公开(公告)日：2010-06-24

申请号：US12656781

申请日：2010-02-16

Applicant: Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

Inventor： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC: H05K3/30

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/10515 ,  Y10T29/4913 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

Abstract: A method of manufacturing a printed circuit board having embedded electronic components. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.

Abstract translation: 一种具有嵌入式电子部件的印刷电路板的制造方法。 利用具有嵌入式电子部件的印刷电路板，包括芯片，安装在芯片的一侧的第一电子部件，安装在芯片的另一侧并与第一电子部件重叠的第二电子部件，第一电子部件 绝缘层，其堆叠在所述芯片的一侧并覆盖所述第一电子部件;堆叠在所述芯片的另一侧并覆盖所述第二电子部件的第二绝缘层，以及形成在所述第一绝缘层的表面上的电路图案 或第二绝缘层，随着多个电子部件被同时嵌入，具有嵌入部件的印刷电路板的密度得到改善，并且当使用薄CCL基板或金属基板作为芯时，特别是金属基板 ，提高了散热性能和机械强度，包括在热应力环境中增加弯曲强度 因为电子部件安装在芯片的两侧。

公开(公告)号：US07656888B2

公开(公告)日：2010-02-02

申请号：US10996709

申请日：2004-11-24

Applicant: Doo-Hwan Lee ,  Jung-A Yun ,  Myoung-Soo You ,  Ki-Hyun Kim

Inventor： Doo-Hwan Lee ,  Jung-A Yun ,  Myoung-Soo You ,  Ki-Hyun Kim

IPC: H04L12/26

CPC classification number: H04L43/0811

Abstract: A bi-directional detector which enables a host and a client in a collection terminal is disclosed. The bi-directional detector includes a client detection unit in the host part, for detecting the clients connected to the host part; a client identification unit for identifying types of the clients detected by the client detection unit; a host detection unit in each of the clients for detecting the host part; and a switch unit in each of the clients for determining whether to apply comparison power to the client detection unit and the host detection unit according to whether power is applied to the client. In the bi-directional detector, the client directly detects the host part and manages the connection, thereby reducing the load on the host part, without performing a step by which a host part responds to a connection request of a client.

Abstract translation: 公开了一种使收集终端中的主机和客户端能够实现的双向检测器。 双向检测器包括主机部分中的客户端检测单元，用于检测连接到主机部分的客户端; 客户识别单元，用于识别由客户端检测单元检测到的客户端的类型; 每个客户机中的主机检测单元，用于检测主机部分; 以及每个客户端中的切换单元，用于根据是否向客户端施加电力来确定是否将比较功率应用于客户端检测单元和主机检测单元。 在双向检测器中，客户端直接检测主机部分并管理连接，从而减少主机部分的负载，而不必执行主机部分响应客户端的连接请求的步骤。

公开(公告)号：US20080041619A1

公开(公告)日：2008-02-21

申请号：US11889498

申请日：2007-08-14

Applicant: Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim

Inventor： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim

IPC: H05K1/16 ,  H05K3/36

CPC classification number: H05K1/185 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3511 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/10378 ,  H05K2203/061 ,  Y10T29/49126

Abstract: A component-embedded multilayer printed wiring board and manufacturing method thereof. A component-embedded multilayer printed wiring board that includes: a first wiring board, in which a component is embedded; an intermediate layer which is stacked on the first wiring board and through which at least one conductive bump penetrates in correspondence to a wiring pattern formed on the first wiring board; and a second wiring board which is stacked on the intermediate layer and on a surface of which a wiring pattern is formed in correspondence with the conductive bump, can contribute to forming smaller and more functional electronic products, and by individually producing wiring boards having embedded components and then stacking these with intermediate layers interposed in-between, the defect status of each wiring board can be examined in advance, while this approach can be used in conjunction with existing surface mounting approaches to increase the effective mounting area.

Abstract translation: 一种组件嵌入式多层印刷线路板及其制造方法。 一种部件嵌入式多层印刷电路板，其特征在于，包括：嵌入有部件的第一布线基板; 层叠在所述第一布线基板上的中间层，至少一个导电凸块与形成在所述第一布线基板上的布线图形对应地贯穿所述中间层; 并且与导电凸块对应地堆叠在中间层上并且其表面上形成有布线图案的第二布线板可以有助于形成更小和更多功能的电子产品，并且通过单独制造具有嵌入部件的布线板 然后将中间层叠置在其间，可以预先检查各布线基板的缺陷状态，同时可以与现有的表面安装方式结合使用，以增加有效的安装面积。

公开(公告)号：US20070181988A1

公开(公告)日：2007-08-09

申请号：US11703814

申请日：2007-02-08

Applicant: Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

Inventor： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

IPC: H01L23/02 ,  H01L21/00

CPC classification number: H01L23/5389 ,  H01L23/13 ,  H01L24/11 ,  H01L24/13 ,  H01L24/24 ,  H01L24/97 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H05K1/185 ,  Y10T29/4913 ,  H01L2224/13099 ,  H01L2224/05599

Abstract: A PCB having an embedded bare chip and a manufacturing method thereof are disclosed. A method of manufacturing a PCB may include embedding a bare chip in a board such that electrode pads of the bare chip are exposed, and forming electrode bumps on the electrode pads. In this way, the mass production system of a bare chip embedded PCB can be made to have a simplified process and low cost.

Abstract translation: 公开了具有嵌入式裸芯片的PCB及其制造方法。 制造PCB的方法可以包括将裸芯片嵌入板中，使得裸芯片的电极焊盘露出，并在电极焊盘上形成电极凸块。 这样，裸芯片嵌入式PCB的批量生产系统可以简化工艺，成本低廉。

公开(公告)号：US20070180767A1

公开(公告)日：2007-08-09

申请号：US11605300

申请日：2006-11-29

Applicant: Hyun-chul Lee ,  Soon-ho Kim ,  Doo-hwan Lee ,  Yulia Potapova ,  Ok-young Lim ,  Eun-duck Park ,  Eun-yong Ko

Inventor： Hyun-chul Lee ,  Soon-ho Kim ,  Doo-hwan Lee ,  Yulia Potapova ,  Ok-young Lim ,  Eun-duck Park ,  Eun-yong Ko

IPC: B01J23/00 ,  C10J3/84

CPC classification number: B01J23/63 ,  B01J37/0201 ,  C01B3/16 ,  C01B2203/0283 ,  C01B2203/1041 ,  C01B2203/107 ,  Y02P20/52

Abstract: A non-pyrophoric shift reaction catalyst includes an oxide carrier impregnated with platinum (Pt) and cerium (Ce). The non-pyrophoric shift reaction catalyst may be prepared by uniformly mixing a platinum precursor, a cerium precursor, and an oxide carrier in a dispersing medium to obtain a mixture; drying the mixture; and calcining the dried mixture. The shift reaction catalyst having a non-pyrophoric property has an excellent reaction activity even at a low temperature and can efficiently remove carbon monoxide in fuel.

Abstract translation: 非自燃转移反应催化剂包括浸渍有铂（Pt）和铈（Ce）的氧化物载体。 非自燃转移反应催化剂可以通过在分散介质中均匀混合铂前体，铈前体和氧化物载体以获得混合物来制备; 干燥混合物; 并煅烧干燥的混合物。 具有非自燃特性的转移反应催化剂即使在低温也具有优异的反应活性，并能有效地除去燃料中的一氧化碳。

公开(公告)号：US07220327B2

公开(公告)日：2007-05-22

申请号：US11001586

申请日：2004-12-01

Applicant: Ji Hong Yoo ,  Doo Hwan Lee

Inventor： Ji Hong Yoo ,  Doo Hwan Lee

IPC: C21D1/60 ,  C22C38/44

CPC classification number: C22C38/02 ,  C21D1/42 ,  C21D9/085 ,  C21D9/32 ,  C21D2211/003 ,  C21D2211/005 ,  C22C38/04 ,  Y02P10/253 ,  Y10T477/60

Abstract: Disclosed is a material of a kick-down drum comprising fine ferrite and microdispersion spheroidized cementite for an automobile also disclosed is a method for manufacturing the kick-down drum material. The kick-down drum of this invention can greatly improve hardenability and durability of the spline member and also has advantages of reducing production costs due to a simplified process of adding only a heating process.

Abstract translation: 公开了一种包括精细铁氧体和用于汽车的微分散球状渗碳体的降压鼓的材料，还公开了一种用于制造降压鼓材料的方法。 本发明的冲压滚筒可以大大提高花键部件的淬透性和耐久性，并且还具有由于仅加入加热工艺的简化过程而降低生产成本的优点。

公开(公告)号：US09087837B2

公开(公告)日：2015-07-21

申请号：US13572833

申请日：2012-08-13

Applicant: Doo Hwan Lee ,  Tae Sung Jeong ,  Yul Kyo Chung

Inventor： Doo Hwan Lee ,  Tae Sung Jeong ,  Yul Kyo Chung

IPC: H01L23/28 ,  H01L21/52 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/538 ,  H01L21/768 ,  H01L23/544 ,  H01L21/54 ,  H01L21/78

CPC classification number: H01L21/52 ,  H01L21/54 ,  H01L21/561 ,  H01L21/76802 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/5389 ,  H01L23/544 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2224/19 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed herein are a semiconductor package and a method of manufacturing the same, the semiconductor package including: a molding member having a cavity formed therein; a device mounted in the cavity; an insulating member formed inside the cavity and on and/or beneath the molding member and the device; a circuit layer formed on the insulating member, and including vias and connection pads electrically connected with the device; a solder resist layer formed on the circuit layer, and having openings exposing upper portions of the connection pads; and solder balls formed in the openings.

Abstract translation: 这里公开了一种半导体封装及其制造方法，所述半导体封装包括：模制构件，其中形成有空腔; 安装在腔体中的装置; 绝缘构件，其形成在所述空腔内并且在所述模制构件和所述装置之上和/或之下; 形成在所述绝缘构件上的电路层，并且包括与所述装置电连接的通孔和连接垫; 形成在电路层上的阻焊层，并且具有暴露连接焊盘的上部的开口; 以及形成在开口中的焊球。

公开(公告)号：US08633132B2

公开(公告)日：2014-01-21

申请号：US12641599

申请日：2009-12-18

Applicant: Hyun-chul Lee ,  Doo-hwan Lee ,  Eun-duck Park ,  Kang-hee Lee ,  Yun-ha Kim ,  Jae-hyun Park

Inventor： Hyun-chul Lee ,  Doo-hwan Lee ,  Eun-duck Park ,  Kang-hee Lee ,  Yun-ha Kim ,  Jae-hyun Park

IPC: H01M4/88 ,  B01J37/00 ,  B01J23/00 ,  H01M4/02

CPC classification number: H01M8/0618 ,  B01J23/78 ,  B01J23/83 ,  B01J23/835 ,  B01J23/8872 ,  B01J23/888 ,  B01J23/8892 ,  B01J23/8896 ,  B01J35/002 ,  B01J37/0205 ,  C01B3/40 ,  C01B3/48 ,  C01B2203/0233 ,  C01B2203/0283 ,  C01B2203/066 ,  C01B2203/1041 ,  C01B2203/1058 ,  C01B2203/1082 ,  C01B2203/1235 ,  H01M8/0625 ,  Y02P20/52 ,  Y02P70/56

Abstract: A hydrocarbon reforming catalyst, a method of preparing the hydrocarbon reforming catalyst, and a fuel cell including the hydrocarbon reforming catalyst. The hydrocarbon reforming catalyst includes an oxide support as well as a nickel active catalyst layer, a metal oxide, an alkali metal supported by the oxide support.

Abstract translation: 烃重整催化剂，烃重整催化剂的制备方法和包含烃重整催化剂的燃料电池。 烃重整催化剂包括氧化物载体以及镍活性催化剂层，金属氧化物，由氧化物载体担载的碱金属。

公开(公告)号：US20130081863A1

公开(公告)日：2013-04-04

申请号：US13607971

申请日：2012-09-10

Applicant: Doo Hwan LEE ,  Tae Sung JEONG ,  Jin Won LEE ,  Moon Il KIM

Inventor： Doo Hwan LEE ,  Tae Sung JEONG ,  Jin Won LEE ,  Moon Il KIM

IPC: H05K1/16 ,  H05K3/10 ,  H05K1/09

CPC classification number: H01L23/5389 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24195 ,  H01L2924/12042 ,  H05K1/188 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2203/308 ,  Y10T156/1052 ,  Y10T156/1082 ,  H01L2924/00

Abstract: Provided are a substrate with built-in electronic component and a method for manufacturing the same. The method for manufacturing a substrate with built-in electronic component includes: forming conductive temporary bumps which penetrate and protrude through a prepreg sheet; mounting and attaching an electronic component on the protruding temporary bumps; forming an embedded substrate by laminating other prepreg sheet on the attached electronic component layer, laminating a metal sheet on a bottom of a laminate or on a bottom and top of the laminate, and pressing the prepreg sheets and the metal sheet; forming contact grooves by removing partial regions of the metal sheet and by removing the temporary bumps exposed by the removal of the metal sheet regions; and filling the contact grooves with a conductive metal and forming a circuit pattern.

Abstract translation: 提供了具有内置电子部件的基板及其制造方法。 用于制造具有内置电子部件的基板的方法包括：形成穿透并突出穿过预浸片的导电性临时凸块; 在突出的临时凸块上安装和附接电子部件; 通过将附着的电子元件层上的其它预浸渍片层叠在一起形成嵌入式基板，在层叠体的底部或层叠体的底部和顶部层压金属片，并且对预浸料片和金属片进行加压; 通过去除金属片的部分区域并且通过去除通过去除金属片区域暴露的临时凸块来形成接触槽; 并用导电金属填充接触槽并形成电路图案。