公开(公告)号：US09039390B2

公开(公告)日：2015-05-26

申请号：US13388116

申请日：2009-12-02

Applicant: Kang-Wook Lee ,  Jang-Woo Lee ,  Bum-Dong Sa ,  Jin-Ung Shin

Inventor： Kang-Wook Lee ,  Jang-Woo Lee ,  Bum-Dong Sa ,  Jin-Ung Shin

IPC: F04B35/04 ,  F01C21/02 ,  F04C18/32 ,  F04C18/356 ,  F04C23/00 ,  F04C23/02 ,  F04C29/00 ,  F04C29/02

CPC classification number: F01C21/02 ,  F04C18/322 ,  F04C18/3564 ,  F04C23/008 ,  F04C23/02 ,  F04C29/0071 ,  F04C29/0085 ,  F04C29/023 ,  F04C2230/603 ,  F04C2240/10 ,  F04C2240/30 ,  F04C2240/40 ,  F04C2240/52 ,  F04C2240/60 ,  F04C2270/12

Abstract: A compressor is provided in which a rotary member suspended on a stationary member is rotated to compress a refrigerant. The rotary member is suspended on a first stationary member and rotatably supported on a second stationary member spaced apart from the first stationary member, to thereby achieve structural stability, improve operation reliability, and reduce vibration. The components can be easily centered and assembled with an excellent assembly property. In addition, a mounting structure of an elastically-supported vane is improved to ensure lubrication performance and operation reliability. Moreover, a mounting structure of a roller-incorporated vane is improved to reduce vibration and prevent refrigerant leakage, which leads to high compression efficiency.

Abstract translation: 提供了一种压缩机，其中悬挂在固定构件上的旋转构件旋转以压缩制冷剂。 旋转构件悬挂在第一固定构件上并且可旋转地支撑在与第一固定构件间隔开的第二固定构件上，从而实现结构稳定性，提高操作可靠性并减少振动。 组件可以容易地集中和组装，具有优异的组装性能。 此外，改进了弹性支撑叶片的安装结构，以确保润滑性能和操作可靠性。 此外，改进了带辊子的叶片的安装结构以减少振动并防止制冷剂泄漏，这导致高的压缩效率。

公开(公告)号：US08814546B2

公开(公告)日：2014-08-26

申请号：US13388112

申请日：2009-12-02

Applicant: Kang-Wook Lee ,  Bum-Dong Sa ,  Se-Seok Seol ,  Seoung-Min Kang ,  Jin-Ung Shin

Inventor： Kang-Wook Lee ,  Bum-Dong Sa ,  Se-Seok Seol ,  Seoung-Min Kang ,  Jin-Ung Shin

IPC: F01C21/00 ,  F04D15/00 ,  F01C21/04 ,  F01C21/06 ,  F03C2/00 ,  F03C4/00 ,  F04C2/00 ,  F01C1/02 ,  F04C18/32 ,  F04C23/02 ,  F04C29/02 ,  F04C29/00 ,  F01C21/02 ,  F04C18/356

CPC classification number: F04C18/3564 ,  F01C21/02 ,  F04C18/322 ,  F04C23/02 ,  F04C29/0071 ,  F04C29/0085 ,  F04C29/023 ,  F04C2240/10 ,  F04C2240/30 ,  F04C2240/40 ,  F04C2240/52 ,  F04C2240/60 ,  F04C2270/12

Abstract: A compressor is provided in which a rotary member is suspended on a stationary member and rotates to compress a refrigerant. In the stationary member, top and bottom ends of a stationary shaft are fixed to improve structural stability and assembly properties. Bearing covers are provided on a contact portion of the stationary member and the rotary member, such that the rotary member may rotate when suspended on the stationary member, which stabilizes operation. In the rotary member, a vane is integrally formed with a roller and mounted on a vane mounting hole of a cylinder-type rotor. Although, the rotary member is provided on an outer circumferential surface of the stationary member, suction and discharge operations of the refrigerant are performed in an axial direction, which lowers product height. Oil stored in a hermetic container is supplied to a lubrication passage provided between the stationary member and the rotary member.

Abstract translation: 提供了一种压缩机，其中旋转构件悬挂在固定构件上并旋转以压缩制冷剂。 在固定件中，固定轴的顶端和底端是固定的，以提高结构的稳定性和组装性能。 轴承盖设置在固定构件和旋转构件的接触部分上，使得旋转构件可以在悬挂在静止构件上时旋转，这使操作稳定。 在旋转构件中，叶片与辊一体地形成并安装在圆柱型转子的叶片安装孔上。 虽然旋转部件设置在固定部件的外周面上，但制冷剂的抽吸和排出操作在轴向上进行，这降低了产品高度。 存储在密封容器中的油被供给到设置在固定构件和旋转构件之间的润滑通道。

公开(公告)号：US20120141312A1

公开(公告)日：2012-06-07

申请号：US13388112

申请日：2009-12-02

Applicant: Kang-Wook Lee ,  Bum-Dong Sa ,  Se-Seok Seol ,  Seoung-Min Kang ,  Jin-Ung Shin

Inventor： Kang-Wook Lee ,  Bum-Dong Sa ,  Se-Seok Seol ,  Seoung-Min Kang ,  Jin-Ung Shin

IPC: F04C18/332 ,  F04C29/02

CPC classification number: F04C18/3564 ,  F01C21/02 ,  F04C18/322 ,  F04C23/02 ,  F04C29/0071 ,  F04C29/0085 ,  F04C29/023 ,  F04C2240/10 ,  F04C2240/30 ,  F04C2240/40 ,  F04C2240/52 ,  F04C2240/60 ,  F04C2270/12

Abstract: The present invention relates to a compressor in which a rotary member is suspended on a stationary member and rotated to compress the refrigerant. In the stationary member, top and bottom ends of a stationary shaft are fixed to improve the structural stability and assembly property. Bearing covers are provided on a contact portion of the stationary member and the rotary member such that the rotary member can be rotated when suspended on the stationary member. This stabilizes the operation. In the rotary member, a vane is integrally formed with a roller and mounted on a vane mounting hole of a cylinder-type rotor. This reduces the vibration and prevents refrigerant leakage to improve the compression effect. Although the rotary member is provided on an outer circumferential surface of the stationary member, it is possible to perform the suction and discharge of the refrigerant in the axial direction. This can lower the product height. The oil stored in a hermetic container is supplied to a lubrication passage provided between the stationary member and the rotary member, thereby reducing a friction loss between the components and achieving the operation reliability.

Abstract translation: 压缩机技术领域本发明涉及一种压缩机，其中旋转构件悬挂在静止构件上并旋转以压缩制冷剂。 在固定件中，固定轴的顶端和底端是固定的，以提高结构的稳定性和组装性。 轴承盖设置在固定构件和旋转构件的接触部分上，使得旋转构件可以在悬挂在固定构件上时旋转。 这样可以稳定操作。 在旋转构件中，叶片与辊一体地形成并安装在圆柱型转子的叶片安装孔上。 这样可以减少振动，防止制冷剂泄漏，提高压缩效果。 虽然旋转部件设置在静止部件的外周面上，但是也可以在轴向上进行制冷剂的吸入和排出。 这可以降低产品的高度。 存储在密闭容器中的油被供给到设置在固定构件和旋转构件之间的润滑通道，从而减少部件之间的摩擦损失并实现操作可靠性。

公开(公告)号：US20110049221A1

公开(公告)日：2011-03-03

申请号：US12551960

申请日：2009-09-01

Applicant: Pascal P. Blais ,  Paul F. Fortier ,  Kang-Wook Lee ,  Jae-Woong Nah ,  Soojae Park ,  Robert L. Toutant ,  Alain A. Warren

Inventor： Pascal P. Blais ,  Paul F. Fortier ,  Kang-Wook Lee ,  Jae-Woong Nah ,  Soojae Park ,  Robert L. Toutant ,  Alain A. Warren

IPC: B23K37/04 ,  B23K31/00

CPC classification number: B23K1/0016 ,  H01L21/563 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/73204 ,  H01L2224/75704 ,  H01L2224/75985 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/3511 ,  H01L2924/01026 ,  H01L2924/00

Abstract: A method and apparatus for making chip assemblies is disclosed that prevent or reduce the cracking and delamination of ultra low-k dielectrics in the back-end-of-line in Si chips that can occur during the chip assembly process. The method and apparatus apply pressure to the top and bottom surfaces of a substrate during the chip bonding process so that the bending and warping of the assembled modules are reduced. The reduced bending and warping prevent or reduce the cracking and delamination of ultra low-k dielectrics.

Abstract translation: 公开了一种用于制造芯片组件的方法和装置，其防止或减少在芯片组装过程中可能发生的Si芯片中后端的超低k电介质的开裂和分层。 该方法和装置在芯片接合过程期间对基板的顶表面和底表面施加压力，使得组装的模块的弯曲和翘曲减小。 减少弯曲和翘曲防止或减少超低k电介质的开裂和分层。

公开(公告)号：US07777323B2

公开(公告)日：2010-08-17

申请号：US11750663

申请日：2007-05-18

Applicant: Yong Chai Kwon ,  Keum-Hee Ma ,  Kang-Wook Lee ,  Dong-Ho Lee ,  Seong-il Han

Inventor： Yong Chai Kwon ,  Keum-Hee Ma ,  Kang-Wook Lee ,  Dong-Ho Lee ,  Seong-il Han

IPC: H01L23/12 ,  H01L21/44

CPC classification number: H01L21/76898 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05009 ,  H01L2224/06181 ,  H01L2224/13009 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16147 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/00

Abstract: Example embodiments are directed to a method of forming a semiconductor structure and a semiconductor structure including a semiconductor unit including a protrusion on a front side of the semiconductor unit and a recess on a backside of the semiconductor unit.

Abstract translation: 示例性实施例涉及一种形成半导体结构的方法和包括半导体单元的半导体结构的方法，所述半导体单元包括在半导体单元的前侧上的突起和半导体单元的背侧上的凹部。

公开(公告)号：US07537959B2

公开(公告)日：2009-05-26

申请号：US11889400

申请日：2007-08-13

Applicant: Kang-Wook Lee ,  Gu-Sung Kim ,  Dong-Hyeon Jang ,  Seung-Duk Baek ,  Jae-Sik Chung

Inventor： Kang-Wook Lee ,  Gu-Sung Kim ,  Dong-Hyeon Jang ,  Seung-Duk Baek ,  Jae-Sik Chung

IPC: H01L21/00 ,  H01L21/26 ,  H01L21/44 ,  H01L29/40

CPC classification number: H01L25/50 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05556 ,  H01L2224/05569 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  Y02P80/30 ,  Y10S438/977 ,  Y10T436/104998 ,  Y10T436/108331 ,  Y10T436/17 ,  Y10T436/175383 ,  H01L2224/81 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A chip stack package is manufactured at a wafer level by forming connection vias in the scribe lanes adjacent the chips and connecting the device chip pads to the connection vias using rerouting lines. A lower chip is then attached and connected to a substrate, which may be a test wafer, and an upper chip is attached and connected to the lower chip, the electrical connections being achieved through their respective connection vias. In addition to the connection vias, the chip stack package may include connection bumps formed between vertically adjacent chips and/or the lower chip and the substrate. The preferred substrate is a test wafer that allows the attached chips to be tested, and replaced if faulty, thereby ensuring that each layer of stacked chips includes only “known-good die” before the next layer of chips is attached thereby increasing the production rate and improving the yield.

Abstract translation: 通过在与芯片相邻的划线中形成连接通孔并且使用重新布线将连接器件芯片焊盘连接到连接通孔，在晶片级制造芯片堆叠封装。 然后将下部芯片连接并连接到可以是测试晶片的衬底，并且上部芯片被附接并连接到下部芯片，电连接通过它们各自的连接通孔来实现。 除了连接通孔之外，芯片堆叠封装可以包括在垂直相邻的芯片和/或下部芯片和衬底之间形成的连接凸块。 优选的基板是测试晶片，其允许附接的芯片被测试并且如果有故障则被替换，从而确保每层堆叠的芯片仅在连接下一层芯片之前仅包括“已知的芯片”，从而提高生产率 并提高产量。

公开(公告)号：US20080124568A1

公开(公告)日：2008-05-29

申请号：US11493724

申请日：2006-07-26

Applicant: Eric Duchesne ,  Kang-Wook Lee ,  Valerie Oberson

Inventor： Eric Duchesne ,  Kang-Wook Lee ,  Valerie Oberson

IPC: B32B15/01 ,  B23K1/00 ,  B23K35/363

CPC classification number: B23K35/362 ,  Y10T428/12493

Abstract: The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another. The process employs the flux composition operatively associated with the solder, and in one embodiment the invention comprises a mixture of the flux composition with powdered solder. In another embodiment, the process comprises IMS, C4 and C4NP processes and the solder comprises a lead free solder. The invention also comprises a product produced by the foregoing process or processes.

Abstract translation: 本发明涉及包含助焊剂的物质组合物，其中助熔剂基本上由助熔剂和溶剂的组合组成，并且其中助熔剂包括酮酸，例如乙酰丙酸或乙酰基丁酸。 助熔剂还可以包含酯酸，或包含酮酸与酯酸的混合物。 溶剂包括粘性溶剂与非粘性溶剂的混合物。 本发明还涉及一种方法，其包括将至少两个表面焊接在一起，每个表面包括金属区域，焊料可以以任何顺序通过以下步骤粘附到该金属区域：将焊料施加到至少一个金属区域，使金属对准 区域，使得它们彼此叠加，将至少一个区域加热至至少包括焊料的熔化温度的温度。 最后一步包括将叠加的区域相互连接。 该方法使用与焊料可操作地相关联的助熔剂组合物，并且在一个实施方案中，本发明包括焊剂组合物与粉末焊料的混合物。 在另一个实施方案中，该方法包括IMS，C4和C4NP方法，焊料包括无铅焊料。 本发明还包括通过前述方法或方法生产的产品。

公开(公告)号：US20070281374A1

公开(公告)日：2007-12-06

申请号：US11889400

申请日：2007-08-13

Applicant: Kang-Wook Lee ,  Gu-Sung Kim ,  Dong-Hyeon Jang ,  Seung-Duk Baek ,  Jae-Sik Chung

Inventor： Kang-Wook Lee ,  Gu-Sung Kim ,  Dong-Hyeon Jang ,  Seung-Duk Baek ,  Jae-Sik Chung

IPC: H01L21/66 ,  H01L21/58

CPC classification number: H01L25/50 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05556 ,  H01L2224/05569 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  Y02P80/30 ,  Y10S438/977 ,  Y10T436/104998 ,  Y10T436/108331 ,  Y10T436/17 ,  Y10T436/175383 ,  H01L2224/81 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A chip stack package is manufactured at a wafer level by forming connection vias in the scribe lanes adjacent the chips and connecting the device chip pads to the connection vias using rerouting lines. A lower chip is then attached and connected to a substrate, which may be a test wafer, and an upper chip is attached and connected to the lower chip, the electrical connections being achieved through their respective connection vias. In addition to the connection vias, the chip stack package may include connection bumps formed between vertically adjacent chips and/or the lower chip and the substrate. The preferred substrate is a test wafer that allows the attached chips to be tested, and replaced if faulty, thereby ensuring that each layer of stacked chips includes only “known-good die” before the next layer of chips is attached thereby increasing the production rate and improving the yield.

公开(公告)号：US20070170576A1

公开(公告)日：2007-07-26

申请号：US11727760

申请日：2007-03-28

Applicant: Kang-Wook Lee ,  Se-Yong Oh ,  Young-Hee Song ,  Gu-Sung Kim

Inventor： Kang-Wook Lee ,  Se-Yong Oh ,  Young-Hee Song ,  Gu-Sung Kim

IPC: H01L23/02

CPC classification number: H01L25/50 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/02372 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A wafer level stack structure, including a first wafer including at least one first device chip of a first chip size, wherein each first device chip contains a first plurality of input/output (I/O) pads, a second wafer including at least one second device chip of a second chip size smaller than the first chip size, wherein each second device chip contains a second plurality of I/O pads, wherein the at least one second device chip is increased to the first chip size, wherein the first wafer and the second wafer are stacked, and wherein the first wafer and the second wafer are coupled to each other. A method of forming a wafer level stack structure, including forming a first wafer including at least one first device chip of a first chip size, wherein each first device chip contains a first plurality of input/output (I/O) pads, forming a second wafer including at least one second device chip of a second chip size smaller than the first chip size, wherein each second device chip contains a second plurality of I/O pads, wherein the at least one second device chip is increased to the first chip size, stacking the first wafer and the second wafer, and coupling the first wafer and the second wafer to each other. A system-in-package, including a wafer level stack structure including at least one first device chip with a first plurality of input/output (I/O) pads and at least one second device chip with a second plurality of I/O pads, and a common circuit board to which the wafer level stack structure is connected. A method of forming a system-in-package for containing a wafer level stack structure, including forming a wafer level stack structure including at least one first device chip having a first plurality of input/output (I/O) pads and at least one second device chip having a second plurality of I/O pads, and forming a common circuit board to which the wafer level stack structure is connected.

公开(公告)号：US20070007641A1

公开(公告)日：2007-01-11

申请号：US11348670

申请日：2006-02-06

Applicant: Kang-Wook Lee ,  Gu-Sung Kim ,  Yong-Chai Kwon ,  Keum-Hee Ma ,  Seong-Il Han

Inventor： Kang-Wook Lee ,  Gu-Sung Kim ,  Yong-Chai Kwon ,  Keum-Hee Ma ,  Seong-Il Han

IPC: H01L23/52

CPC classification number: H01L25/0657 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00012

Abstract: A method for fabricating a chip-embedded interposer may comprise forming at least one cavity on a silicon substrate, forming a plurality of through vias penetrating the silicon substrate, providing an integrated circuit chip having a plurality of I/O pads, and forming rerouting conductors connected to the I/O pads and the through vias. A stack structure having different kinds of chips may be incorporated at wafer level using the described interposer.

Abstract translation: 芯片嵌入式插入器的制造方法可以包括在硅衬底上形成至少一个空腔，形成穿过硅衬底的多个通孔，提供具有多个I / O焊盘的集成电路芯片，以及形成重新布线的导体 连接到I / O焊盘和通孔。 具有不同种类的芯片的堆叠结构可以使用所描述的插入器结合在晶片级。