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    UV CURABLE CMP POLISHING PAD AND METHOD OF MANUFACTURE
    82.
    发明申请
    UV CURABLE CMP POLISHING PAD AND METHOD OF MANUFACTURE 审中-公开

    公开(公告)号：US20190009388A1

    公开(公告)日：2019-01-10

    申请号：US16130939

    申请日：2018-09-13

    Applicant: Applied Materials, Inc.

    Inventor： Mahendra Christopher Orilall ,  Rajeev Bajaj ,  Fred C. Redeker

    IPC: B24D11/00 ,  B29C35/08 ,  B24D3/32

    Abstract: A method of fabricating a chemical mechanical polishing pad includes introducing polymer precursors containing acrylate functional groups into a mold, providing abrasive particles and a photo-initiator in the polymer precursors to form a mixture, and while the mixture is contained between a bottom plate and a top cover of the mold, exposing the mixture to ultraviolet radiation through a transparent section of the mold to cause the polymer precursors to form radicals, forming a polymer matrix from the polymer precursor by causing the radicals to cross-link with one another. The polishing layer includes the polymer matrix having the abrasive particles dispersed therein.

    SYSTEMS, APPARATUS, AND METHODS FOR CHEMICAL POLISHING
    87.
    发明申请
    SYSTEMS, APPARATUS, AND METHODS FOR CHEMICAL POLISHING 审中-公开

    公开(公告)号：US20170225294A1

    公开(公告)日：2017-08-10

    申请号：US15426039

    申请日：2017-02-06

    Applicant: Applied Materials, Inc.

    Inventor： Balasubramaniam C. Jaganathan ,  Rajeev Bajaj

    IPC: B24B57/02 ,  B24B37/20

    CPC classification number: B24B57/02 ,  B24B37/20

    Abstract: Embodiments of the present invention provide systems, apparatus, and methods for chemical polishing a substrate using a fluid network platen assembly that includes a pad having a plurality of fluid openings; a network of a plurality of fluid channels, each channel in fluid communication with at least one fluid opening; a plurality of inlets, each inlet coupled to a different fluid channel; and an outlet coupled to one of the fluid channels not coupled to an inlet. Numerous additional aspects are disclosed.

    Conditioning of grooving in polishing pads
    88.
    发明授权
    Conditioning of grooving in polishing pads 有权
    调理抛光垫中的切槽

    公开(公告)号：US09486893B2

    公开(公告)日：2016-11-08

    申请号：US14285545

    申请日：2014-05-22

    Applicant: Applied Materials, Inc.

    Inventor： Hung Chen ,  Rajeev Bajaj ,  Brian J. Brown ,  Robert T. Lum ,  Fred C. Redeker

    IPC: H01L21/302 ,  B24B53/017 ,  B24B37/26 ,  B26F3/00 ,  B23K26/36 ,  B26D3/06

    CPC classification number: B24B53/017 ,  B23K26/36 ,  B24B37/26 ,  B26D3/06 ,  B26F3/004

    Abstract: Among other things, a method comprises polishing a surface of a substrate by applying a pressure between the surface of a substrate and a surface of a polishing pad. The surface of the polishing pad defines one or more grooves separated by one or more partition regions. The one or more grooves have an initial depth before the polishing starts and extend from an initial outer surface of the one or more partition regions to an initial bottom of the one or more grooves. The method also comprises removing material below an initial bottom of the one or more grooves such that a distance between an outer surface of the one or more partition regions and a bottom of the one or more grooves remain substantially the same as the initial depth.

    Abstract translation: 除其他之外，一种方法包括通过在基板的表面和抛光垫的表面之间施加压力来抛光基板的表面。 抛光垫的表面限定了一个或多个由一个或多个分隔区隔开的槽。 一个或多个凹槽在抛光开始之前具有初始深度并且从一个或多个分隔区域的初始外表面延伸到一个或多个凹槽的初始底部。 该方法还包括在一个或多个凹槽的初始底部下方移除材料，使得一个或多个分隔区域的外表面与一个或多个凹槽的底部之间的距离保持与初始深度基本相同。

    UV CURABLE CMP POLISHING PAD AND METHOD OF MANUFACTURE
    89.
    发明申请
    UV CURABLE CMP POLISHING PAD AND METHOD OF MANUFACTURE 审中-公开
    UV可固化CMP抛光垫及其制造方法

    公开(公告)号：US20160176021A1

    公开(公告)日：2016-06-23

    申请号：US14575608

    申请日：2014-12-18

    Applicant: Applied Materials, Inc.

    Inventor： Mahendra Christopher Orilall ,  Rajeev Bajaj ,  Fred C. Redeker

    IPC: B24D11/00 ,  B24D3/32 ,  B29C35/08

    CPC classification number: B24D11/001 ,  B24D3/32 ,  B24D11/00 ,  B29C35/0805 ,  B29C35/0888 ,  B29C2035/0822 ,  B29C2035/0827

    Abstract: A method of fabricating a chemical mechanical polishing pad includes introducing polymer precursors containing acrylate functional groups into a mold, providing abrasive particles and a photo-initiator in the polymer precursors to form a mixture, and while the mixture is contained between a bottom plate and a top cover of the mold, exposing the mixture to ultraviolet radiation through a transparent section of the mold to cause the polymer precursors to form radicals, forming a polymer matrix from the polymer precursor by causing the radicals to cross-link with one another. The polishing layer includes the polymer matrix having the abrasive particles dispersed therein.

    Abstract translation: 制造化学机械抛光垫的方法包括将含有丙烯酸酯官能团的聚合物前体引入模具中，在聚合物前体中提供研磨颗粒和光引发剂以形成混合物，并且当混合物包含在底板和 模具的顶盖，通过模具的透明部分将混合物暴露于紫外线辐射，以使聚合物前体形成自由基，通过使自由基彼此交联从聚合物前体形成聚合物基质。 抛光层包括其中分散有磨料颗粒的聚合物基质。

    CHEMICAL MECHANICAL POLISHING APPARATUS AND METHODS
    90.
    发明申请
    CHEMICAL MECHANICAL POLISHING APPARATUS AND METHODS 审中-公开
    化学机械抛光装置及方法

    公开(公告)号：US20140199840A1

    公开(公告)日：2014-07-17

    申请号：US14143276

    申请日：2013-12-30

    Applicant: Applied Materials, Inc.

    Inventor： Rajeev Bajaj ,  Thomas H. Osterheld ,  Hung Chen ,  Terrance Y. Lee

    IPC: H01L21/306 ,  H01L21/67

    CPC classification number: B24B37/044 ,  B24B57/02 ,  H01L21/30625 ,  H01L21/3212 ,  H01L21/67075 ,  H01L21/67092

    Abstract: In one aspect, a substrate polishing apparatus is disclosed. The apparatus has a polishing platform having two or more zones, each zone adapted to contain a different slurry component. In another aspect, a substrate polishing system is provided having a holder to hold a substrate, a polishing platform having a polishing pad, and a distribution system adapted to dispense, in a timed sequence, at least two different slurry components selected from a group consisting of an oxidation slurry component, a material removal slurry component, and a corrosion inhibiting slurry component. Polishing methods and systems adapted to polish substrates are provided, as are numerous other aspects.

    Abstract translation: 一方面，公开了一种基板研磨装置。 该设备具有具有两个或更多个区域的抛光平台，每个区域适于容纳不同的浆料组分。 在另一方面，提供一种基板抛光系统，其具有用于保持基板的保持器，具有抛光垫的抛光平台和适于以定时顺序分配至少两种不同的浆料组分的分配系统，所述浆料组分选自 的氧化浆料组分，材料去除浆料组分和腐蚀抑制浆料组分。 提供了适于抛光底物的抛光方法和系统，以及许多其它方面。

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