公开(公告)号：US06699928B2

公开(公告)日：2004-03-02

申请号：US09941495

申请日：2001-08-29

申请人： Chad A. Cobbley ,  Tongbi Jiang ,  Edward A. Schrock

发明人： Chad A. Cobbley ,  Tongbi Jiang ,  Edward A. Schrock

IPC分类号： C08J300

CPC分类号： H01L24/83 ,  H01L24/27 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512

摘要： An adhesive composition and methods incorporating the adhesive composition in semiconductor applications are provided. The adhesive composition is an instant setting adhesive composition that does not require external energy input such as heat or radiation such for application of the adhesive composition on a surface. The instant setting composition possesses sufficient thixotropic characteristics such that applying the instant setting adhesive composition to a surface can be accomplished by a variety of application techniques and in a variety of patterns. Once applied to the surface, the instant setting adhesive composition sets to retain the discrete pattern as applied, in a relatively short period of time, typically from about 0.10 to about 120 seconds at an ambient temperature, typically from 20° C. to 30° C. Advantageously, the instant setting adhesive composition can be screen printed on a semiconductor wafer prior to singulation because streets between the dice are essentially free of the instant setting adhesive composition.

摘要翻译： 提供在半导体应用中粘合组合物的粘合剂组合物和方法。 粘合剂组合物是瞬间固化粘合剂组合物，其不需要诸如热或辐射的外部能量输入，以便将粘合剂组合物施加在表面上。 本发明的凝固组合物具有足够的触变特性，使得将即刻固化粘合剂组合物施加到表面可以通过各种应用技术和各种图案来实现。 一旦施加到表面上，即刻固化粘合剂组合物在相对较短的时间段内保持离散的图案，通常在约0.10至约120秒的环境温度，通常为20℃至30℃ 有利地，即刻固化粘合剂组合物可以在切割之前丝网印刷在半导体晶片上，因为骰子之间的街道基本上不含瞬时固化粘合剂组合物。

公开(公告)号：US06641669B1

公开(公告)日：2003-11-04

申请号：US09513934

申请日：2000-02-28

申请人： Tongbi Jiang ,  Chad A. Cobbley ,  John VanNortwick

发明人： Tongbi Jiang ,  Chad A. Cobbley ,  John VanNortwick

IPC分类号： B05C1111

CPC分类号： B41C1/14 ,  B41N1/242 ,  H01L2224/4826 ,  H05K3/1225 ,  Y10S438/945

摘要： A method and apparatus for improved stencil/screen print quality is disclosed. The stencil or screen assists in application of a printable material onto a substrate, such as an adhesive to a semiconductor die of a semiconductor wafer during a lead-on-chip (LOC) packaging process. In one embodiment, the stencil includes a coating applied to at least one surface of a pattern of the stencil or screen to retard running of the printable material onto the surface. In another embodiment, the stencil or screen includes a second coating applied to at least one other surface of the pattern to promote spreading of the printable material onto the substrate.

公开(公告)号：US06595408B1

公开(公告)日：2003-07-22

申请号：US09167763

申请日：1998-10-07

申请人： Chad A. Cobbley ,  Michael B. Ball ,  Marjorie L. Waddel

发明人： Chad A. Cobbley ,  Michael B. Ball ,  Marjorie L. Waddel

IPC分类号： B23K3512

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  B23K2101/40 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2924/00014 ,  H05K3/3489 ,  H05K2203/041 ,  H05K2203/082 ,  Y10T29/49146 ,  H01L2224/05599

摘要： An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. A ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.

摘要翻译： 在第一衬底上形成一组焊球，用于与另一衬底上的导电部位相互连接。 球形拾取工具从流化球储存器中抽真空吸取球，并利用气泡将其上承载的焊球释放到衬底的导电部位以与其结合。 在另一个实施例中，衬底的接合焊盘涂覆有焊剂或粘合剂，并且下降到流化的球储存器中以直接附着焊球。

公开(公告)号：US06551917B2

公开(公告)日：2003-04-22

申请号：US09897808

申请日：2001-06-29

申请人： Chad A. Cobbley ,  Michael B. Ball ,  Marjorie L. Waddel

发明人： Chad A. Cobbley ,  Michael B. Ball ,  Marjorie L. Waddel

IPC分类号： H01L2144

CPC分类号： H01L24/12 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3478 ,  H05K2203/0126 ,  H05K2203/041 ,  H05K2203/0557 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49211 ,  Y10T29/49222 ,  Y10T29/53178 ,  Y10T29/532 ,  H01L2224/05599

摘要： Apparatus and methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.

摘要翻译： 使用具有定位在接合焊盘上方的通孔图案的模板将导电球放置在衬底的预先焊接的焊盘上的装置和方法。 导电球通过移动进给机构放置在通孔中，并且球体通过通孔落到接合垫上。 在一个实施例中，进给机构是穿过整个通孔图案的球形料斗。 在另一个实施例中，梭板从储存器供给球体并可逆地移动约一半的间距，从非排放位置移动到排出位置。

公开(公告)号：US06537400B1

公开(公告)日：2003-03-25

申请号：US09520377

申请日：2000-03-06

申请人： Rich Fogal ,  John VanNortwick ,  Chad A. Cobbley

发明人： Rich Fogal ,  John VanNortwick ,  Chad A. Cobbley

IPC分类号： B32B3100

CPC分类号： H01L21/67259 ,  H01L21/67144 ,  H01L21/6838 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/14 ,  Y10T156/1089 ,  Y10T156/109 ,  Y10T156/1702 ,  Y10T156/1744 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Apparatus and method for attaching, assembling, and/or mounting a substrate to any semiconductor device or a flip-chip type semiconductor device.

公开(公告)号：US06533159B1

公开(公告)日：2003-03-18

申请号：US09639486

申请日：2000-08-14

申请人： Chad A. Cobbley ,  Michael B. Ball ,  Marjorie L. Waddel

发明人： Chad A. Cobbley ,  Michael B. Ball ,  Marjorie L. Waddel

IPC分类号： B23K500

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  B23K2101/40 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2924/00014 ,  H05K3/3489 ,  H05K2203/041 ,  H05K2203/082 ,  Y10T29/49146 ,  H01L2224/05599

摘要： An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. A ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.

摘要翻译： 在第一衬底上形成一组焊球，用于与另一衬底上的导电部位相互连接。 球形拾取工具从流化球储存器中抽真空吸取球，并利用气泡将其上承载的焊球释放到衬底的导电部位以与其结合。 在另一个实施例中，衬底的接合焊盘涂覆有焊剂或粘合剂，并且下降到流化的球储存器中以直接附着焊球。

公开(公告)号：US06521287B2

公开(公告)日：2003-02-18

申请号：US09513939

申请日：2000-02-28

申请人： Tongbi Jiang ,  Chad A. Cobbley ,  John VanNortwick

发明人： Tongbi Jiang ,  Chad A. Cobbley ,  John VanNortwick

IPC分类号： B05D132

CPC分类号： B41C1/14 ,  B41N1/242 ,  H01L2224/4826 ,  H05K3/1225 ,  Y10S438/945

摘要： A method and apparatus for improved stencil/screen print quality is disclosed. The stencil or screen assists in application of a printable material onto a substrate, such as an adhesive to a semiconductor die of a semiconductor wafer during a lead-on-chip (LOC) packaging process. In one embodiment, the stencil includes a coating applied to at least one surface of a pattern of the stencil or screen to retard running of the printable material onto the surface. In another embodiment, the stencil or screen includes a second coating applied to at least one other surface of the pattern to promote spreading of the printable material onto the substrate.

摘要翻译： 公开了一种用于改进模板/丝网印刷质量的方法和装置。 在片上（LOC）包装过程中，模板或屏幕有助于将可印刷材料施加到基底上，例如对半导体晶片的半导体管芯的粘合剂。 在一个实施例中，模板包括施加到模板或筛网的图案的至少一个表面上的涂层，以阻止可印刷材料运动到表面上。 在另一个实施例中，模板或丝网包括施加到图案的至少一个其他表面的第二涂层，以促进可印刷材料在基底上的铺展。

公开(公告)号：US06368897B1

公开(公告)日：2002-04-09

申请号：US09513935

申请日：2000-02-28

申请人： Tongbi Jiang ,  Chad A. Cobbley ,  John VanNortwick

发明人： Tongbi Jiang ,  Chad A. Cobbley ,  John VanNortwick

IPC分类号： B41N124

CPC分类号： B41C1/14 ,  B41N1/242 ,  H01L2224/4826 ,  H05K3/1225 ,  Y10S438/945

摘要： A method and apparatus for improved stencil/screen print quality is disclosed. The stencil or screen assists in application of a printable material onto a substrate, such as an adhesive to a semiconductor die of a semiconductor wafer during a lead-on-chip (LOC) packaging process. In one embodiment, the stencil includes a coating applied to at least one surface of a pattern of the stencil or screen to retard running of the printable material onto the surface. In another embodiment, the stencil or screen includes a second coating applied to at least one other surface of the pattern to promote spreading of the printable material onto the substrate.

摘要翻译： 公开了一种用于改进模板/丝网印刷质量的方法和装置。 在片上（LOC）包装过程中，模板或屏幕有助于将可印刷材料施加到基底上，例如对半导体晶片的半导体管芯的粘合剂。 在一个实施例中，模板包括施加到模板或筛网的图案的至少一个表面上的涂层，以阻止可印刷材料运动到表面上。 在另一个实施例中，模板或丝网包括施加到图案的至少一个其他表面的第二涂层，以促进可印刷材料在基底上的铺展。

公开(公告)号：US06329220B1

公开(公告)日：2001-12-11

申请号：US09448072

申请日：1999-11-23

申请人： Todd O. Bolken ,  Cary J. Baerlocher ,  David J. Corisis ,  Chad A. Cobbley

发明人： Todd O. Bolken ,  Cary J. Baerlocher ,  David J. Corisis ,  Chad A. Cobbley

IPC分类号： H01L2144

CPC分类号： H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30107 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A ball grid array assembly includes a package cover that encapsulates a die and a portion of a substrate to which the die is attached, including an edge of the substrate. Encapsulation of the substrate edge by the cover reduces penetration of moisture or other contaminants into the substrate. The cover includes a rib that extends to contact a circuit board to which the ball grid array assembly is connected. With such a rib, planarity between the circuit board and the substrate is maintained during soldering.

摘要翻译： 球栅阵列组件包括包封模具和包括模具附接到其上的基板的一部分的封装盖，包括基板的边缘。 通过盖子封装衬底边缘可以减少水分或其他污染物渗透到衬底中。 该盖包括延伸以接触球栅阵列组件所连接的电路板的肋。 使用这样的肋，在焊接期间保持电路板和基板之间的平坦度。

公开(公告)号：US08212348B2

公开(公告)日：2012-07-03

申请号：US12839834

申请日：2010-07-20

申请人： Todd O. Bolken ,  Chad A. Cobbley

发明人： Todd O. Bolken ,  Chad A. Cobbley

IPC分类号： H01L21/00

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/5383 ,  H01L24/10 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： Techniques for fabricating multiple device components. Specifically, techniques for fabricating a stacked package comprising at least one I/C module and a multi-chip package. The multi-chip package includes a plurality of integrated circuit dices coupled to a carrier. The dice are encapsulated such that conductive elements are exposed through the encapsulant. The conductive elements are electrically coupled to the chips. The I/C module comprises an interposer having a plurality of integrated circuit dice disposed thereon. The dice of the I/C module are electrically coupled to the interposer via bondwires. The interposer is configured such that vias are aligned with the conductive elements on the multi-chip package. The multi-chip package and I/C module may be fabricated separately and subsequently coupled together to form a stacked package.

摘要翻译： 制造多器件组件的技术。 具体地，涉及用于制造包括至少一个I / C模块和多芯片封装的堆叠封装的技术。 多芯片封装包括耦合到载体的多个集成电路芯片。 骰子被封装，使得导电元件通过密封剂暴露。 导电元件电耦合到芯片。 I / C模块包括具有设置在其上的多个集成电路芯片的插入器。 I / C模块的裸片通过焊丝电耦合到插入器。 插入器被配置为使得通孔与多芯片封装上的导电元件对准。 多芯片封装和I / C模块可以单独制造，然后耦合在一起以形成堆叠封装。