公开(公告)号：US08181341B2

公开(公告)日：2012-05-22

申请号：US12488638

申请日：2009-06-22

Applicant: Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

IPC: H01K3/10

CPC classification number: H05K3/421 ,  H05K1/115 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09863 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/31511

Abstract: A method of forming a circuit board which includes generating laser light with a carbon dioxide laser and making a hole through an insulating substrate by irradiating the insulating substrate with the laser light. The hole includes a top opening in a top surface of the insulating substrate, a bottom opening in a bottom surface of the insulating substrate, and an inner wall extending from the top opening to the bottom opening along a thickness direction of the insulating substrate, the inner wall including a bulge which extends in a direction generally orthogonal to the thickness direction. A via hole is formed in the insulating substrate by providing metal in the hole such that the metal extends from the top opening to the bottom opening along the inner wall, and completely closes each of the top and bottom openings.

Abstract translation: 一种形成电路板的方法，其包括用二氧化碳激光器产生激光并通过用激光照射绝缘基板使绝缘基板形成孔。 所述孔包括在所述绝缘基板的上表面中的顶部开口，所述绝缘基板的底表面中的底部开口以及沿着所述绝缘基板的厚度方向从所述顶部开口延伸到所述底部开口的内壁， 内壁包括在大致正交于厚度方向的方向上延伸的凸起。 通过在孔中提供金属使得金属沿着内壁从顶部开口延伸到底部开口，并且完全封闭每个顶部和底部开口，在绝缘基板中形成通孔。

公开(公告)号：US08177577B2

公开(公告)日：2012-05-15

申请号：US12453718

申请日：2009-05-20

Applicant: Michimasa Takahashi

Inventor： Michimasa Takahashi

IPC: H05K1/11

CPC classification number: H05K1/183 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/141 ,  H05K1/142 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/10484 ,  H05K2203/049 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed wiring board includes a first substrate having a recess portion and multiple conductors, a second substrate having multiple conductors and inserted in the recess portion of the first substrate such that the first substrate has a surface exposing at least a portion of a surface of the second substrate. The multiple conductors in the first substrate is electrically connected to the multiple conductors in the second substrate, and the second substrate has density of the conductors which is higher than density of the conductors of the first substrate.

Abstract translation: 印刷布线板包括具有凹部和多个导体的第一基板，具有多个导体的第二基板，并插入在第一基板的凹部中，使得第一基板具有暴露出第一基板的表面的至少一部分的表面 第二基板。 第一衬底中的多个导体电连接到第二衬底中的多个导体，并且第二衬底具有比第一衬底的导体的密度高的导体的密度。

公开(公告)号：US08101868B2

公开(公告)日：2012-01-24

申请号：US11580165

申请日：2006-10-13

Applicant: Sotaro Ito ,  Michimasa Takahashi ,  Yukinobu Mikado

Inventor： Sotaro Ito ,  Michimasa Takahashi ,  Yukinobu Mikado

IPC: H05K1/16

CPC classification number: H01L24/83 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K1/185 ,  H05K3/0035 ,  H05K3/4652 ,  H05K2201/096 ,  H05K2201/10477 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111 ,  H01L2224/13109

Abstract: A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a second resin insulating layer provided on the first resin insulating layer, a conductor circuit provided on the second resin insulating layer, and via holes for electrically connecting the semiconductor device to the conductor circuit, wherein the semiconductor device is accommodated in a recess provided in the first resin insulating layer, and a metal layer for placing the semiconductor device is provided on the bottom face of the recess. A multilayered printed circuit board in which the installed semiconductor device establishes electrical connection through the via holes is provided.

Abstract translation: 用于安装半导体器件的多层印刷电路板或基板包括半导体器件，容纳半导体器件的第一树脂绝缘层，设置在第一树脂绝缘层上的第二树脂绝缘层，设置在第二树脂绝缘层上的导体电路 层和用于将半导体器件电连接到导体电路的通孔，其中半导体器件容纳在设置在第一树脂绝缘层中的凹部中，并且用于放置半导体器件的金属层设置在 休息。 提供了一种多层印刷电路板，其中安装的半导体器件通过通孔建立电连接。

公开(公告)号：US20120005889A1

公开(公告)日：2012-01-12

申请号：US13243112

申请日：2011-09-23

Applicant: Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

IPC: H05K3/00

CPC classification number: H01L23/48 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/00 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09827 ,  Y10T29/49124 ,  H01L2924/00

Abstract: A method for manufacturing a multilayer printed wiring board including forming a multilayer printed wiring board structure comprising first and second buildup portions, the first buildup portion including insulating layers, conductor layers and first viaholes electrically connecting the conductor layers through the insulation layers such that the first viaholes are formed in the insulating layers, respectively, the second buildup portion including insulating layers, conductor layers and second viaholes electrically connecting the conductor layers through the insulation layers such that the first viaholes are tapered toward the second viaholes, and the second via holes are tapered toward the first viaholes. The viaholes are formed by plating openings formed after lamination of respective ones of the insulating layers of the buildup portions, and each insulating layer in the buildup portions is about 100 μm or less in thickness.

Abstract translation: 一种制造多层印刷线路板的方法，包括形成包括第一和第二积累部分的多层印刷线路板结构，所述第一累积部分包括绝缘层，导体层和通过绝缘层将导体层电连接的第一通孔，使得第一 分别在绝缘层中形成通孔，第二累积部分包括绝缘层，导体层和第二通孔，其通过绝缘层电连接导体层，使得第一通孔朝向第二通孔逐渐变细，第二通孔为 朝向第一通孔逐渐变细。 通孔由层叠各积层部的绝缘层之后形成的电镀开口形成，积层部的各绝缘层的厚度为100μm以下。

公开(公告)号：US20110203837A1

公开(公告)日：2011-08-25

申请号：US12894777

申请日：2010-09-30

Applicant: Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K3/4691 ,  H05K2201/09127 ,  H05K2201/09536 ,  H05K2203/308 ,  Y10T29/49124

Abstract: A flex-rigid wiring board includes an insulative substrate, a flexible connected body positioned beside the insulative substrate and including multiple flexible wiring boards, and an insulation layer positioned over the insulative substrate and the flexible connected body and having a portion exposing a portion of the flexible connected body. The flexible wiring boards include a double-sided flexible wiring board having a conductive layer on one surface of the double-sided flexible wiring board and a conductive layer on the opposite surface of the double-sided flexible wiring board. The flexible connected body has a conductor on one side of the flexible connected body, a conductor on the opposite side of the flexible connected body, and a through-hole conductor electrically connecting the conductors of the flexible connected body. The through-hole conductor is penetrating from one side through the opposite side of the flexible wiring boards.

Abstract translation: 柔性刚性布线板包括绝缘基板，位于绝缘基板旁边的柔性连接体，并且包括多个柔性布线板，以及位于绝缘基板和柔性连接体上方的绝缘层，并且具有露出一部分 柔性连接体。 柔性布线板包括双面柔性布线板，该双面柔性布线板在双面柔性布线板的一个表面上具有导电层，在双面柔性布线板的相对表面上具有导电层。 柔性连接体在柔性连接体的一侧具有导体，在柔性连接体的相对侧上具有导体，以及电连接柔性连接体的导体的通孔导体。 通孔导体从一侧穿过柔性布线板的相对侧。

公开(公告)号：US20110199739A1

公开(公告)日：2011-08-18

申请号：US12873944

申请日：2010-09-01

Applicant: Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K3/4691 ,  H05K2201/0391 ,  H05K2201/09127 ,  H05K2201/09854 ,  H05K2203/308 ,  Y10T29/49124

Abstract: A flex-rigid wiring board including an insulative substrate having a wiring layer which is formed on the insulative substrate and includes a conductor, a flexible wiring board positioned beside the insulative substrate and having a wiring layer, the wiring layer of the flexible wiring board including a conductor and being contained inside the flexible wiring board, and a first insulation layer positioned on the insulative substrate and the flexible wiring board such that a portion of the flexible wiring board is left exposed from the first insulation layer. The first insulation layer has a wiring layer which is formed on the first insulation layer and includes a conductor. The wiring layer of the first insulation layer has a thickness which is formed thicker than a thickness of the wiring layer of the flexible wiring board and a thickness of the wiring layer of the insulative substrate.

Abstract translation: 一种柔性刚性布线板，包括具有布线层的绝缘基板，所述布线层形成在所述绝缘基板上并且包括导体，柔性布线板位于所述绝缘基板的旁边并具有布线层，所述柔性布线板的布线层包括 导体，并且被容纳在柔性布线板内部;以及第一绝缘层，其位于绝缘基板和柔性布线板上，使得柔性布线板的一部分从第一绝缘层露出。 第一绝缘层具有形成在第一绝缘层上并包括导体的布线层。 第一绝缘层的布线层的厚度比柔性布线基板的布线层的厚度和绝缘基板的布线层的厚度厚。

公开(公告)号：US20110180307A1

公开(公告)日：2011-07-28

申请号：US12914378

申请日：2010-10-28

Applicant: Nobuyuki NAGANUMA ,  Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Nobuyuki NAGANUMA ,  Michimasa Takahashi ,  Masakazu Aoyama

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K3/4691 ,  H05K2201/09527 ,  H05K2201/096

Abstract: A flex-rigid wiring board having a flexible wiring board, a first insulation layer positioned adjacent to a side of the flexible board and having a first hole which penetrates through the first layer, a second insulation layer laminated over the flexible board and the first layer and having a second hole which penetrates through the second layer, the second hole of the second layer being formed along the axis of the first hole of the first layer, a first conductor structure formed in the first hole and including a filled conductor formed by filling plating in the first hole, and a second conductor structure formed in the second hole and including a filled conductor formed by filling plating in the second hole, the second conductor structure being formed along the axis of the first conductor structure and electrically connected to the first conductor structure.

Abstract translation: 一种具有柔性布线板的挠性刚性布线板，与柔性板的一侧相邻并且具有穿过第一层的第一孔的第一绝缘层，层压在柔性板上的第二绝缘层和第一层 并且具有穿过所述第二层的第二孔，所述第二层的第二孔沿着所述第一层的第一孔的轴线形成，形成在所述第一孔中的第一导体结构，所述第一导体结构包括填充导体， 电镀在第一孔中，第二导体结构形成在第二孔中，并且包括通过在第二孔中填充电镀形成的填充导体，第二导​​体结构沿着第一导体结构的轴线形成并电连接到第一孔 导体结构。

公开(公告)号：US20110180306A1

公开(公告)日：2011-07-28

申请号：US12914064

申请日：2010-10-28

Applicant: Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

IPC: H05K1/14 ,  H05K3/10

CPC classification number: H05K3/4691 ,  H05K1/025 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4053 ,  H05K3/429 ,  H05K3/4614 ,  H05K2201/0191 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745

Abstract: A flex-rigid wiring board including a flexible wiring board, a first insulation layer positioned to a side of the flexible board and having a first hole through the first layer, a second insulation layer over the first layer and an end portion of the flexible board and with a second hole through the second layer along the axis of the first hole, a third insulation layer over the first layer and the end portion of the flexible board on the opposite side of the second layer and with a third hole through the third layer along the axis of the first hole, a first structure having a filled conductor in the first hole, a second structure having a filled conductor in the second hole along the axis of the first structure, and a third structure having a filled conductor in the third hole along the axis of the first structure.

Abstract translation: 一种挠性刚性布线板，包括柔性布线板，位于所述柔性板的一侧的第一绝缘层，并且具有穿过所述第一层的第一孔，所述第一层上的第二绝缘层和所述柔性板的端部 并且沿着第一孔的轴线穿过第二层的第二孔，在第二层的相对侧的第一层和柔性板的端部之上的第三绝缘层和穿过第三层的第三孔 沿着第一孔的轴线，具有在第一孔中的填充导体的第一结构，具有沿着第一结构的轴线的第二孔中的填充导体的第二结构，以及在第三孔中具有填充导体的第三结构 孔沿着第一结构的轴线。

公开(公告)号：US07973249B2

公开(公告)日：2011-07-05

申请号：US12713249

申请日：2010-02-26

Applicant: Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K3/421 ,  H05K1/115 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09863 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/31511

Abstract: A multilayer printed wiring board including insulating layers and conductor layers being stacked alternately on each other. The conductor layers are electrically connected to each other through viaholes formed in the insulating layers. Each of the viaholes is formed to bulge in a direction generally orthogonal to the direction of thickness of the insulating layer. The multilayer printed wiring board is to have electronic components such as a capacitor, IC and the like mounted on the surface layer thereof.

Abstract translation: 包括彼此交替堆叠的绝缘层和导体层的多层印刷线路板。 导体层通过形成在绝缘层中的通孔彼此电连接。 每个通孔形成为沿与绝缘层的厚度方向大致正交的方向凸出。 该多层印刷线路板具有安装在其表面层上的诸如电容器，IC等的电子部件。

公开(公告)号：US07957154B2

公开(公告)日：2011-06-07

申请号：US11611538

申请日：2006-12-15

Applicant: Sotaro Ito ,  Michimasa Takahashi ,  Yukinobu Mikado

Inventor： Sotaro Ito ,  Michimasa Takahashi ,  Yukinobu Mikado

IPC: H05K1/16

CPC classification number: H05K1/0218 ,  H01L23/49822 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/2402 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/1517 ,  H01L2924/15331 ,  H01L2924/15788 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/183 ,  H05K1/185 ,  H05K3/4652 ,  H05K2201/09981 ,  H05K2203/0733 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A multilayer printed circuit board, wherein, on a resin-insulating layer that houses a semiconductor element, another resin-insulating layer and a conductor circuit are formed with conductor circuits electrically connected through a via hole, wherein a electromagnetic shielding layer is formed on a resin-insulating layer surrounding a concave portion for housing a semiconductor element or on the inner wall surface of the concave portion, and the semiconductor element is embedded in the concave portion.

Abstract translation: 一种多层印刷电路板，其中，在容纳半导体元件的树脂绝缘层，另一树脂绝缘层和导体电路上形成有通过通孔电连接的导体电路，其中电磁屏蔽层形成在 环绕用于容纳半导体元件的凹部或凹部的内壁面的树脂绝缘层，并且半导体元件嵌入在凹部中。