公开(公告)号：US5145851A

公开(公告)日：1992-09-08

申请号：US780405

申请日：1991-10-17

申请人： Masayuki Ishikawa ,  Hiroshi Azuma ,  Shigeru Ito ,  Tomohiro Yamaguchi

发明人： Masayuki Ishikawa ,  Hiroshi Azuma ,  Shigeru Ito ,  Tomohiro Yamaguchi

IPC分类号： C07D239/54 ,  A61K31/495 ,  A61K31/505 ,  A61K31/52 ,  A61P13/02 ,  A61P15/00

CPC分类号： A61K31/505

摘要： 6-[[3-[4-(2-Methoxyphenyl)-1-piperazinyl)propyl]-amino]-1,3-dimethyluracil can be used as a therapeutic agent for urinary obstruction.

摘要翻译： 6 - [[3- [4-（2-甲氧基苯基）-1-哌嗪基）丙基] - 氨基] -1,3-二甲基丙烯酰胺可用作尿路梗阻的治疗剂。

公开(公告)号：US4975607A

公开(公告)日：1990-12-04

申请号：US376847

申请日：1989-07-07

申请人： Masayoshi Hara ,  Shinichi Niwa ,  Masayuki Ishikawa ,  Yukio Okada

发明人： Masayoshi Hara ,  Shinichi Niwa ,  Masayuki Ishikawa ,  Yukio Okada

IPC分类号： G01P3/48 ,  G01P3/487 ,  G02B26/12 ,  G11B15/473 ,  H02K3/26 ,  H02K7/20 ,  H02K29/14

CPC分类号： H02K7/20 ,  G01P3/48 ,  G01P3/487 ,  G02B26/121 ,  G11B15/4731 ,  H02K29/14 ,  H02K3/26 ,  Y10S310/06 ,  Y10T29/49155

摘要： A frequency generator includes a circuit board having one surface on which a generating coil pattern and a wiring pattern are printed in stacked relationship via an insulating layer. In a preferred embodiment, the coil is pointed over the wiring pattern.

摘要翻译： 频率发生器包括电路板，该电路板具有经由绝缘层以堆叠关系印刷发生线圈图案和布线图案的一个表面。 在优选实施例中，线圈指向布线图案。

公开(公告)号：US4922499A

公开(公告)日：1990-05-01

申请号：US307927

申请日：1989-02-09

申请人： Koichi Nitta ,  Yukie Nishikawa ,  Masayuki Ishikawa ,  Yasuhiko Tsuburai ,  Yoshihiro Kokubun

发明人： Koichi Nitta ,  Yukie Nishikawa ,  Masayuki Ishikawa ,  Yasuhiko Tsuburai ,  Yoshihiro Kokubun

IPC分类号： H01L33/00 ,  H01S5/20 ,  H01S5/223 ,  H01S5/32 ,  H01S5/323

CPC分类号： H01L33/0062 ,  H01S5/20 ,  H01S5/2231 ,  H01S5/2059 ,  H01S5/321 ,  H01S5/32325 ,  Y10S148/095 ,  Y10S148/157

摘要： A gain waveguide type semiconductor laser oscillating visible light has an N type GaAs substrate of, and a double-heterostructure provided above the substrate to include an InGap active layer, and first and second cladding layers sandwiching the active layer. The first cladding layer consists of N type InGaAlP, whereas the second cladding layer consists of P type InGaAlP. A P type InGaP layer is formed as an intermediate band-gap layer on the second cladding layer. An N type GaAs current-blocking layer is formed on the intermediate band-gap layer, and has an elongated waveguide opening. A P type GaAs contact layer is formed to cover the current-blocking layer and the opening. The intermediate band-gap layer has a carrier concentration, in a layer portion being in contact with the opening, high enough to cause a current injected in the oscillation mode to concentrate on the layer portion and has a carrier density, in the remaining layer portion, low enough to suppress or prevent the injected current from spreading thereinto. The layer portion may be formed by additionally doping a selected impurity into the intermediate gap layer by using a presently available impurity diffusion/injection technique.

公开(公告)号：US09184357B2

公开(公告)日：2015-11-10

申请号：US13310384

申请日：2011-12-02

申请人： Yoshiaki Sugizaki ,  Hideki Shibata ,  Masayuki Ishikawa ,  Hideo Tamura ,  Tetsuro Komatsu ,  Akihiro Kojima

发明人： Yoshiaki Sugizaki ,  Hideki Shibata ,  Masayuki Ishikawa ,  Hideo Tamura ,  Tetsuro Komatsu ,  Akihiro Kojima

IPC分类号： H01L33/00 ,  H01L33/44 ,  H01L33/38 ,  H01L33/62 ,  H01L23/00 ,  H01L25/075 ,  H01L33/34 ,  H01L33/48 ,  H01L33/58

CPC分类号： H01L33/62 ,  H01L24/02 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/34 ,  H01L33/38 ,  H01L33/44 ,  H01L33/486 ,  H01L33/50 ,  H01L33/58 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/05012 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05571 ,  H01L2224/06132 ,  H01L2224/06152 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0066 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for manufacturing a light emitting device includes forming a multilayer body including a light emitting layer so that a first surface thereof is adjacent to a first surface side of a translucent substrate. A dielectric film on a second surface side opposite to the first surface of the multilayer body is formed having first and second openings on a p-side electrode and an n-side electrode. A seed metal on the dielectric film and an exposed surface of the first and second openings form a p-side metal interconnect layer and an n-side metal interconnect layer separating the seed metal into a p-side seed metal and an n-side seed metal by removing a part of the seed metal. A resin is formed in a space from which the seed metal is removed.

摘要翻译： 一种制造发光器件的方法包括：形成包括发光层的多层体，使得其第一表面与透光性基板的第一表面侧相邻。 在与p层电极和n侧电极之间形成有第一和第二开口的与多层体的第一表面相对的第二表面侧上的电介质膜形成。 电介质膜上的种子金属和第一和第二开口的暴露表面形成将种子金属分离成p侧金属和n侧籽晶的p侧金属互连层和n侧金属互连层 金属，通过去除一部分种子金属。 在除去种子金属的空间中形成树脂。

公开(公告)号：US08721961B2

公开(公告)日：2014-05-13

申请号：US12094167

申请日：2005-11-29

申请人： Masayuki Ishikawa ,  Masayoshi Kohinata ,  Akifumi Mishima

发明人： Masayuki Ishikawa ,  Masayoshi Kohinata ,  Akifumi Mishima

IPC分类号： C22C5/02

CPC分类号： C22C5/02 ,  B23K35/3013 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/1131 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2224/0401

摘要： An Au—Sn alloy bump that does not include large voids and a method of producing the same are provided. The Au—Sn alloy bump that does not include large voids comprises a composition containing Sn: 20.5 to 23.5 mass % and the balance Au and unavoidable impurities, and a structure where 0.5 to 30 area % of Sn-rich primary crystal phase is crystallized in the matrix.

摘要翻译： 提供不包括大空隙的Au-Sn合金凸块及其制造方法。 不包含大空隙的Au-Sn合金凸块包括含有Sn：20.5〜23.5质量％，余量为Au和不可避免的杂质的组合物，以及富含Sn的一次结晶相的0.5〜30面积％结晶化的结构 矩阵。

公开(公告)号：US20120097972A1

公开(公告)日：2012-04-26

申请号：US13310384

申请日：2011-12-02

申请人： Yoshiaki SUGIZAKI ,  Hideki Shibata ,  Masayuki Ishikawa ,  Hideo Tamura ,  Tetsuro Komatsu ,  Akihiro Kojima

发明人： Yoshiaki SUGIZAKI ,  Hideki Shibata ,  Masayuki Ishikawa ,  Hideo Tamura ,  Tetsuro Komatsu ,  Akihiro Kojima

IPC分类号： H01L33/50 ,  H01L33/30

CPC分类号： H01L33/62 ,  H01L24/02 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/34 ,  H01L33/38 ,  H01L33/44 ,  H01L33/486 ,  H01L33/50 ,  H01L33/58 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/05012 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05571 ,  H01L2224/06132 ,  H01L2224/06152 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0066 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for manufacturing a light emitting device includes forming a multilayer body including a light emitting layer so that a first surface thereof is adjacent to a first surface side of a translucent substrate. A dielectric film on a second surface side opposite to the first surface of the multilayer body is formed having first and second openings on a p-side electrode and an n-side electrode. A seed metal on the dielectric film and an exposed surface of the first and second openings form a p-side metal interconnect layer and an n-side metal interconnect layer separating the seed metal into a p-side seed metal and an n-side seed metal by removing a part of the seed metal. A resin is formed in a space from which the seed metal is removed.

摘要翻译： 一种制造发光器件的方法包括：形成包括发光层的多层体，使得其第一表面与透光性基板的第一表面侧相邻。 在与p层电极和n侧电极之间形成有第一和第二开口的与多层体的第一表面相对的第二表面侧上的电介质膜形成。 电介质膜上的种子金属和第一和第二开口的暴露表面形成将种子金属分离成p侧金属和n侧籽晶的p侧金属互连层和n侧金属互连层 金属，通过去除一部分种子金属。 在除去种子金属的空间中形成树脂。

公开(公告)号：US20110291149A1

公开(公告)日：2011-12-01

申请号：US12885721

申请日：2010-09-20

申请人： Yoshiaki Sugizaki ,  Hideki Shibata ,  Akihiro Kojima ,  Masayuki Ishikawa ,  Hideo Tamura ,  Tetsuro Komatsu

发明人： Yoshiaki Sugizaki ,  Hideki Shibata ,  Akihiro Kojima ,  Masayuki Ishikawa ,  Hideo Tamura ,  Tetsuro Komatsu

IPC分类号： H01L33/48

CPC分类号： H01L33/647 ,  H01L27/153 ,  H01L33/62 ,  H01L2224/16 ,  H01L2933/0066

摘要： According to one embodiment, a light emitting device includes a light emitting chip, an external terminal made of a metal material, and a circuit board. The light emitting chip is mounted on the circuit board via the external terminal. The light emitting chip includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnection layer, a second interconnection layer, a first metal pillar, a second metal pillar and a resin layer. The circuit board includes an interconnection bonded to the first metal pillar and the second metal pillar via the external terminal, and a heat radiation material provided on an opposite side of the interconnection and connected to the interconnection.

摘要翻译： 根据一个实施例，发光器件包括发光芯片，由金属材料制成的外部端子和电路板。 发光芯片通过外部端子安装在电路板上。 发光芯片包括半导体层，第一电极，第二电极，绝缘层，第一互连层，第二互连层，第一金属柱，第二金属柱和树脂层。 电路板包括经由外部端子与第一金属柱和第二金属柱接合的互连以及设置在互连的相对侧并连接到互连的散热材料。

公开(公告)号：US08063308B2

公开(公告)日：2011-11-22

申请号：US11659816

申请日：2005-10-18

申请人： Tsunenori Morioka ,  Hiroshi Hayami ,  Masayuki Ishikawa ,  Seie Kobayashi

发明人： Tsunenori Morioka ,  Hiroshi Hayami ,  Masayuki Ishikawa ,  Seie Kobayashi

IPC分类号： H01B3/46

CPC分类号： H01B3/441 ,  C08K3/22 ,  C08L23/0853 ,  C08L23/0869 ,  C08L2203/202 ,  C08L2312/00 ,  H01B7/295

摘要： Provided are a halogen-free electric wire including an insulation coating the life of which is less reduced in the case of the insulating coating being in contact with a PVC-resin-containing member; a wire bundle including the halogen-free electric wire and a PVC-resin-containing member, wherein a reduction in the life of a covering material of the halogen-free electric wire is lessened; and an automotive wiring harness comprising the wire bundle. The halogen-free electric wire includes a conductor and a covering material that covers the outer surface of the conductor, wherein the covering material includes a polyolefin resin and a flame retardant, and the flame retardant contains aluminum hydroxide as a main component, in particular, at a ratio of 80 weight percent or more. The wire bundle includes the halogen-free electric wires and a member containing a vinyl chloride resin. The automotive wiring harness comprises the wire bundle.

摘要翻译： 提供一种无卤电线，其包括绝缘涂层，其绝缘涂层与含PVC树脂的构件接触的情况下，其寿命较少; 包含无卤素电线的线束和含有PVC树脂的构件，其中减少了无卤电线的覆盖材料的使用寿命; 以及包括线束的汽车线束。 无卤电线包括导体和覆盖导体外表面的覆盖材料，其中覆盖材料包括聚烯烃树脂和阻燃剂，阻燃剂包含氢氧化铝作为主要成分，特别地， 比例为80重量％以上。 线束包括无卤电线和含氯乙烯树脂的部件。 汽车线束包括线束。

公开(公告)号：US20110281780A1

公开(公告)日：2011-11-17

申请号：US13188423

申请日：2011-07-21

申请人： Yoshihiko Ooeda ,  Masayuki Ishikawa

发明人： Yoshihiko Ooeda ,  Masayuki Ishikawa

IPC分类号： C10M169/04

CPC分类号： G11B5/725 ,  G11B5/82

摘要： A lubricant according to one embodiment includes a first ingredient and a second ingredient, said first ingredient as the main constituent being a first perfluoropolyether compound represented by the formula (1) which has a weight-average molecular weight of 500 to 6000 and a dispersity smaller than 1.3, and said second ingredient being a second perfluoropolyether compound which has a weight-average molecular weight of 500 to 6000 and has 6 to 10 hydroxyl groups (on average) in one molecule, Rt-Rf1-Rt   (1) where, Rf1 denotes a perfluoropolyether chain represented by the formula (2) and Rt denotes a terminal group represented by the formula (3), —CF2O—[(CF2CF2O)m—(CF2O)n]—CF2—  (2) where, m and n each denote a natural number,

摘要翻译： 根据一个实施方案的润滑剂包括第一成分和第二成分，所述第一成分作为主要成分是由式（1）表示的第一全氟聚醚化合物，其重均分子量为500至6000，分散度较小 并且所述第二成分是第二全氟聚醚化合物，其重均分子量为500-6000，并且在一个分子中具有6至10个羟基（平均）），Rt-Rf1-Rt（1）其中Rf1 表示由式（2）表示的全氟聚醚链，并且Rt表示由式（3）表示的端基，-CF 2 O - [（CF 2 CF 2 O）m - （CF 2 O）n] -CF 2 - （2）其中m和n 每个表示自然数，

公开(公告)号：US20110067911A1

公开(公告)日：2011-03-24

申请号：US12736986

申请日：2009-06-12

申请人： Masayuki Ishikawa ,  Sho Nakagawa

发明人： Masayuki Ishikawa ,  Sho Nakagawa

IPC分类号： H05K1/11 ,  B23K31/02 ,  B32B15/00

CPC分类号： B23K1/0008 ,  B23K35/007 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/24 ,  B23K35/262 ,  B23K35/268 ,  B23K35/3013 ,  B23K2101/36 ,  B23K2103/52 ,  C22C5/02 ,  C22C11/06 ,  C22C13/00 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29144 ,  H01L2224/29298 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/83143 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2224/95085 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/15787 ,  H05K1/111 ,  H05K3/341 ,  H05K2201/09381 ,  H05K2201/09427 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T428/12486 ,  Y10T428/24777 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： In this method of bonding a part to a substrate using a solder paste, the solder paste is mounted or applied between a metallization layer formed on the substrate and a metallization layer formed on the part, and the part is bonded to the substrate by performing a reflow process in a non-oxidizing atmosphere to bond the substrate and the part. The metallization layer formed on the surface of the substrate is planar and includes a metallization layer main portion that has an area smaller than that of the metallization layer of the part and a solder guide portion that protrudes from a periphery of the metallization layer main portion.

摘要翻译： 在使用焊膏将部件接合到基板的方法中，将焊膏安装或施加在形成在基板上的金属化层和形成在该部件上的金属化层之间，并且通过执行 在非氧化性气氛中进行回流处理以将基板和部件结合。 形成在基板表面上的金属化层是平面的，并且包括具有小于该部分的金属化层的面积的金属化层主体部分和从金属化层主体部分的周边突出的焊料引导部分。