Microwave plasma applicator with improved power uniformity

    公开(公告)号:US09653266B2

    公开(公告)日:2017-05-16

    申请号:US14645837

    申请日:2015-03-12

    Abstract: An apparatus for generating plasma includes a plasma discharge tube and a conductive coil helically wound around an outer surface of the plasma discharge tube. A waveguide is coupled to a microwave cavity surrounding the plasma discharge tube to guide the microwave energy into the plasma discharge tube such that the plasma is generated in the plasma discharge tube. The waveguide is positioned such that an electric field of the microwave energy is oriented at a predetermined angle with respect to the longitudinal axis of the plasma discharge tube. A resulting induced electric current in the conductive coil affects power absorption in the plasma discharge tube, the predetermined angle being selectable such that power absorption in the plasma discharge tube is according to a predetermined profile with respect to the longitudinal axis of the plasma discharge tube.

    PLASMA PROCESSING APPARATUS
    87.
    发明申请

    公开(公告)号:US20170103874A1

    公开(公告)日:2017-04-13

    申请号:US15285587

    申请日:2016-10-05

    Abstract: Detection accuracy of a power of a progressive wave and detection accuracy of a power of a reflection wave can be improved. In a plasma processing apparatus, a first directional coupler is provided in a first waveguide which is configured to connect a microwave generating unit and a first port of a circulator. A first detector is connected to the first directional coupler. A second port of the circulator is connected to a plasma generating unit via a second waveguide. Further, a second directional coupler is provided in a third waveguide which is configured to connect a third port of the circulator and a dummy load. A second detector is connected to the second directional coupler.

    Methods and systems for plasma deposition and treatment
    88.
    发明授权
    Methods and systems for plasma deposition and treatment 有权
    用于等离子体沉积和处理的方法和系统

    公开(公告)号:US09520271B2

    公开(公告)日:2016-12-13

    申请号:US14341362

    申请日:2014-07-25

    Abstract: An apparatus for separating ions having different mass or charge includes a waveguide conduit coupled to a microwave source for transmitting microwaves through openings in the waveguide conduit. The outlet ends of pipes are positioned at the openings for transporting material from a material source to the openings. A plasma chamber is in communication with the waveguide tube through the openings. The plasma chamber receives through the openings microwaves from the waveguide tube and material from the pipes. The plasma chamber includes magnets disposed in an outer wall thereof for forming a magnetic field in the plasma chamber. The plasma chamber includes a charged cover at a side of the chamber opposite the side containing the openings. The cover includes extraction holes through which ion beams from the plasma chamber are extracted. Deflectors coupled to one of the extraction holes receive the ion beams extracted from the plasma chamber. Each deflector bends an ion beam and provides separate passages for capturing ions following different trajectories from the bending of the ion beam based on their respective mass or charge.

    Abstract translation: 用于分离具有不同质量或电荷的离子的装置包括耦合到微波源的波导导管,用于通过波导管道中的开口传输微波。 管道的出口端位于用于将材料从材料源运输到开口的开口处。 等离子体室通过开口与波导管连通。 等离子体腔室通过开口接收来自波导管的微波和来自管道的材料。 等离子体室包括设置在其外壁中的磁体,用于在等离子体室中形成磁场。 等离子体室包括在室的与包含开口的一侧相对的一侧的带电盖。 盖子包括提取来自等离子体室的离子束的抽吸孔。 与一个提取孔耦合的偏转器接收从等离子体室提取的离子束。 每个偏转器弯曲离子束,并提供单独的通道,用于根据其相应的质量或电荷离开离子束弯曲的不同轨迹之后捕获离子。

    DRY ETCHING METHOD
    90.
    发明申请
    DRY ETCHING METHOD 审中-公开
    干蚀刻方法

    公开(公告)号:US20150099368A1

    公开(公告)日:2015-04-09

    申请号:US14447681

    申请日:2014-07-31

    Abstract: In a dry etching method for isotropically etching each of SiGe layers selectively relative to each of Si layers in a laminated film composed of the Si layers and SiGe layers alternately and repeatedly laminated, the each of the SiGe layers is plasma-etched with pulse-modulated plasma using NF3 gas.

    Abstract translation: 在由Si层和SiGe层组成的层叠膜中,相对于Si层中的每一个Si层选择性地各向同性蚀刻每个SiGe层的干蚀刻方法中,每个SiGe层被等离子体蚀刻 使用NF3气体的等离子体。

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