Abstract:
A computer-implemented process for controlling a vehicle interior includes detecting a previously defined situation that relates to an undesirable environmental condition of the vehicle interior, and assessing both a risk level and an urgency level, based on a vehicle sensor input. The process also includes generating a vehicle command based upon the detected previously defined situation, the assessed risk level, and assessed urgency level, and executing the generated vehicle command to control at least one of an engine, a window, and a heating, ventilation and air conditioning (HVAC) unit to modify an environmental condition of the vehicle interior.
Abstract:
A computer-implemented process for controlling a vehicle interior includes detecting a previously defined situation that relates to an undesirable environmental condition of the vehicle interior, and assessing both a risk level and an urgency level, based on a vehicle sensor input. The process also includes generating a vehicle command based upon the detected previously defined situation, the assessed risk level, and assessed urgency level, and executing the generated vehicle command to control at least one of an engine, a window, and a heating, ventilation and air conditioning (HVAC) unit to modify an environmental condition of the vehicle interior.
Abstract:
The main structure of the present invention comprises: a carrying-frame set with a cargo-carrying structure, direction-guiding wheels, and a connection component comprising a sleeving-connection element and a quick-dismantling component; wherein the connection component is provided for connecting a power-providing frame set with an adjustment component comprising an assembly-connection element and a connection portion, and a steering component is set at the side of the connection component. Thereby, the user can adjust the distance between the carrying-frame and the power-providing frame to achieve the advantage of saving the accommodation space through the steering component.
Abstract:
The string light contains three copper wires and a number of lighting units and each lighting unit contains at least two surface-mount-device (SMD) light emitting diodes (LEDs). A first wire and a second wire are connected to a positive terminal and a negative terminal of a power source, respectively. Within each lighting unit, a first SMD LED has its anode connected to the first wire, a second SMD LED has its cathode connected to the second wire, and the first and second SMD LEDs have their cathode and anode connected to a third wire, respectively. The string light is capable of withstanding stronger pull by employing three wires. The parallel-connected lighting units and the series-connected SMD LEDs within each lighting unit significantly reduce the effect of voltage drop.
Abstract:
A method and system for canonical channel estimation in the Long Term Evolution uplink where a multi-frequency signal is generated and then converted to frequency spectrum which is then convolved in the frequency domain with a truncated window function to obtain a time domain channel impulse response. The time domain channel impulse response can be then transformed to a frequency domain to produce a down sampled user channel response, which can be then linearly interpolated to provide a channel estimate for a plurality of subcarriers. Such an approach achieves channel estimation within Long Term Evolution at only canonical locations to reduce complexity without loss in channel entropy.
Abstract:
The substrate with through silicon plugs (or vias) described above removes the need for conductive bumps. The process flow is very simple and cost efficient. The structures described combines the separate TSV, redistribution layer, and conductive bump structures into a single structure. By combining the separate structures, a low resistance electrical connection with high heat dissipation capability is created. In addition, the substrate with through silicon plugs (or vias, or trenches) also allows multiple chips to be packaged together. A through silicon trench can surround the one or more chips to provide protection against copper diffusing to neighboring devices during manufacturing. In addition, multiple chips with similar or different functions can be integrated on the TSV substrate. Through silicon plugs with different patterns can be used under a semiconductor chip(s) to improve heat dissipation and to resolve manufacturing concerns.
Abstract:
A method of applying an order N fast Hadamard transform (FHT) of a vector U using a mixed radix FHT in a receiver of a communication system, the N a positive integer, when receiving signals from a transmitter over a channel and generating the vector U. The method includes, in an FHT module of a decoder in the receiver, planning n stages of the mixed radix FHT, where the n is a positive integer, each stage defined by corresponding logic, decomposing the order N FHT into n low order FHTs, such that N=KnKn−1 . . . K1 and U=UKnKn−1 . . . K1, where the K is a positive integer, calculating, via the corresponding logic, each low order FHT at each stage, wherein input vectors of a subsequent stage are calculated in a proceeding stage, and reconstructing, by the decoder, calculated results of the each low order FHT to form an output vector output the decoder.
Abstract:
A light emitting diodes (LEDs) is presented. The LED includes a stress-alleviation layer on a substrate. Open regions and stress-alleviation layer regions are formed on the substrate. Epitaxial layers are disposed on the substrate, at least in the open regions therein, thereby forming an LED structure. The substrate is diced through at least a first portion of the stress-alleviation regions, thereby forming the plurality of LEDs.