公开(公告)号：USD673252S1

公开(公告)日：2012-12-25

申请号：US29413314

申请日：2012-02-14

Applicant: Matthew Abbondanzio ,  George Kyaw Maung Aye ,  Andrew Michael Brooks ,  Jeffrey Allan Gershune ,  Joseph Thomas Graceffa ,  Maria Dora Lalli ,  David Brian Seal

Designer： Matthew Abbondanzio ,  George Kyaw Maung Aye ,  Andrew Michael Brooks ,  Jeffrey Allan Gershune ,  Joseph Thomas Graceffa ,  Maria Dora Lalli ,  David Brian Seal

公开(公告)号：US20120084180A1

公开(公告)日：2012-04-05

申请号：US12896775

申请日：2010-10-01

Applicant: Catherine D. Dowdell ,  Michael M. Sawalski ,  John R. Weaver ,  Thomas A. Helf ,  Marissa A.K. Schultz ,  James R. Crapser ,  Sara Cantor Aye ,  Mark King ,  Andrew Michael Brooks ,  Kristina J. Genslak ,  Felicia E. Zusman

Inventor： Catherine D. Dowdell ,  Michael M. Sawalski ,  John R. Weaver ,  Thomas A. Helf ,  Marissa A.K. Schultz ,  James R. Crapser ,  Sara Cantor Aye ,  Mark King ,  Andrew Michael Brooks ,  Kristina J. Genslak ,  Felicia E. Zusman

IPC: G09B19/00 ,  G06Q30/00

CPC classification number: G06Q30/00 ,  G06Q30/0641 ,  G09B19/00

Abstract: A personal growth system and method for personal growth are provided. The personal growth system may be web-enabled and may include a communication interface operable to communicate with an endpoint user interface. The user interface generally includes a display area. The personal growth program is operable to generate, for a user in the display area, a first information request for the user and to obtain first user input relating to the user's current state of being. The personal growth system also may include a recommendation database defining guided experiences, each of which may include at least one instruction that leads the user through the guided experience. The personal growth system may communicate applicable guided experiences to the endpoint based on the first user input. The instructions of the guided experiences may specify an act intended to generate a result. The personal growth program may be further operable to generate, for the user in the display area, a second information request and to obtain second user input relating to the result. An account database in the personal growth system stores a growth interaction history of the user, which may include the first user input, the selected guided experience, and the second user input relating to the result of the selected guided experience.

Abstract translation: 提供个人成长系统和个人成长方法。 个人成长系统可以是网络启用的，并且可以包括可操作以与端点用户界面通信的通信接口。 用户界面通常包括显示区域。 个人成长程序可操作地为显示区域中的用户生成针对用户的第一信息请求并且获得与用户的当前状态有关的第一用户输入。 个人成长系统还可以包括定义指导经验的推荐数据库，每个引导体验可以包括引导用户通过指导经验的至少一个指令。 个人成长系统可以基于第一用户输入将适用的导向经验传达到端点。 指导经验的指示可以指定旨在产生结果的行为。 个人成长程序可以进一步可操作以为显示区域中的用户生成第二信息请求并获得与结果相关的第二用户输入。 个人成长系统中的帐户数据库存储用户的增长交互历史，其可以包括第一用户输入，所选择的引导体验和与所选择的引导体验的结果相关的第二用户输入。

公开(公告)号：US20110233740A1

公开(公告)日：2011-09-29

申请号：US13155203

申请日：2011-06-07

Applicant: Matt E. Schwab ,  J. Michael Brooks ,  David J. Corisis

Inventor： Matt E. Schwab ,  J. Michael Brooks ,  David J. Corisis

IPC: H01L23/495 ,  H01L21/58 ,  H01L21/60 ,  H01L23/488

CPC classification number: H01L24/03 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/09 ,  H01L24/17 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/11011 ,  H01L2224/13111 ,  H01L2224/1405 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/85 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a method for forming a microelectronic device includes attaching a microelectronic die to a support member by forming an attachment feature on at least one of a back side of the microelectronic die and the support member. The attachment feature includes a volume of solder material. The method also includes contacting the attachment feature with the other of the microelectronic die and the support member, and reflowing the solder material to join the back side of the die and the support member via the attachment feature. In several embodiments, the attachment feature is not electrically connected to internal active structures of the die.

Abstract translation: 公开了用于制造封装的微电子器件的封装的微电子器件和方法。 在一个实施例中，用于形成微电子器件的方法包括通过在微电子管芯的背面和支撑构件的至少一个上形成附着特征来将微电子管芯附接到支撑构件。 附件特征包括一定量的焊料。 该方法还包括使附接特征与另一个微电子管芯和支撑构件接触，以及回流焊料材料以经由附接特征连接到管芯的背面和支撑构件。 在几个实施例中，附接特征不与管芯的内部有源结构电连接。

公开(公告)号：US07910385B2

公开(公告)日：2011-03-22

申请号：US11433015

申请日：2006-05-12

Applicant: Young Do Kweon ,  J. Michael Brooks ,  Tongbi Jiang

Inventor： Young Do Kweon ,  J. Michael Brooks ,  Tongbi Jiang

IPC: H01L23/58 ,  H01L21/66

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L22/20 ,  H01L23/3135 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/48 ,  H01L24/73 ,  H01L24/96 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Microelectronic devices and methods for manufacturing microelectronic devices are described herein. An embodiment of one such method includes attaching a plurality of singulated microelectronic dies to a removable support member with an active side of the individual dies facing toward the support member, depositing a flowable material onto the dies and a portion of the removable support member such that the flowable material covers a back side of the individual dies and is disposed between adjacent dies, and removing the support member from the active sides of the dies.

Abstract translation: 本文描述了用于制造微电子器件的微电子器件和方法。 一种这样的方法的实施例包括将多个单独的微电子管芯附接到可移除的支撑构件，其中各个模具的活动侧面向支撑构件，将可流动材料沉积到模具上以及可移除支撑构件的一部分，使得 可流动材料覆盖各个模具的背面并且设置在相邻模具之间，并且从模具的活动侧移除支撑构件。

公开(公告)号：US20100255636A1

公开(公告)日：2010-10-07

申请号：US12816480

申请日：2010-06-16

Applicant: Matt E. Schwab ,  J. Michael Brooks ,  David J. Corisis

Inventor： Matt E. Schwab ,  J. Michael Brooks ,  David J. Corisis

IPC: H01L21/60 ,  H01L21/78 ,  H01L21/56

CPC classification number: H01L23/3128 ,  H01L23/16 ,  H01L23/36 ,  H01L23/4924 ,  H01L24/06 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/16788 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.

Abstract translation: 公开了具有基本刚性支撑构件的封装半导体部件。 封装可以包括半导体管芯和靠近半导体管芯的支撑构件。 支撑构件至少基本上是刚性的。 包装件还可以包括在支撑构件和半导体管芯之间的粘合剂，并且将支撑构件粘合地附接到半导体管芯。 封装还可以包括承载半导体管芯的衬底和附接到半导体管芯的支撑构件。

公开(公告)号：US07720054B2

公开(公告)日：2010-05-18

申请号：US10790204

申请日：2004-03-02

Applicant: Donnie Van Savage ,  Donald Earl Slice, Jr. ,  Roy Michael Brooks ,  Matthew Henry Birkner

Inventor： Donnie Van Savage ,  Donald Earl Slice, Jr. ,  Roy Michael Brooks ,  Matthew Henry Birkner

IPC: H04L12/28 ,  H04L12/26

CPC classification number: H04L45/28 ,  H04L43/00 ,  H04L45/02 ,  H04L45/12 ,  H04L45/124 ,  H04L45/125 ,  H04L45/18 ,  H04L45/22 ,  H04L45/245 ,  Y02D50/30

Abstract: A first router is configured for monitoring prescribed attributes of an active path connected to the first router, and supplying an update message to a second router, according to a prescribed routing protocol such as Enhanced Interior Gateway Routing Protocol (EIGRP), that specifies a detected change by the first router in at least one of the prescribed attributes of the connected active path. Hence, the second router, in response to receiving the update message, can update an internal topology table based on the detected change in the active path connected to the first router, and selectively adjust an internal routing table based on the detected change relative to queuing policies for prescribed data flows.

Abstract translation: 第一路由器被配置为用于监视连接到第一路由器的活动路径的规定属性，并且根据规定的路由协议（诸如增强型内部网关路由协议（EIGRP））向第二路由器提供更新消息，其指定检测到的 由连接的主动路径的规定属性中的至少一个更改第一路由器。 因此，第二路由器响应于接收到更新消息，可以基于检测到的连接到第一路由器的活动路径的变化来更新内部拓扑表，并且基于检测到的相对于排队的改变来选择性地调整内部路由表 规定数据流的政策。

公开(公告)号：US07655500B2

公开(公告)日：2010-02-02

申请号：US12028211

申请日：2008-02-08

Applicant: Tongbi Jiang ,  J. Michael Brooks

Inventor： Tongbi Jiang ,  J. Michael Brooks

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L24/19 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/83

Abstract: Packaged microelectronic devices and methods for packaging microelectronic devices are disclosed herein. In one embodiment, a method of packaging a microelectronic device including a microelectronic die having a first side with a plurality of bond-pads and a second side opposite the first side includes forming a recess in a substrate, placing the microelectronic die in the recess formed in the substrate with the second side facing toward the substrate, and covering the first side of the microelectronic die with a dielectric layer after placing the microelectronic die in the recess. The substrate can include a thermal conductive substrate, such as a substrate comprised of copper and/or aluminum. The substrate can have a coefficient of thermal expansion at least approximately equal to the coefficient of thermal expansion of the microelectronic die or a printed circuit board.

Abstract translation: 封装的微电子器件和用于封装微电子器件的方法在本文中公开。 在一个实施例中，包括微电子器件的方法包括具有多个接合焊盘的第一侧的微电子管芯和与第一侧相对的第二侧的微电子器件包括在衬底中形成凹槽，将微电子管芯置于形成的凹部中 在具有第二面朝向衬底的衬底中，并且在将微电子管芯放置在凹槽中之后用介电层覆盖微电子管芯的第一侧。 衬底可以包括导热衬底，例如由铜和/或铝构成的衬底。 衬底可以具有至少近似等于微电子管芯或印刷电路板的热膨胀系数的热膨胀系数。

公开(公告)号：US20080224298A1

公开(公告)日：2008-09-18

申请号：US11742297

申请日：2007-04-30

Applicant: David J. Corisis ,  J. Michael Brooks ,  Choon Kuan Lee ,  Chin Hui Chong

Inventor： David J. Corisis ,  J. Michael Brooks ,  Choon Kuan Lee ,  Chin Hui Chong

IPC: H01L23/48 ,  B23P19/00 ,  H01L21/00

CPC classification number: H01L23/5389 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1627 ,  H01L2924/181 ,  Y10T29/53183 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Packaged semiconductor components, apparatus for packaging semiconductor devices, methods of packaging semiconductor devices, and methods of manufacturing apparatus for packaging semiconductor devices. One embodiment of an apparatus for packaging semiconductor devices comprises a first board having a front side, a backside, arrays of die contacts, arrays of first backside terminals electrically coupled to the die contacts, arrays of second backside terminals, and a plurality of individual package areas that have an array of the die contacts, an array of the first backside terminals, and an array of the second backside terminals. The apparatus further includes a second board having a first side laminated to the front side of the first board, a second side, openings through the second board aligned with individual package areas that define die cavities, and arrays of front contacts at the second side electrically coupled to the second backside terminals by interconnects extending through the first board and the second board.

Abstract translation: 封装半导体部件，半导体装置的封装装置，半导体装置的封装方法以及半导体装置的封装装置的制造方法。 用于封装半导体器件的装置的一个实施例包括具有正面，背面，芯片触点阵列，电耦合到裸片触点的第一背面端子阵列，第二背面端子阵列和多个单独封装的第一板 具有芯片触点阵列的区域，第一背面端子的阵列和第二背面端子的阵列。 所述设备还包括第二板，其具有层压到所述第一板的前侧的第一侧，第二侧，穿过所述第二板的开口，所述第二板与限定模腔的各个封装区域对准，并且在所述第二侧上的前触点阵列电 通过延伸穿过第一板和第二板的互连件耦合到第二背面端子。

公开(公告)号：US20080224291A1

公开(公告)日：2008-09-18

申请号：US11685502

申请日：2007-03-13

Applicant: Matt E. Schwab ,  J. Michael Brooks ,  David J. Corisis

Inventor： Matt E. Schwab ,  J. Michael Brooks ,  David J. Corisis

IPC: H01L23/02 ,  H01L21/00

CPC classification number: H01L23/3128 ,  H01L23/16 ,  H01L23/36 ,  H01L23/4924 ,  H01L24/06 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/16788 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.

Abstract translation: 公开了具有基本刚性支撑构件的封装半导体部件。 封装可以包括半导体管芯和靠近半导体管芯的支撑构件。 支撑构件至少基本上是刚性的。 包装件还可以包括在支撑构件和半导体管芯之间的粘合剂，并且将支撑构件粘合地附接到半导体管芯。 封装还可以包括承载半导体管芯的衬底和附接到半导体管芯的支撑构件。

公开(公告)号：US07253025B2

公开(公告)日：2007-08-07

申请号：US10923360

申请日：2004-08-20

Applicant: Tongbi Jiang ,  J. Michael Brooks

Inventor： Tongbi Jiang ,  J. Michael Brooks

IPC: H01L21/44 ,  H01L29/40

CPC classification number: H01L24/16 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83894 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/078 ,  H01L2924/10161 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A microelectronic device and method for manufacture. In one embodiment, two microelectronic substrates are directly bonded to each other without an intermediate adhesive material. For example, each microelectronic substrate can include a first surface, a second surface opposite the first surface, and a functional microelectronic feature coupled to a connection terminal of the microelectronic substrate. The connection terminals can be coupled to a support member, such as a leadframe or a printed circuit board, with the bond plane between the microelectronic substrates either aligned with or transverse to the support member. The microelectronic substrates can be enclosed in a protective packaging material that can include a transparent window to allow selected radiation to strike one or the other of the microelectronic substrates.

Abstract translation: 一种微电子器件及其制造方法。 在一个实施例中，两个微电子基板彼此直接接合而没有中间粘合剂材料。 例如，每个微电子衬底可以包括第一表面，与第一表面相对的第二表面，以及耦合到微电子衬底的连接端子的功能微电子特征。 连接端子可以耦合到诸如引线框架或印刷电路板的支撑构件，其中微电子衬底之间的键合平面与支撑构件对准或横向于支撑构件。 微电子衬底可以封装在保护性包装材料中，该保护性包装材料可以包括透明窗口，以允许选定的辐射冲击微电子衬底中的一个或另一个。