公开(公告)号：US5736901A

公开(公告)日：1998-04-07

申请号：US625701

申请日：1996-04-03

申请人： Morio Nakamura ,  Masahiro Maeda ,  Yorito Ota

发明人： Morio Nakamura ,  Masahiro Maeda ,  Yorito Ota

IPC分类号： H03F1/08 ,  H03F3/193 ,  H03F3/60 ,  H03F3/16

CPC分类号： H03F3/1935 ,  H03F1/086

摘要： In a radio frequency amplifier, a resistor and an inductor are connected to a gate terminal of transistor such as an FET. Another resistor for preventing oscillation is connected to the inductor. A capacitor and a third resistor connected to each other in parallel are connected to the first resistor while the other ends thereof are grounded. A resistance value of the resistor for preventing oscillation is in the range of about 30 .OMEGA. to about 70 .OMEGA.. An inductance value of the inductor is such that an impedance value for a low frequency becomes negligibly small.

摘要翻译： 在射频放大器中，电阻器和电感器连接到诸如FET的晶体管的栅极端子。 用于防止振荡的另一个电阻器连接到电感器。 并联连接的电容器和第三电阻器连接到第一电阻器，而其另一端接地。 用于防止振荡的电阻器的电阻值在约30欧姆至约70欧米茄的范围内。 电感器的电感值使得低频的阻抗值变得可忽略不计。

公开(公告)号：US6166436A

公开(公告)日：2000-12-26

申请号：US60600

申请日：1998-04-15

申请人： Masahiro Maeda ,  Morio Nakamura ,  Takayuki Yoshida ,  Masazumi Yamazaki

发明人： Masahiro Maeda ,  Morio Nakamura ,  Takayuki Yoshida ,  Masazumi Yamazaki

IPC分类号： H01L21/56 ,  H01L23/482 ,  H01L23/66 ,  H01L21/44 ,  H01L21/60

CPC分类号： H01L23/4824 ,  H01L21/563 ,  H01L23/66 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/10329 ,  H01L2924/1306 ,  H01L2924/13064 ,  H01L2924/1423 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/01015 ,  H01L2924/01031 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599

摘要： A high frequency semiconductor device includes: a substrate having a substantially flat principal surface, with a predetermined circuit pattern including at least an input line, an output line, and a ground electrode provided on the principal surface; and a transistor which has a drain electrode, a source electrode, and a gate electrode and is mounted on the substrate by a flip chip mounting. The source electrode and the ground electrode are connected to each other by a first bump in the flip chip mounting.

摘要翻译： 高频半导体器件包括：具有基本上平坦的主表面的基板，具有至少包括设置在主表面上的输入线，输出线和接地电极的预定电路图案; 以及具有漏电极，源电极和栅电极并通过倒装芯片安装而安装在基板上的晶体管。 源电极和接地电极通过倒装芯片安装中的第一凸块相互连接。

公开(公告)号：US5901042A

公开(公告)日：1999-05-04

申请号：US62752

申请日：1998-04-20

申请人： Yorito Ota ,  Masahiro Maeda ,  Shigeru Morimoto ,  Morio Nakamura

发明人： Yorito Ota ,  Masahiro Maeda ,  Shigeru Morimoto ,  Morio Nakamura

IPC分类号： H01L23/12 ,  H01L23/36 ,  H01L23/66 ,  H01L25/16 ,  H05K7/20

CPC分类号： H01L25/165 ,  H01L23/36 ,  H01L23/66 ,  H01L24/49 ,  H01L25/162 ,  H01L2223/6644 ,  H01L2224/48091 ,  H01L2224/48237 ,  H01L2224/49175 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/13063 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3011 ,  H01L2924/30111

摘要： A semiconductor chip is mounted on the central portion of a metal heat radiator. A pair of metal projecting members are provided on the heat radiator externally of the pair of opposed sides of the semiconductor chip to extend therealong beyond both ends of the semiconductor chip. A circuit board is mounted on the side of each of the pair of projecting members opposed to the semiconductor chip. The top surface of the semiconductor chip and the top surface of each of the projecting members are connected to each other by a third bonding wire for grounding.

摘要翻译： 半导体芯片安装在金属散热器的中心部分上。 一对金属突出构件设置在半导体芯片的一对相对侧的外部的散热器上，以延伸超过半导体芯片的两端。 电路板安装在与半导体芯片相对的一对突出构件中的每一个的侧面上。 半导体芯片的顶表面和每个突出构件的顶表面通过用于接地的第三接合线彼此连接。

公开(公告)号：US5838543A

公开(公告)日：1998-11-17

申请号：US812484

申请日：1997-03-06

申请人： Morio Nakamura ,  Masahiro Maeda

发明人： Morio Nakamura ,  Masahiro Maeda

IPC分类号： H01L23/367 ,  H05K7/20 ,  H05K9/00

CPC分类号： H05K9/0056 ,  H01L23/3677 ,  H01L23/66 ,  H05K7/20445 ,  H01L2924/0002

摘要： A radio frequency power amplification module includes: a radiation section; a printed circuit board attached to the radiation section; a semiconductor device for power amplification, mounted on the printed circuit board; and a cap. The radiation section includes a plurality of radiation boards, the plurality of radiation boards at least including a first radiation board as a lowermost layer, and a second radiation board attached onto the first radiation board, the first radiation board being coupled to the cap.

摘要翻译： 射频功率放大模块包括：辐射部分; 连接到辐射部分的印刷电路板; 用于功率放大的半导体器件，安装在印刷电路板上; 和帽子。 所述辐射部分包括多个辐射板，所述多个辐射板至少包括作为最下层的第一辐射板，以及连接到所述第一辐射板上的第二辐射板，所述第一辐射板耦合到所述盖。

公开(公告)号：US07948088B2

公开(公告)日：2011-05-24

申请号：US12063606

申请日：2006-08-25

申请人： Toshio Saito ,  Satoshi Moriya ,  Morio Nakamura ,  Goichi Yokoyama ,  Tatsuyuki Saito ,  Nobuaki Miyakawa

发明人： Toshio Saito ,  Satoshi Moriya ,  Morio Nakamura ,  Goichi Yokoyama ,  Tatsuyuki Saito ,  Nobuaki Miyakawa

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L21/763 ,  H01L21/76898 ,  H01L21/823871 ,  H01L21/823878 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/45 ,  H01L24/48 ,  H01L25/50 ,  H01L27/0203 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： In order to improve the manufacturing yield of a semiconductor device having a three-dimensional structure in which a plurality of chips are stacked and attached to each other, the opening shape of each of conductive grooves (4A) formed in each chip (C2) obtained from a wafer (W2) is rectangular, and the number of the conductive grooves (4A) whose long-sides are directed in a Y direction and the number of the conductive grooves (4A) whose long-sides are directed in an X direction perpendicular to the Y direction are made to be approximately equal to each other number in the entire wafer (W2), whereby the film stress upon embedding of a conductive film into the interior of the conductive grooves is reduced, and generation of exfoliation and micro-cracks in the conductive film or warpage and cracks of the wafer (W2) are prevented.

摘要翻译： 为了提高具有多个芯片彼此堆叠并附接的三维结构的半导体器件的制造成品，形成在每个芯片（C2）中的每个导电槽（4A）的开口形状获得 从晶片（W2）的长方形的长方形的导体槽（4A）的长度方向的长度方向的数量和长边方向的X方向的导体槽的数量 使整个晶片（W2）的Y方向大致相等，由此导电膜嵌入导电槽内的膜应力减小，剥离和微裂纹的产生 导致膜或翘曲和晶片（W2）的裂纹被阻止。

公开(公告)号：US5180798A

公开(公告)日：1993-01-19

申请号：US637155

申请日：1991-01-03

申请人： Morio Nakamura ,  Takushi Yamamoto ,  Hitoshi Tanaka ,  Hitoshi Ozawa ,  Yasuhiro Shimada

发明人： Morio Nakamura ,  Takushi Yamamoto ,  Hitoshi Tanaka ,  Hitoshi Ozawa ,  Yasuhiro Shimada

IPC分类号： A61L15/60 ,  C08F2/20 ,  C08F2/32 ,  C08F20/00 ,  C08F20/06 ,  C08F20/56 ,  C08F120/04

CPC分类号： C08F2/32 ,  A61L15/60

摘要： An improved process for the production of a water-absorbent resin by reversed phase suspension polymerization of a water-soluble ethylenic unsaturated monomer is disclosed. The process is conducted by subjecting an aqueous solution of a water-soluble ethylenic unsaturated monomer to reversed phase suspension polymerization reaction of a first stage in a petroleum hydrocarbon solvent in the presence of a surfactant and/or polymeric protective colloid by using a radical polymerization initiator optionally in the presence of a crosslinking agent, cooling the resulting slurry to precipitate the surfactant and/or polymeric protective colloid, and adding an aqueous solution of a water-soluble ethylenic unsaturated monomer containing a radical polymerization initiator and optionally a crosslinking agent to the first polymerization reaction system to further carry out the reversed phase suspension polymerization reaction, at least, once.

公开(公告)号：US4972019A

公开(公告)日：1990-11-20

申请号：US368795

申请日：1989-06-20

申请人： Shigeji Obayashi ,  Morio Nakamura ,  Takushi Yamamoto ,  Hitoshi Tanaka ,  Yuji Sakamoto

发明人： Shigeji Obayashi ,  Morio Nakamura ,  Takushi Yamamoto ,  Hitoshi Tanaka ,  Yuji Sakamoto

IPC分类号： A61L15/18 ,  C08K3/28 ,  C08K3/30

CPC分类号： C08K3/28 ,  A61L15/18 ,  C08K3/30

摘要： A water-absorbent resin composition having superior gel stability which comprises a water-absorbent resin, at least one oxygen-containing reducing inorganic salt and, optionally, at least one organic antioxidant.

公开(公告)号：US4863989A

公开(公告)日：1989-09-05

申请号：US53623

申请日：1987-05-26

申请人： Shigeji Obayashi ,  Morio Nakamura ,  Takushi Yamamoto ,  Hitoshi Tanaka ,  Yuji Sakamoto

发明人： Shigeji Obayashi ,  Morio Nakamura ,  Takushi Yamamoto ,  Hitoshi Tanaka ,  Yuji Sakamoto

IPC分类号： A61L15/18 ,  C08K3/28 ,  C08K3/30

CPC分类号： C08K3/28 ,  A61L15/18 ,  C08K3/30

摘要： A water-absorbent resin composition having superior gel stability which comprises a water-absorbent resin, at least one oxygen-containing reducing inorganic salt and, optionally, at least one organic antioxidant.

摘要翻译： 具有优异凝胶稳定性的吸水性树脂组合物，其包含吸水性树脂，至少一种含氧还原性无机盐和任选的至少一种有机抗氧化剂。

公开(公告)号：US4683274A

公开(公告)日：1987-07-28

申请号：US738290

申请日：1985-05-28

申请人： Morio Nakamura ,  Shigeji Obayashi ,  Takushi Yamamoto ,  Toshikazu Nakanishi ,  Hitoshi Tanaka ,  Yuji Sakamoto

发明人： Morio Nakamura ,  Shigeji Obayashi ,  Takushi Yamamoto ,  Toshikazu Nakanishi ,  Hitoshi Tanaka ,  Yuji Sakamoto

IPC分类号： C08F20/00 ,  A61L15/60 ,  C08F2/18 ,  C08F2/32 ,  C08F20/06 ,  C08F120/04 ,  C08F220/04 ,  C08F20/04

CPC分类号： C08F20/06 ,  A61L15/60 ,  C08F2/32

摘要： A water-absorbent resin usable as a suitable water absorbent in sanitary materials and other fields can be produced by subjecting an aqueous solution of an .alpha.,.beta.-unsaturated carboxylic acid and of an alkali metal salt thereof to polymerization with a radical polymerization initiator in a petroleum-based hydrocarbon solvent in the presence or absence of a crosslinking agent and, in this polymerization, using a saccharose-fatty acid ester as a protective colloid agent.

摘要翻译： 在卫生材料和其它领域中可用作合适的吸水剂的吸水性树脂可以通过使α，β-不饱和羧酸及其碱金属盐的水溶液与自由基聚合引发剂在 在存在或不存在交联剂的情况下，在石油基烃溶剂中，在该聚合中，使用蔗糖脂肪酸酯作为保护胶体剂。

公开(公告)号：US5334679A

公开(公告)日：1994-08-02

申请号：US95830

申请日：1993-07-22

申请人： Takushi Yamamoto ,  Hiroari Hara ,  Nobuhiro Maeda ,  Morio Nakamura

发明人： Takushi Yamamoto ,  Hiroari Hara ,  Nobuhiro Maeda ,  Morio Nakamura

IPC分类号： C08F2/18 ,  C08F2/32 ,  C08F20/34

CPC分类号： C08F20/34

摘要： The present invention is directed to a method for production of a water-soluble cationic polymer comprising polymerizing a cationic vinyl monomer; either a cationic acrylate monomer alone or a mixture of said monomer and another monomer copolymerizable therewith, in dispersion medium in the presence of a surfactant by suspension polymerization method. The present invention offers an industrially advantageous method to obtain the water-soluble cationic polymer with a high degree of cationization and a high viscosity in water solution which can be used for flocculants, antistatic agents, retention aids for paper manufacturing and other purposes.

摘要翻译： 本发明涉及一种生产水溶性阳离子聚合物的方法，其包括使阳离子乙烯基单体聚合; 单独的阳离子丙烯酸酯单体或所述单体和可与其共聚的其它单体的混合物，在悬浮聚合法的表面活性剂存在下在分散介质中。 本发明提供了一种工业上有利的方法来获得水溶性阳离子聚合物，其水溶液的高粘度，可用于絮凝剂，抗静电剂，造纸用助留剂和其它目的。