-
公开(公告)号：US08110750B2
公开(公告)日：2012-02-07
申请号：US12488299
申请日：2009-06-19
申请人： Yasushi Inagaki , Katsuyuki Sano
发明人： Yasushi Inagaki , Katsuyuki Sano
IPC分类号： H05K1/16
CPC分类号： H05K1/0237 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/5383 , H01L23/66 , H01L24/81 , H01L2223/6616 , H01L2223/6622 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/13111 , H01L2224/16225 , H01L2224/81192 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/15787 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H01L2924/3511 , H05K1/0224 , H05K1/0263 , H05K1/0265 , H05K1/111 , H05K1/115 , H05K1/144 , H05K1/185 , H05K3/4602 , H05K2201/0352 , H05K2201/09309 , H05K2201/09536 , H05K2201/09736 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A multilayer printed wiring board has a core substrate, an interlayer insulation layer formed over the core substrate, conductive layers formed over the core substrate, and a via hole for providing electrical connection between the conductive layers. The conductive layers include a conductive layer formed on the core substrate, and the conductive layer formed on the core substrate has a side face in a form of rounded taper tapering toward the core substrate.
摘要翻译： 多层印刷电路板具有芯基板，在芯基板上形成的层间绝缘层，形成在芯基板上的导电层，以及用于在导电层之间提供电连接的通孔。 导电层包括形成在芯基板上的导电层，并且形成在芯基板上的导电层具有朝向芯基板渐缩的圆锥形的侧面。
-
公开(公告)号：US08107253B2
公开(公告)日：2012-01-31
申请号：US12034517
申请日：2008-02-20
申请人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
发明人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
IPC分类号： H05K1/18
CPC分类号： H05K1/115 , H01G2/06 , H01G4/12 , H01G4/224 , H01G4/228 , H01G4/248 , H01G4/40 , H01L21/4857 , H01L23/498 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L25/16 , H01L25/162 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05027 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2924/01002 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01046 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/112 , H05K1/181 , H05K1/183 , H05K1/185 , H05K1/186 , H05K3/4602 , H05K2201/09509 , H05K2201/09545 , H05K2201/096 , H05K2201/10015 , H05K2201/10636 , H05K2201/10674 , Y02P70/611
摘要： A printed circuit board includes a chip capacitor having electrodes and a metal film formed on one or more of the electrodes, an accommodating layer accommodating the chip capacitor inside the accommodating layer, a connection layer formed over the accommodating layer and having a via hole opening extending to the metal film, and a first via hole structure formed in the via hole opening of the connection layer and connected to the metal film on the one or more of the electrodes of the chip capacitor.
摘要翻译： 印刷电路板包括具有电极的片状电容器和形成在一个或多个电极上的金属膜，在容纳层内容纳片状电容器的容纳层，形成在容纳层上的连接层，并且具有通孔开口延伸 以及形成在连接层的通孔开口中并连接到片式电容器的一个或多个电极上的金属膜的第一通孔结构。
-
公开(公告)号：US07995352B2
公开(公告)日：2011-08-09
申请号：US12691154
申请日：2010-01-21
申请人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
发明人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
IPC分类号： H05K1/18
CPC分类号： H05K1/115 , H01G2/06 , H01G4/12 , H01G4/224 , H01G4/228 , H01G4/248 , H01G4/40 , H01L21/4857 , H01L23/498 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L25/16 , H01L25/162 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05027 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2924/01002 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01046 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/112 , H05K1/181 , H05K1/183 , H05K1/185 , H05K1/186 , H05K3/4602 , H05K2201/09509 , H05K2201/09545 , H05K2201/096 , H05K2201/10015 , H05K2201/10636 , H05K2201/10674 , Y02P70/611
摘要： Chip capacitors are provided in a printed circuit board. In this manner, the distance between an IC chip and each chip capacitor is shortened, and the loop inductance is reduced. In addition, the chip capacitors are accommodated in a core substrate having a large thickness. Therefore, the thickness of the printed circuit board does not become large.
摘要翻译： 片状电容器设置在印刷电路板中。 以这种方式，IC芯片和每个芯片电容器之间的距离缩短，并且环路电感减小。 此外，芯片电容器容纳在具有大厚度的芯基板中。 因此，印刷电路板的厚度不会变大。
-
公开(公告)号：US20100328915A1
公开(公告)日：2010-12-30
申请号：US12873815
申请日：2010-09-01
申请人： Yasushi INAGAKI , Motoo ASAI , Dongdong WANG , Hideo YABASHI , Seiji SHIRAI
发明人： Yasushi INAGAKI , Motoo ASAI , Dongdong WANG , Hideo YABASHI , Seiji SHIRAI
CPC分类号： H05K1/181 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L24/16 , H01L24/17 , H01L25/16 , H01L25/162 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/82039 , H01L2224/82047 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01052 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/185 , H05K1/186 , H05K1/187 , H05K3/4602 , H05K3/4611 , H05K2201/0187 , H05K2201/09509 , H05K2201/09536 , H05K2201/10636 , H05K2201/10674 , H05K2203/063 , Y02P70/611 , Y10T29/435 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/05599
摘要： A printed circuit board has a core substrate including a resin substrate having an opening, a capacitor formed in the opening and having a first electrode structure having a portion facing to the upper surface of the core substrate and a second electrode structure having a portion facing to the lower surface of the core substrate, an upper insulating layer formed over the upper surface of the core substrate and having a conductive circuit formed over the upper insulating layer and a via hole electrically connecting the portion of the first electrode structure and the conductive circuit of the upper insulating layer, and a lower insulating layer formed over the lower surface of the core substrate and having a conductive circuit formed over the lower insulating layer and a via hole electrically connecting the portion of the second electrode structure and the conductive circuit of the lower insulating layer.
摘要翻译： 印刷电路板具有包括具有开口部的树脂基板的芯基板，形成在开口部的电容器，具有第一电极结构，具有与芯基板的上表面相对的部分，第二电极结构体具有面向 芯基板的下表面，形成在芯基板的上表面上方并具有形成在上绝缘层上的导电电路的上绝缘层和将第一电极结构的部分与导电电路电连接的通孔， 上绝缘层和下绝缘层，形成在芯基板的下表面上，并且具有形成在下绝缘层上的导电电路和将第二电极结构的部分与下部绝缘层的导电电路电连接的通孔 绝缘层。
-
公开(公告)号：US20100101838A1
公开(公告)日：2010-04-29
申请号：US12649038
申请日：2009-12-29
申请人： Yasushi Inagaki , Katsuyuki Sano
发明人： Yasushi Inagaki , Katsuyuki Sano
IPC分类号： H05K1/02
CPC分类号： H05K1/09 , H01L23/49816 , H01L23/49822 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2924/01019 , H01L2924/01025 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H01L2924/15312 , H01L2924/19106 , H01L2924/3011 , H01L2924/3511 , H05K1/0237 , H05K1/056 , H05K1/183 , H05K1/185 , H05K3/429 , H05K3/4602 , H05K3/4608 , H05K3/4641 , H05K2201/0347 , H05K2201/0352 , H05K2201/09309 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/09809 , H01L2224/05599
摘要： A package substrate free of malfunction or error even with an IC chip in a high frequency range, particularly an IC chip with a frequency exceeding 3 GHz, is provided. A conductor layer 34P on a core substrate 30 is formed to have a thickness of 30 μm and a conductor circuit 58 on an interlayer resin insulating layer 50 is formed to have a thickness of 15 μm. By making the conductor layer 34P thick, it is possible to increase a volume of the conductor itself and decrease resistance. Further, by employing the conductor layer 34 as a power supply layer, it is possible to improve a capability of supplying power to the IC chip.
摘要翻译： 即使IC芯片处于高频范围，特别是具有频率超过3GHz的IC芯片，也不会出现故障或误差的封装基板。 芯基板30上的导体层34P形成为具有30μm的厚度，层间树脂绝缘层50上的导体电路58形成为具有15μm的厚度。 通过使导体层34P变厚，可以增加导体本身的体积并降低电阻。 此外，通过使用导体层34作为电源层，可以提高向IC芯片供电的能力。
-
公开(公告)号：US20100014261A1
公开(公告)日：2010-01-21
申请号：US12566776
申请日：2009-09-25
申请人： Yasushi INAGAKI , Motoo ASAI , Dongdong WANG , Hideo YABASHI , Seiji SHIRAI
发明人： Yasushi INAGAKI , Motoo ASAI , Dongdong WANG , Hideo YABASHI , Seiji SHIRAI
IPC分类号： H05K1/18
CPC分类号： H05K1/181 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L24/16 , H01L24/17 , H01L25/16 , H01L25/162 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/82039 , H01L2224/82047 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01052 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/185 , H05K1/186 , H05K1/187 , H05K3/4602 , H05K3/4611 , H05K2201/0187 , H05K2201/09509 , H05K2201/09536 , H05K2201/10636 , H05K2201/10674 , H05K2203/063 , Y02P70/611 , Y10T29/435 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/05599
摘要： A printed circuit board includes a core substrate having an opening portion, an electronic component provided in the opening portion of the core substrate and including a dielectric body, a first electrode formed over the dielectric body, and a second electrode formed over the dielectric body such that the dielectric body is interposed between the first electrode and the second electrode, and a resin filling a gap between the core substrate and the electronic component in the opening portion of the core substrate. The resin filling the gap includes a filler.
摘要翻译： 印刷电路板包括具有开口部分的芯基板，设置在芯基板的开口部分中的电子部件，包括电介质体，形成在绝缘体上的第一电极和形成在电介质体上的第二电极， 介电体插入在第一电极和第二电极之间，以及树脂填充芯基板的开口部分中的芯基板和电子部件之间的间隙。 填充间隙的树脂包括填料。
-
公开(公告)号：US20090090542A1
公开(公告)日：2009-04-09
申请号：US12272892
申请日：2008-11-18
申请人： Yasushi INAGAKI , Katsuyuki Sano
发明人： Yasushi INAGAKI , Katsuyuki Sano
IPC分类号： H05K1/11
CPC分类号： H05K1/0237 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/5383 , H01L23/66 , H01L24/81 , H01L2223/6616 , H01L2223/6622 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/13111 , H01L2224/16225 , H01L2224/81192 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/15787 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H01L2924/3511 , H05K1/0224 , H05K1/0263 , H05K1/0265 , H05K1/111 , H05K1/115 , H05K1/144 , H05K1/185 , H05K3/4602 , H05K2201/0352 , H05K2201/09309 , H05K2201/09536 , H05K2201/09736 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An IC chip for a high frequency region, particularly a packaged substrate in which no malfunction or error occurs even if 3 GHz is exceeded. A conductive layer on a core substrate is formed at a thickness of 30 μm and a conductor circuit on an interlayer resin insulation layer is formed at a thickness of 15 μm. By thickening the conductive layer, the volume of the conductor can be increased and resistance can be reduced. Further, by using the conductive layer as a power source layer, the capacity of supply of power to an IC chip can be improved.
摘要翻译： 用于高频区域的IC芯片，特别是即使超过3GHz也不发生故障或错误的封装衬底。 在芯基板上形成厚度为30μm的导电层，形成层间树脂绝缘层上的导体电路，厚度为15μm。 通过增厚导电层，可以增加导体的体积并降低电阻。 此外，通过使用导电层作为电源层，可以提高向IC芯片供电的能力。
-
公开(公告)号：US20080169120A1
公开(公告)日：2008-07-17
申请号：US11778139
申请日：2007-07-16
申请人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
发明人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
IPC分类号： H05K1/03
CPC分类号： H05K1/181 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L24/16 , H01L24/17 , H01L25/16 , H01L25/162 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/82039 , H01L2224/82047 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01052 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/185 , H05K1/186 , H05K1/187 , H05K3/4602 , H05K3/4611 , H05K2201/0187 , H05K2201/09509 , H05K2201/09536 , H05K2201/10636 , H05K2201/10674 , H05K2203/063 , Y02P70/611 , Y10T29/435 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/05599
摘要： A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 id constituted by provided a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.
摘要翻译： 片状电容器20设置在印刷电路板10的芯基板30中。 这使得可以缩短IC芯片90和芯片电容器20之间的距离并减小环路电感。 由于通过以多层方式设置第一树脂基板30a，第二树脂基板30b和第三树脂基板30c构成的芯基板30d，因此芯基板30可以获得足够的强度。
-
9.发明申请公开(公告)号：US20080158841A1
公开(公告)日：2008-07-03
申请号：US12034504
申请日：2008-02-20
申请人： Yasushi INAGAKI , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
发明人： Yasushi INAGAKI , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
IPC分类号： H05K7/02
CPC分类号： H05K1/115 , H01G2/06 , H01G4/12 , H01G4/224 , H01G4/228 , H01G4/248 , H01G4/40 , H01L21/4857 , H01L23/498 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L25/16 , H01L25/162 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05027 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2924/01002 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01046 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/112 , H05K1/181 , H05K1/183 , H05K1/185 , H05K1/186 , H05K3/4602 , H05K2201/09509 , H05K2201/09545 , H05K2201/096 , H05K2201/10015 , H05K2201/10636 , H05K2201/10674 , Y02P70/611
摘要： Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large thickness. Therefore, the thickness of the printed circuit board does not become large.
摘要翻译： 片状电容器20设置在印刷电路板10中。 以这种方式，IC芯片90和每个片状电容器20之间的距离缩短，并且环路电感减小。 此外，芯片电容器20被容纳在具有大厚度的芯基板30中。 因此，印刷电路板的厚度不会变大。
-
公开(公告)号：US20080158838A1
公开(公告)日：2008-07-03
申请号：US12034517
申请日：2008-02-20
申请人： Yasushi INAGAKI , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
发明人： Yasushi INAGAKI , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
IPC分类号： H05K1/18
CPC分类号： H05K1/115 , H01G2/06 , H01G4/12 , H01G4/224 , H01G4/228 , H01G4/248 , H01G4/40 , H01L21/4857 , H01L23/498 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L25/16 , H01L25/162 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05027 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2924/01002 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01046 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/112 , H05K1/181 , H05K1/183 , H05K1/185 , H05K1/186 , H05K3/4602 , H05K2201/09509 , H05K2201/09545 , H05K2201/096 , H05K2201/10015 , H05K2201/10636 , H05K2201/10674 , Y02P70/611
摘要： Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large thickness. Therefore, the thickness of the printed circuit board does not become large.
-
-
-
-
-
-
-
-
-
搜索结果
54 条记录 (耗时 0.047 秒)
