公开(公告)号：US08943685B2

公开(公告)日：2015-02-03

申请号：US12923992

申请日：2010-10-19

申请人： Young Do Kweon ,  Sung Yi ,  Hong-Won Kim

发明人： Young Do Kweon ,  Sung Yi ,  Hong-Won Kim

IPC分类号： H05K3/02 ,  H05K1/16 ,  H05K3/06 ,  H05K3/46

CPC分类号： H05K1/162 ,  H05K3/062 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/09509 ,  H05K2201/09672 ,  H05K2201/09881 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156

摘要： A method of manufacturing a capacitor-embedded printed circuit board using a first conductive layer formed on one side of an insulation layer, the method including: forming a second conductive layer on one side of the first conductive layer; forming a second electrode by removing a portion of the second conductive layer; forming a first electrode by removing a portion of the first conductive layer in correspondence with the second electrode; and forming a dielectric layer on one side of the second electrode.

摘要翻译： 一种使用形成在绝缘层的一侧上的第一导电层制造电容器嵌入式印刷电路板的方法，所述方法包括：在所述第一导电层的一侧上形成第二导电层; 通过去除所述第二导电层的一部分来形成第二电极; 通过与所述第二电极对应地移除所述第一导电层的一部分来形成第一电极; 以及在所述第二电极的一侧上形成介电层。

公开(公告)号：US08801057B2

公开(公告)日：2014-08-12

申请号：US13317412

申请日：2011-10-18

申请人： Jeong Hun Kim ,  Yong Jae Kim ,  Youn Baek Lee ,  Heum Yong Park ,  Kyung Shik Roh ,  Young Do Kwon

发明人： Jeong Hun Kim ,  Yong Jae Kim ,  Youn Baek Lee ,  Heum Yong Park ,  Kyung Shik Roh ,  Young Do Kwon

IPC分类号： B60R19/00 ,  B60R21/0136

CPC分类号： B60R21/0136 ,  A47L9/009 ,  A47L9/2805 ,  A47L2201/04 ,  G01D5/165

摘要： A bumper structure of a cleaning robot which detects whether or not an obstacle contacts a bumper and a position of the obstacle, allows the bumper to be simply process and reduces the number of components of the cleaning robot to lower the production costs of the cleaning robot. The bumper structure includes a main body, a bumper installed on the front surface of the main body, a resistance film provided between the main body and the bumper and fixed to the main body, and a metal film provided between the main body and the bumper and fixed to the bumper such that the shape of the metal film is deformed together with the bumper and the metal film comes into contact with the resistance film when at least one obstacle contacts the bumper, so as to measure resistance values.

摘要翻译： 清洁机器人的保险杠结构，其检测障碍物是否碰到保险杠和障碍物的位置，允许缓冲器简单地处理并减少清洁机器人的部件数量，以降低清洁机器人的生产成本 。 保险杠结构包括主体，安装在主体前表面上的保险杠，设置在主体和保险杠之间并固定在主体上的电阻膜，以及设置在主体和保险杠之间的金属膜 并且当至少一个障碍物接触保险杠时，金属膜的形状与保险杠一起变形并且金属膜与电阻膜接触，以便测量电阻值，并且固定到保险杠。

公开(公告)号：US08756804B2

公开(公告)日：2014-06-24

申请号：US13213984

申请日：2011-08-19

申请人： Hyung Jin Jeon ,  Young Do Kweon ,  Seung Wook Park ,  Seon Hee Moon

发明人： Hyung Jin Jeon ,  Young Do Kweon ,  Seung Wook Park ,  Seon Hee Moon

IPC分类号： H01K3/10

CPC分类号： H05K1/115 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/0298 ,  H05K1/036 ,  H05K3/42 ,  H05K3/4602 ,  H05K3/4605 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/09563 ,  H05K2201/10378 ,  H05K2203/0594 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  H01L2924/00

摘要： Disclosed is a printed circuit board, including a base member, an insulating layer formed on each of both surfaces of the base member so that the surfaces of the base member are flattened, a circuit layer formed on the insulating layer, and a via for connecting the circuit layer formed on one surface of the base member with the circuit layer formed on the other surface of the base member. A method of manufacturing the printed circuit board is also provided.

摘要翻译： 公开了一种印刷电路板，包括基底构件，形成在基底构件的两个表面中的每一个上的绝缘层，使得基底构件的表面变平，形成在绝缘层上的电路层和用于连接的通孔 所述电路层形成在所述基底构件的一个表面上，所述电路层形成在所述基底构件的另一个表面上。 还提供了制造印刷电路板的方法。

公开(公告)号：US08687447B2

公开(公告)日：2014-04-01

申请号：US12650491

申请日：2009-12-30

申请人： Choung Ki Song ,  Young Do Hur ,  Sang Sic Yoon ,  Yong Gu Kang ,  Gyung Tae Kim

发明人： Choung Ki Song ,  Young Do Hur ,  Sang Sic Yoon ,  Yong Gu Kang ,  Gyung Tae Kim

IPC分类号： G11C7/00 ,  G11C29/00

CPC分类号： G11C29/12 ,  G11C11/401 ,  G11C2029/1204

摘要： A semiconductor memory apparatus includes: a precharge voltage control unit configured to selectively output a bit line precharge voltage or a core voltage as a control voltage in response to a test signal; a bit line equalization unit configured to precharge a bit line to the control voltage; a sense amplifier driving control unit configured to generate a first voltage supply control signal, a second voltage supply control signal and a third voltage supply control signal in response to the test signal, a sense amplifier enable test signal, a first voltage supply signal, a second voltage supply signal and a third voltage supply signal; and a voltage supply unit configured to provide the core voltage, an external voltage and a ground voltage to a sense amplifier with an open bit line structure in response to the first to third voltage supply control signals.

摘要翻译： 半导体存储装置包括：预充电电压控制单元，被配置为响应于测试信号选择性地输出位线预充电电压或核心电压作为控制电压; 位线均衡单元，被配置为将位线预充电到所述控制电压; 感测放大器驱动控制单元，被配置为响应于测试信号产生第一电压供应控制信号，第二电压供应控制信号和第三电压供应控制信号，感测放大器使能测试信号，第一电压供应信号， 第二电压供给信号和第三电压供给信号; 以及电压供给单元，被配置为响应于所述第一至第三电压供给控制信号，将具有开放位线结构的所述核心电压，外部电压和接地电压提供给具有开放位线结构的读出放大器。

公开(公告)号：US20130169382A1

公开(公告)日：2013-07-04

申请号：US13472195

申请日：2012-05-15

申请人： Jin Gu Kim ,  Jong Yun Lee ,  Young Do Kweon ,  Chang Bae Lee ,  Young Seuck Yoo

发明人： Jin Gu Kim ,  Jong Yun Lee ,  Young Do Kweon ,  Chang Bae Lee ,  Young Seuck Yoo

IPC分类号： H03H7/01 ,  H04B3/28 ,  B32B38/00 ,  H04B15/00 ,  B05D5/12

CPC分类号： H01P1/20345 ,  H01F17/0013 ,  H01F2017/0093 ,  H03H1/0007 ,  H03H7/427 ,  H03H2001/0085 ,  H04B3/28

摘要： Disclosed herein are a common mode filter and a method for manufacturing the same. The common mode filter includes a first insulator sheet; a first circuit layer having a first-layered first coil and a first-layered second coil alternately and separately arranged; a second insulator sheet laminated on the first circuit layer; and a second circuit layer having a second-layered first coil and a second-layered second coil alternately and separately arranged, the second-layered first coil being connected to the first-layered first coil and the second-layered second coil being connected to the first-layered second coil through the plurality of penetration holes.

摘要翻译： 这里公开了共模滤波器及其制造方法。 共模滤波器包括第一绝缘片; 具有第一层次的第一线圈和第一层次的第二线圈的第一电路层交替且分开布置; 叠层在第一电路层上的第二绝缘片; 并且具有交替且分离布置的具有第二层第一线圈和第二层次线圈的第二电路层，所述第二层第一线圈连接到所述第一层第一线圈，所述第二层第二线圈连接到 第一层第二线圈通过多个穿透孔。

公开(公告)号：US20130153275A1

公开(公告)日：2013-06-20

申请号：US13425665

申请日：2012-03-21

申请人： Jin Gul Hyun ,  Jin Gu Kim ,  Young Do Kweon ,  Hyung Jin Jeon

发明人： Jin Gul Hyun ,  Jin Gu Kim ,  Young Do Kweon ,  Hyung Jin Jeon

IPC分类号： H05K1/00 ,  H05K3/28 ,  H05K3/10

CPC分类号： H05K3/4673 ,  H05K3/28 ,  H05K2201/09781 ,  H05K2203/0126 ,  H05K2203/0759 ,  Y10T29/49158

摘要： Disclosed herein are a printed circuit board and a method for manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board includes: a base substrate; circuit patterns formed in a circuit region on the base substrate; dummy patterns formed in a dummy region on the base substrate; and an insulating layer formed above the circuit patterns and the dummy patterns by a slit die coating method.

摘要翻译： 这里公开了一种印刷电路板及其制造方法。 根据本发明的优选实施例，印刷电路板包括：基底; 形成在基底基板上的电路区域中的电路图案; 形成在基底基板上的虚拟区域中的虚拟图案; 以及通过狭缝模涂法形成在电路图案和虚设图案之上的绝缘层。

公开(公告)号：US20130081868A1

公开(公告)日：2013-04-04

申请号：US13355797

申请日：2012-01-23

申请人： Dong Hwan LEE ,  Seung Wook Park ,  Kyung Sang Lim ,  Young Do Kweon

发明人： Dong Hwan LEE ,  Seung Wook Park ,  Kyung Sang Lim ,  Young Do Kweon

IPC分类号： H05K1/11

CPC分类号： H05K1/0225 ,  H05K1/0253 ,  H05K1/111

摘要： Disclosed herein is a printed circuit board, including: a dielectric substrate having a ground surface; a plurality of pads formed on the dielectric substrate; a transmission line transmitting a signal between the plurality of pads; and slots formed in partial regions of the ground surface correspondingly to the pads, thereby to improve signal transmitting characteristics and allow high-density wiring and thin thickness.

摘要翻译： 本文公开了一种印刷电路板，包括：具有接地表面的电介质基板; 形成在电介质基板上的多个焊盘; 传输线，在所述多个焊盘之间传输信号; 以及与焊盘对应地形成在地表面的部分区域中的槽，从而改善信号传输特性并允许高密度布线和薄厚度。

公开(公告)号：US08373537B2

公开(公告)日：2013-02-12

申请号：US12923574

申请日：2010-09-28

申请人： Mi Jin Park ,  Young Do Kweon ,  Jin Gu Kim

发明人： Mi Jin Park ,  Young Do Kweon ,  Jin Gu Kim

IPC分类号： H01C1/012

CPC分类号： H01C7/003 ,  H01C1/01 ,  H01C7/06 ,  Y10T29/49082 ,  Y10T29/49099

摘要： There are provided a resistor and a method of fabricating the same. The resistor includes: a substrate; a lower resistant material layer formed on the upper portion of the substrate; an insulating layer to be stacked on the upper portion of the lower resistant material layer; an upper resistant material layer to be stacked on the upper portion of the insulating layer; and two penetration parts vertically penetrating through the insulating layer, wherein the penetration part is filled with a resistant material having the same component as that of the lower resistant material layer and the upper resistant material layer to electrically connect the upper resistant material layer to the lower resistant material layer.

摘要翻译： 提供了一种电阻器及其制造方法。 电阻器包括：基板; 在所述基板的上部形成有较低阻力的材料层; 绝缘层，堆叠在下阻抗材料层的上部; 层叠在绝缘层的上部的上部电阻材料层; 和穿过绝缘层的两个穿透部分，其中穿透部分填充有与下阻力材料层和上阻力材料层具有相同成分的电阻材料，以将上部阻力材料层与下部电阻材料层电连接 耐材料层。

公开(公告)号：US20130026924A1

公开(公告)日：2013-01-31

申请号：US13360481

申请日：2012-01-27

申请人： Young Do JONG ,  Hyun Gu KANG ,  Hye Man JUNG ,  Kang Nyung LEE

发明人： Young Do JONG ,  Hyun Gu KANG ,  Hye Man JUNG ,  Kang Nyung LEE

IPC分类号： H05B37/02 ,  H01L33/62 ,  H01J7/24

CPC分类号： H05B33/083 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2924/181 ,  H05B33/0803 ,  H05B33/0809 ,  H05B33/0818 ,  H05B33/0824 ,  Y02B20/347 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00011

摘要： An LED driving circuit package includes a rectification unit to receive an AC power voltage and rectify the AC power voltage to generate a ripple voltage, an LED driving switching unit including a plurality of switch units and a plurality of current control units. The LED driving circuit package further includes a low voltage control unit including a circuit power supply unit to generate low voltage power, a voltage detection unit to detect a magnitude of the ripple voltage, a reference frequency generation unit to generate a reference frequency, and a reference pulse generation unit to generate a reference pulse for controlling the operation of the LED driving switch unit according to the reference frequency and a magnitude of the voltage detected by the voltage detection unit.

摘要翻译： LED驱动电路组件包括：整流单元，用于接收交流电源电压并整流交流电源电压以产生纹波电压; LED驱动开关单元，包括多个开关单元和多个电流控制单元。 LED驱动电路封装还包括低电压控制单元，其包括用于产生低电压电力的电路电源单元，用于检测纹波电压幅度的电压检测单元，产生参考频率的基准频率产生单元，以及 参考脉冲发生单元，用于产生用于根据参考频率控制LED驱动开关单元的操作的参考脉冲和由电压检测单元检测的电压的大小。

公开(公告)号：US08283768B2

公开(公告)日：2012-10-09

申请号：US12424514

申请日：2009-04-15

申请人： Joon Seok Kang ,  Sung Yi ,  Young Do Kweon

发明人： Joon Seok Kang ,  Sung Yi ,  Young Do Kweon

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/4334 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01073 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599

摘要： Disclosed herein are a wafer level package for heat dissipation and a method of manufacturing the same. The wafer level package includes a heat dissipation plate including a cavity and a hole, a die including a pad disposed in the cavity of the heat dissipation plate in a face-up manner, a thermal conductive adhesive disposed between the die and an inner wall of the cavity and disposed in the hole, and a redistribution layer connected at one end to the pad and at the other end extended. The wafer level package protects the die from external environments and enables the die to be easily flush with the heat dissipation plate.

摘要翻译： 这里公开了用于散热的晶片级封装及其制造方法。 晶片级封装包括包括空腔和孔的散热板，包括以面朝上的方式设置在散热板的空腔中的焊盘的模具，设置在模具和内壁之间的导热粘合剂 空腔并设置在孔中，并且再分配层在一端连接到垫并且在另一端延伸。 晶圆级封装保护模具免受外部环境的影响，使模具能够轻松地与散热板齐平。