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1.发明申请公开(公告)号：US20100168830A1
公开(公告)日：2010-07-01
申请号：US12718864
申请日：2010-03-05
申请人： Andy Hung , Robert Greenberg , Dau Min Zhou , Jack Judy , Neil Talbot
发明人： Andy Hung , Robert Greenberg , Dau Min Zhou , Jack Judy , Neil Talbot
IPC分类号： A61N1/05
CPC分类号： A61N1/05 , A61N1/0526 , A61N1/0541 , A61N1/0543 , A61N1/0551
摘要： The present invention is a micro-machined electrode for neural-electronic interfaces which can achieve a ten times lower impedance and higher charge injection limit for a given material and planar area.
摘要翻译： 本发明是用于神经 - 电子接口的微加工电极，其可以为给定材料和平面区域实现十倍低阻抗和更高电荷注入极限。
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公开(公告)号：US08615308B2
公开(公告)日：2013-12-24
申请号：US12718864
申请日：2010-03-05
申请人： Andy Hung , Robert Greenberg , Dau Min Zhou , Jack Judy , Neil Talbot
发明人： Andy Hung , Robert Greenberg , Dau Min Zhou , Jack Judy , Neil Talbot
IPC分类号： A61N1/04
CPC分类号： A61N1/05 , A61N1/0526 , A61N1/0541 , A61N1/0543 , A61N1/0551
摘要： The present invention is a micro-machined electrode for neural-electronic interfaces which can achieve a ten times lower impedance and higher charge injection limit for a given material and planar area.
摘要翻译： 本发明是用于神经 - 电子接口的微加工电极，其可以为给定材料和平面区域实现十倍低阻抗和更高电荷注入极限。
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公开(公告)号：US07706893B2
公开(公告)日：2010-04-27
申请号：US11488806
申请日：2006-07-17
申请人： Andy Hung , Robert Greenberg , Dau Min Zhou , Jack Judy , Neil Talbot
发明人： Andy Hung , Robert Greenberg , Dau Min Zhou , Jack Judy , Neil Talbot
IPC分类号： A61N1/00
CPC分类号： A61N1/05 , A61N1/0526 , A61N1/0541 , A61N1/0543 , A61N1/0551
摘要： The present invention is a micro-machined electrode for neural-electronic interfaces which can achieve a ten times lower impedance and higher charge injection limit for a given material and planar area.
摘要翻译： 本发明是用于神经 - 电子接口的微加工电极，其可以为给定材料和平面区域实现十倍低阻抗和更高电荷注入极限。
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公开(公告)号：US07676274B2
公开(公告)日：2010-03-09
申请号：US10160468
申请日：2002-05-01
申请人： Andy Hung , Robert Greenberg , Dau Min Zhou , Jack Judy , Neil Talbot
发明人： Andy Hung , Robert Greenberg , Dau Min Zhou , Jack Judy , Neil Talbot
IPC分类号： A61N1/00
CPC分类号： A61N1/05 , A61N1/0526 , A61N1/0541 , A61N1/0543 , A61N1/0551
摘要： The present invention is a micro-machined electrode for neural-electronic interfaces which can achieve a ten times lower impedance and higher charge injection limit for a given material and planar area.
摘要翻译： 本发明是用于神经 - 电子接口的微加工电极，其可以为给定材料和平面区域实现十倍低阻抗和更高电荷注入极限。
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公开(公告)号：US20060259108A1
公开(公告)日：2006-11-16
申请号：US11488806
申请日：2006-07-17
申请人： Andy Hung , Robert Greenberg , Dao Zhou , Jack Judy , Neil Talbot
发明人： Andy Hung , Robert Greenberg , Dao Zhou , Jack Judy , Neil Talbot
IPC分类号： A61N1/05
CPC分类号： A61N1/05 , A61N1/0526 , A61N1/0541 , A61N1/0543 , A61N1/0551
摘要： The present invention is a micro-machined electrode for neural-electronic interfaces which can achieve a ten times lower impedance and higher charge injection limit for a given material and planar area.
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6.发明授权Biocompatible bonding method and electronics package suitable for implantation 有权生物相容性接合方法和电子封装适合植入公开(公告)号：US09592396B2
公开(公告)日：2017-03-14
申请号：US13351899
申请日：2012-01-17
申请人： Robert J. Greenberg , Alfred E. Mann , Neil Talbot , Jerry Ok , Gaillard R. Nolan , Dau Min Zhou
发明人： Robert J. Greenberg , Alfred E. Mann , Neil Talbot , Jerry Ok , Gaillard R. Nolan , Dau Min Zhou
IPC分类号： H05K3/34 , A61N1/375 , A61N1/05 , H05K3/36 , H05K1/03 , H05K3/32 , H05K3/40 , H05K3/42 , H05K3/46
CPC分类号： A61N1/375 , A61N1/0543 , A61N1/36046 , A61N1/3758 , H05K1/0306 , H05K3/321 , H05K3/328 , H05K3/361 , H05K3/4015 , H05K3/423 , H05K3/4652 , H05K3/4691 , H05K2201/09127 , H05K2201/1028 , H05K2201/10287 , H05K2201/10295 , H05K2201/10977 , H05K2203/0733 , H05K2203/1446 , Y10T29/49155
摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。
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7.发明申请Biocompatible Bonding Method and Electronics Package Suitable for Implantation 有权生物相容性接合方法和适用于植入的电子封装公开(公告)号：US20120131794A1
公开(公告)日：2012-05-31
申请号：US13351899
申请日：2012-01-17
申请人： Robert J. Greenberg , Alfred E. Mann , Neil Talbot , Jerry Ok , Gaillard R. Nolan , Dau Min Zhou
发明人： Robert J. Greenberg , Alfred E. Mann , Neil Talbot , Jerry Ok , Gaillard R. Nolan , Dau Min Zhou
IPC分类号： H05K3/10
CPC分类号： A61N1/375 , A61N1/0543 , A61N1/36046 , A61N1/3758 , H05K1/0306 , H05K3/321 , H05K3/328 , H05K3/361 , H05K3/4015 , H05K3/423 , H05K3/4652 , H05K3/4691 , H05K2201/09127 , H05K2201/1028 , H05K2201/10287 , H05K2201/10295 , H05K2201/10977 , H05K2203/0733 , H05K2203/1446 , Y10T29/49155
摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。
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8.发明申请Biocompatible Bonding Method and Electronics Package Suitable for Implantation 有权生物相容性接合方法和适用于植入的电子封装公开(公告)号：US20110213443A1
公开(公告)日：2011-09-01
申请号：US12861729
申请日：2010-08-23
申请人： Robert J. Greenberg , Alfred E. Mann , Neil Talbot , Jerry Ok , Gaillard R. Nolan , Dau Min Zhou
发明人： Robert J. Greenberg , Alfred E. Mann , Neil Talbot , Jerry Ok , Gaillard R. Nolan , Dau Min Zhou
IPC分类号： A61F9/08
CPC分类号： A61N1/375 , A61N1/0543 , A61N1/36046 , A61N1/3758 , H05K1/0306 , H05K3/321 , H05K3/328 , H05K3/361 , H05K3/4015 , H05K3/423 , H05K3/4652 , H05K3/4691 , H05K2201/09127 , H05K2201/1028 , H05K2201/10287 , H05K2201/10295 , H05K2201/10977 , H05K2203/0733 , H05K2203/1446 , Y10T29/49155
摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。
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9.发明授权Biocompatible bonding method and electronics package suitable for implantation 有权生物相容性接合方法和电子封装适合植入公开(公告)号：US07813796B2
公开(公告)日：2010-10-12
申请号：US11455028
申请日：2006-07-24
申请人： Robert J. Greenberg , Alfred E. Mann , Neil Talbot , Jerry Ok , Gaillard R. Nolan , Dau Min Zhou
发明人： Robert J. Greenberg , Alfred E. Mann , Neil Talbot , Jerry Ok , Gaillard R. Nolan , Dau Min Zhou
IPC分类号： A61N1/00
CPC分类号： A61N1/3758 , A61N1/0543 , A61N1/36046 , A61N1/375 , H01L21/563 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L24/81 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/13169 , H01L2224/13178 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81469 , H01L2224/81478 , H01L2224/81815 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1461 , H05K1/028 , H05K1/0306 , H05K1/09 , H05K1/111 , H05K1/113 , H05K1/115 , H05K1/189 , H05K3/10 , H05K3/188 , H05K3/305 , H05K3/321 , H05K3/328 , H05K3/3436 , H05K3/361 , H05K3/4015 , H05K3/4038 , H05K3/4084 , H05K3/423 , H05K3/4644 , H05K3/4652 , H05K3/4691 , H05K13/0469 , H05K2201/09127 , H05K2201/1028 , H05K2201/10287 , H05K2201/10295 , H05K2201/10977 , H05K2203/05 , H05K2203/06 , H05K2203/0733 , H05K2203/09 , H05K2203/107 , H05K2203/1446 , H01L2924/00 , H01L2224/05599
摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。
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10.发明授权Biocompatible bonding method and electronics package suitable for implantation 有权生物相容性接合方法和电子封装适合植入公开(公告)号：US08121697B2
公开(公告)日：2012-02-21
申请号：US12861729
申请日：2010-08-23
申请人： Robert J. Greenberg , Alfred E. Mann , Neil Talbot , Jerry Ok , Gaillard R. Nolan , Dau Min Zhou
发明人： Robert J. Greenberg , Alfred E. Mann , Neil Talbot , Jerry Ok , Gaillard R. Nolan , Dau Min Zhou
IPC分类号： A61N1/00
CPC分类号： A61N1/375 , A61N1/0543 , A61N1/36046 , A61N1/3758 , H05K1/0306 , H05K3/321 , H05K3/328 , H05K3/361 , H05K3/4015 , H05K3/423 , H05K3/4652 , H05K3/4691 , H05K2201/09127 , H05K2201/1028 , H05K2201/10287 , H05K2201/10295 , H05K2201/10977 , H05K2203/0733 , H05K2203/1446 , Y10T29/49155
摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。
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