公开(公告)号：US07199438B2

公开(公告)日：2007-04-03

申请号：US10667605

申请日：2003-09-23

申请人： Bernd Karl Appelt ,  William Tze-You Chen

发明人： Bernd Karl Appelt ,  William Tze-You Chen

IPC分类号： H01L31/0203 ,  H01L23/02 ,  H01L23/29

CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An optical semiconductor package includes a substrate, a chip, a plurality of bonding wires, a window, a supporter, and an encapsulant. The chip is disposed on the substrate and has an optical element. The bonding wires are used for electrically connecting the chip to the substrate. The window is supported on the supporter and positioned over the optical element of the chip. The encapsulant is overmolded on the substrate for fixing the window and encapsulating the chip and the bonding wires.

摘要翻译： 光学半导体封装包括基板，芯片，多个接合线，窗口，支撑件和密封剂。 芯片设置在基板上并具有光学元件。 接合线用于将芯片电连接到基板。 窗户支撑在支架上并定位在芯片的光学元件上。 密封剂在基板上被包覆成型，用于固定窗户并封装芯片和接合线。

公开(公告)号：US08487426B2

公开(公告)日：2013-07-16

申请号：US13048836

申请日：2011-03-15

申请人： Kay Stephan Essig ,  Bernd Karl Appelt ,  Ming Chiang Lee

发明人： Kay Stephan Essig ,  Bernd Karl Appelt ,  Ming Chiang Lee

IPC分类号： H01L23/04 ,  H01L23/043

CPC分类号： H01L23/488 ,  H01L23/295 ,  H01L23/36 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/24246 ,  H01L2224/24247 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/82101 ,  H01L2224/82106 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2924/00

摘要： A semiconductor package includes a conductive base, a die disposed adjacent to an upper surface of the conductive base, a patterned conductive layer, and a dielectric layer encapsulating the die. The dielectric layer defines an opening through which the patterned conductive layer is electrically connected to the upper surface of the conductive base. The conductive base has a lateral surface including a first portion adjacent to the upper surface of the conductive base and a second portion adjacent to a lower surface of the conductive base, where the second portion is sloped inwardly with respect to the lower surface of the conductive base.

摘要翻译： 半导体封装包括导电基底，邻近导电基底的上表面设置的管芯，图案化导电层和封装管芯的电介质层。 电介质层限定开口，图案化导电层通过该开口电连接到导电基底的上表面。 导电基底具有包括邻近导电基底的上表面的第一部分和与导电基底的下表面相邻的第二部分的侧表面，其中第二部分相对于导电基底的下表面向内倾斜 基础。

公开(公告)号：US20110169150A1

公开(公告)日：2011-07-14

申请号：US13006340

申请日：2011-01-13

申请人： Yuan-Chang Su ,  Shih-Fu Huang ,  Chia-Cheng Chen ,  Tzu-Hui Chen ,  Kuang-Hsiung Chen ,  Pao-Ming Hsieh ,  Ming Chiang Lee ,  Bernd Karl Appelt

发明人： Yuan-Chang Su ,  Shih-Fu Huang ,  Chia-Cheng Chen ,  Tzu-Hui Chen ,  Kuang-Hsiung Chen ,  Pao-Ming Hsieh ,  Ming Chiang Lee ,  Bernd Karl Appelt

IPC分类号： H01L23/495 ,  H01L21/60 ,  H05K3/10

CPC分类号： H01L24/14 ,  H01L21/4857 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/28 ,  H01L23/296 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5226 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48237 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83385 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T29/49155 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a substrate unit, a die electrically connected to first contact pads, and a package body covering a first patterned conductive layer and the die. The substrate unit includes: (1) the first patterned conductive layer; (2) a first dielectric layer exposing a part of the first patterned conductive layer to form the first contact pads; (3) a second patterned conductive layer; (4) a second dielectric layer defining openings extending from the first patterned conductive layer to the second patterned conductive layer, where the second patterned conductive layer includes second contact pads exposed by the second dielectric layer; and (5) conductive posts extending from the first patterned conductive layer to the second contact pads through the openings, each of the conductive posts filling a corresponding one of the openings. At least one of the conductive posts defines a cavity.

摘要翻译： 半导体封装包括基板单元，与第一接触焊盘电连接的管芯，以及覆盖第一图案化导电层和管芯的封装体。 基板单元包括：（1）第一图案化导电层; （2）暴露第一图案化导电层的一部分以形成第一接触焊盘的第一电介质层; （3）第二图案化导电层; （4）限定从第一图案化导电层延伸到第二图案化导电层的开口的第二介电层，其中第二图案化导电层包括由第二介电层暴露的第二接触焊盘; 和（5）通过开口从第一图案化导电层延伸到第二接触垫的导电柱，每个导电柱填充相应的一个开口。 导电柱中的至少一个限定了空腔。

公开(公告)号：US20100320610A1

公开(公告)日：2010-12-23

申请号：US12779818

申请日：2010-05-13

申请人： SHIH-FU HUANG ,  Yuan-Chang Su ,  Chia-Cheng Chen ,  Kuang-Hsiung Chen ,  Ming-Chiang Lee ,  Bernd Karl Appelt ,  Chia-Hsiung Hsieh

发明人： SHIH-FU HUANG ,  Yuan-Chang Su ,  Chia-Cheng Chen ,  Kuang-Hsiung Chen ,  Ming-Chiang Lee ,  Bernd Karl Appelt ,  Chia-Hsiung Hsieh

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L23/145 ,  H01L24/16 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor package includes a substrate, a die, and a package body. The substrate includes: (a) a core including a resin reinforced with fibers; (b) a plurality of openings extending through the core; (c) a dielectric layer; and (d) a single conductive layer disposed between the dielectric layer and the core. Portions of a lower surface of the single conductive layer cover the plurality of openings to form a plurality of first contact pads for electrical connection external to the semiconductor package. Exposed portions of an upper surface of the single conductive layer form a plurality of second contact pads. The die is electrically connected to the plurality of second contact pads, and the package body encapsulates the die.

摘要翻译： 半导体封装包括基板，管芯和封装体。 基材包括：（a）包含用纤维增强的树脂的芯; （b）延伸穿过所述芯的多个开口; （c）电介质层; 和（d）设置在电介质层和芯之间的单个导电层。 单个导电层的下表面的一部分覆盖多个开口以形成多个用于半导体封装外部电连接的第一接触焊盘。 单个导电层的上表面的暴露部分形成多个第二接触焊盘。 模具电连接到多个第二接触焊盘，并且封装体封装模具。

公开(公告)号：US07344915B2

公开(公告)日：2008-03-18

申请号：US11078384

申请日：2005-03-14

申请人： Bernd Karl Appelt ,  Ching-Hua Tsao

发明人： Bernd Karl Appelt ,  Ching-Hua Tsao

IPC分类号： H01L21/00

CPC分类号： H01L23/13 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing a semiconductor package with a laminated chip cavity is disclosed. A board and a metal foil having a layer of adhesive resin are provided. The metal foil is laminated with the board to make the adhesive resin be attached to the board. Next, a through opening is formed to pass through the board, the adhesive resin and the metal foil. Next, the metal foil is removed to expose an adhesive surface of the adhesive resin on the board so as to attach a carrier plate, thereby forming a chip cavity.

摘要翻译： 公开了一种用于制造具有层叠芯片空腔的半导体封装的方法。 提供了具有粘合树脂层的板和金属箔。 将金属箔与板层叠以使粘合剂树脂附着到板上。 接下来，形成贯通板，粘合树脂和金属箔的贯通孔。 接下来，去除金属箔以暴露板上的粘合剂树脂的粘合剂表面，以便附接载板，从而形成芯片腔。

公开(公告)号：US5928970A

公开(公告)日：1999-07-27

申请号：US10279

申请日：1998-01-21

申请人： Bernd Karl Appelt ,  William Thomas Fotorny ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  Mark David Poliks

发明人： Bernd Karl Appelt ,  William Thomas Fotorny ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  Mark David Poliks

IPC分类号： B29B15/12 ,  B29C70/08 ,  B29C70/22 ,  B29C70/54 ,  B32B15/14 ,  B32B27/04 ,  B32B27/38 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C03C25/48 ,  C03C25/50 ,  C08J3/24 ,  C08J5/04 ,  C08J5/24 ,  D06N7/00 ,  H01L23/14 ,  H01L23/498 ,  H05K1/03 ,  H05K3/02

CPC分类号： C08J3/243 ,  B29C70/08 ,  B29C70/086 ,  B29C70/088 ,  B29C70/22 ,  B29C70/543 ,  B32B15/14 ,  B32B27/04 ,  B32B27/38 ,  B32B37/0038 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C03C25/48 ,  C03C25/50 ,  C08J3/244 ,  C08J3/245 ,  C08J5/04 ,  C08J5/24 ,  D06N3/0022 ,  H01L23/145 ,  H01L23/49894 ,  H05K1/0366 ,  B29B15/125 ,  B29C2791/001 ,  B29K2063/00 ,  B29K2101/10 ,  B29K2105/0809 ,  B29K2105/24 ,  B29K2105/243 ,  B29K2105/256 ,  B29K2705/00 ,  B29L2009/00 ,  B29L2031/3425 ,  B32B2305/18 ,  B32B2311/12 ,  B32B2457/08 ,  C08J2363/00 ,  D06N2205/20 ,  H01L2924/0002 ,  H05K2201/0154 ,  H05K2201/0166 ,  H05K2201/029 ,  H05K3/022 ,  Y10S428/901 ,  Y10T428/2857 ,  Y10T428/2929 ,  Y10T428/2931 ,  Y10T442/131 ,  Y10T442/2025 ,  Y10T442/2041 ,  Y10T442/2049 ,  Y10T442/2057 ,  Y10T442/2098

摘要： A method for coating cloth especially fiberglass sheets with a thermosetting resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin/solvent mixture while maintaining at least some of the interstices or openings essentially free of the solvent mixture. This first coating is then partially cured to between about 70% and 90% of full cure. The coated fiberglass with partially cured resin thereon is then given a second coating of either the same or different thermosetting resin mixture which coats the first coating and fills in the interstices between the fibers. This second coating is then partially cured, which advances the cure of the first coating past 80% full cure and results in an impregnated fiberglass cloth structure for use as sticker sheets. During lamination, the first coating acts like an impenetrable insulating sheet, preventing resin displacement and, therefore, preventing glass fiber contact with the conductive planes. The second coating is fluid enough to fill in spaces in the planes and to form the adhesive bond to cores and conductive layers. The structure reduces the tendency of the resin to flake and produce dust during subsequent processing operations.

公开(公告)号：US5871819A

公开(公告)日：1999-02-16

申请号：US891427

申请日：1997-07-09

申请人： Bernd Karl Appelt ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  William John Rudik

发明人： Bernd Karl Appelt ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  William John Rudik

IPC分类号： B29B15/12 ,  B29C70/08 ,  B29C70/22 ,  B32B15/14 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C03C25/48 ,  C08J3/24 ,  C08J5/04 ,  D06N7/00 ,  H01L23/498 ,  H05K1/03 ,  H05K3/02 ,  B05D3/02 ,  B32B31/08

CPC分类号： H05K1/0366 ,  B29B15/125 ,  B29C70/086 ,  B29C70/088 ,  B29C70/22 ,  B32B15/14 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C03C25/48 ,  C08J3/243 ,  H01L23/49894 ,  B29C2791/001 ,  B29K2063/00 ,  B29K2105/0809 ,  B29K2105/24 ,  B29K2105/243 ,  B29K2705/00 ,  B29L2009/00 ,  C08J2363/00 ,  H01L2924/0002 ,  H05K2201/0154 ,  H05K2201/0166 ,  H05K2201/029 ,  H05K3/022 ,  Y10S428/901 ,  Y10T428/2857 ,  Y10T428/2929 ,  Y10T428/2931 ,  Y10T442/131 ,  Y10T442/2025 ,  Y10T442/2041 ,  Y10T442/2057 ,  Y10T442/2098

摘要： A method for coating cloth especially fiberglass sheets with a resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin solvent mixture as well as most of the interstices or openings, although some of the interstices or openings have holes where the coating does not completely fill in. This first coating is then partially cured to the extent that it will not redissolve in a second coating of the same resin solution. The coated fiberglass with partially cured resin thereon is then given a second coating of the same resin mixture which coats the first coating and fills in any holes in the first coating. This second coating is then partially cured, which advances the cure of the first coating and results in an impregnated fiberglass cloth structure for use as sticker sheets. This substantially reduces pinholing.

公开(公告)号：US5780366A

公开(公告)日：1998-07-14

申请号：US716813

申请日：1996-09-10

申请人： Bernd Karl Appelt ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  William John Rudik

发明人： Bernd Karl Appelt ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  William John Rudik

IPC分类号： B29B15/12 ,  B29C70/08 ,  B32B15/14 ,  B32B37/00 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C08J3/24 ,  C08J5/04 ,  D06N7/00 ,  H01L23/14 ,  H01L23/498 ,  H05K1/03 ,  H05K3/02 ,  B32B31/08 ,  B32B7/00

CPC分类号： B32B37/0038 ,  B29B15/125 ,  B29C70/08 ,  B32B15/14 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C08J3/243 ,  D06N7/0094 ,  H01L23/145 ,  H01L23/49894 ,  H05K1/0366 ,  B29K2063/00 ,  B29K2101/10 ,  B29K2105/256 ,  C08J2363/00 ,  D06N2201/082 ,  H01L2924/0002 ,  H05K2201/0154 ,  H05K2201/0166 ,  H05K2201/029 ,  H05K3/022 ,  Y10S428/902 ,  Y10T428/2929 ,  Y10T428/2931 ,  Y10T442/131 ,  Y10T442/2041 ,  Y10T442/2057 ,  Y10T442/2098

摘要： A method and resultant article are provided which optimize the adhesion of resin to the glass fibers in fiberglass cloth impregnated with a resin and also optimize the adhesion of the impregnated resin to metal sheets laminated to the resin-impregnated cloth. The fiberglass is treated in two or more passes. On the first pass, the fiberglass is impregnated with a first resin which is optimized for adherence to glass fibers and the coated resin is partially cured. In a last pass, the fiberglass is impregnated with a second resin, which is different from said first resin, and is optimized for bonding to metal. The second resin is then partially cured. The first and second resins are selected such that they form a bond with each other when cured.

公开(公告)号：US5773371A

公开(公告)日：1998-06-30

申请号：US890614

申请日：1997-07-09

申请人： Bernd Karl Appelt ,  William Thomas Fotorny ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  Mark David Poliks

发明人： Bernd Karl Appelt ,  William Thomas Fotorny ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  Mark David Poliks

IPC分类号： B29B15/12 ,  B29C70/22 ,  B29C70/54 ,  B32B15/04 ,  B32B27/04 ,  B32B27/38 ,  B32B37/00 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C03C25/50 ,  C08J3/24 ,  C08J5/04 ,  C08J5/24 ,  D06N7/00 ,  H01L23/498 ,  H05K1/03 ,  H05K3/02 ,  B32B31/08

CPC分类号： B32B37/0038 ,  B29B15/125 ,  B29C70/22 ,  B29C70/543 ,  B32B15/04 ,  B32B27/04 ,  B32B27/38 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C03C25/50 ,  C08J3/243 ,  C08J3/244 ,  C08J3/245 ,  C08J5/24 ,  H01L23/49894 ,  H05K1/0366 ,  B29K2063/00 ,  B29L2031/3425 ,  B32B2305/18 ,  B32B2311/12 ,  B32B2457/08 ,  C08J2363/00 ,  H01L2924/0002 ,  H05K2201/0154 ,  H05K2201/0166 ,  H05K2201/029 ,  H05K3/022 ,  Y10S428/901 ,  Y10T428/2857 ,  Y10T428/2929 ,  Y10T428/2931 ,  Y10T442/131 ,  Y10T442/2025 ,  Y10T442/2041 ,  Y10T442/2057 ,  Y10T442/2098 ,  Y10T442/2738

摘要： A method for coating cloth especially fiberglass sheets with a resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin solvent mixture while maintaining the interstices or openings essentially free of the solvent mixture. This first coating is then partially cured to the extent that it will not redissolve in a second coating of the same resin solution. The coated fiberglass with partially cured resin thereon is then given a second coating of the same resin mixture which coats the first coating and fills in the interstices between the fibers. This second coating is then partially cured, which advances the cure of the first coating and results in an impregnated fiberglass cloth structure for use as sticker sheets. During lamination, the first coating acts like an impenetrable insulating sheet, preventing resin displacement and, therefore, preventing glass fiber contact with the conductive planes. The second coating is fluid enough to fill in spaces in the planes and to form the adhesive bond to cores and conductive layers.

公开(公告)号：US08284561B2

公开(公告)日：2012-10-09

申请号：US12850872

申请日：2010-08-05

申请人： Yuan-Chang Su ,  Shih-Fu Huang ,  Bernd Karl Appelt ,  Ming-Chiang Lee

发明人： Yuan-Chang Su ,  Shih-Fu Huang ,  Bernd Karl Appelt ,  Ming-Chiang Lee

IPC分类号： H05K1/18 ,  H05K1/11

CPC分类号： H05K1/186 ,  H01L2224/16225 ,  H01L2924/15153 ,  H01L2924/15321 ,  H05K3/0097 ,  H05K3/4697 ,  H05K2201/0352 ,  H05K2203/1536 ,  Y10T29/4913 ,  Y10T29/49165

摘要： The present invention directs to fabrication methods of the embedded component package structures by providing preformed lamination structures, joining or stacking the preformed laminate structures and mounting at least one electronic component to the joined structures. By way of the fabrication methods, the production yield can be greatly improved with lower cycle time.

摘要翻译： 本发明通过提供预制的层压结构，连接或堆叠预成型的层压结构并将至少一个电子部件安装到接合的结构来指导嵌入式组件封装结构的制造方法。 通过制造方法，可以以较低的循环时间大大提高生产产量。