公开(公告)号：US20070096311A1

公开(公告)日：2007-05-03

申请号：US11641152

申请日：2006-12-19

申请人： Giles Humpston ,  David Tuckerman ,  Bruce McWilliams ,  Belgacem Haba ,  Craig Mitchell

发明人： Giles Humpston ,  David Tuckerman ,  Bruce McWilliams ,  Belgacem Haba ,  Craig Mitchell

IPC分类号： H01L23/48

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： Capped chips and methods of forming a capped chip are provided in which electrical interconnects are made by conductive elements which extend from bond pads of a chip at least partially through a plurality of through holes of a cap. The electrical interconnects may be solid, so as to form seals extending across the through holes. In some cases, stud bumps extend from the bond pads, forming parts of the electrical interconnects. In some cases, a fusible conductive medium forms a part of the electrical interconnects.

摘要翻译： 提供了覆盖芯片和形成封盖芯片的方法，其中电互连通过至少部分地通过盖的多个通孔从芯片的焊盘延伸的导电元件制成。 电互连可以是固体的，以便形成延伸穿过通孔的密封件。 在一些情况下，螺柱凸起从接合焊盘延伸，形成电互连的部分。 在一些情况下，可熔导电介质形成电互连的一部分。

公开(公告)号：US20060081983A1

公开(公告)日：2006-04-20

申请号：US10711945

申请日：2004-10-14

申请人： Giles Humpston ,  Bruce McWilliams

发明人： Giles Humpston ,  Bruce McWilliams

IPC分类号： H01L23/52

CPC分类号： B81B7/0077 ,  G01N21/3504 ,  H01L21/50 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A microelectronic package may include front and rear covers overlying the front and rear surfaces of a microelectronic element such as an infrared sensor and spaces between the microelectronic element and the covers to provide thermal isolation. A sensing unit including a microelectronic package may include a reflector spaced from the front cover to provide an analyte space, and the microelectronic element may include an emitter and a detector so that radiation directed from the emitter will be reflected by the sensor to the detector, and such radiation will be affected by the properties of the analyte in the analyte space. Such a unit provides a compact, economical chemical sensor. Other packages include elements such as valves for passing fluids into and out of the spaces within the package itself.

摘要翻译： 微电子封装可以包括覆盖微电子元件的前表面和后表面的前盖和后盖，例如红外传感器和微电子元件和盖之间的空间，以提供热隔离。 包括微电子封装的感测单元可以包括与前盖隔开以提供分析物空间的反射器，并且微电子元件可以包括发射器和检测器，使得从发射器引导的辐射将被传感器反射到检测器， 并且这种辐射将受分析物空间中分析物的性质的影响。 这种单元提供了紧凑，经济的化学传感器。 其他包装包括诸如用于使流体进入和流出包装内的空间的阀门的元件。

公开(公告)号：US20050085016A1

公开(公告)日：2005-04-21

申请号：US10949847

申请日：2004-09-24

申请人： Bruce McWilliams ,  Giles Humpston

发明人： Bruce McWilliams ,  Giles Humpston

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/10 ,  H01L23/485 ,  H01L27/146 ,  H03H3/007 ,  H03H3/08 ,  H03H9/10 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A method of making a chip assembly is provided which includes the steps of: (a) assembling (i) a capped chip including a chip, a cap overlying a front surface of the chip and a sacrificial layer overlying the cap with (ii) one or more further components; and (b) after the assembling step, removing the sacrificial layer from the capped chip. A method of making a plurality of capped chip assemblies is provided which includes the steps of: (a) assembling a lid member and a chip member including a plurality of chips to one another so that the lid member overlies the chip member and a top surface of the lid member faces away from the chip member; (b) severing the lid member and chip member to form a plurality of individual units each including one or more of the chips and a portion of the lid member; (c) providing a sacrificial layer overlying the top surface of the lid member prior to the severing step; and (d) removing the sacrificial layer after the severing step.

摘要翻译： 提供了一种制造芯片组件的方法，其包括以下步骤：（a）组装（i）包括芯片的封盖芯片，覆盖在芯片的前表面上的盖和覆盖盖的牺牲层，（ii）一个 或更多的组分; 和（b）在组装步骤之后，从封盖的芯片上去除牺牲层。 提供一种制造多个封盖芯片组件的方法，其包括以下步骤：（a）将包括多个芯片的盖构件和芯片构件彼此组装，使得盖构件覆盖在芯片构件和顶表面 所述盖构件背离所述芯片构件; （b）切断盖部件和芯片部件以形成多个单独的单元，每个单独的单元包括一个或多个芯片和盖部件的一部分; （c）在切割步骤之前提供覆盖盖构件的顶表面的牺牲层; 和（d）在切割步骤之后去除牺牲层。

公开(公告)号：US20070138644A1

公开(公告)日：2007-06-21

申请号：US11300900

申请日：2005-12-15

申请人： Bruce McWilliams ,  Giles Humpston ,  Belgacem Haba ,  Robert Burtzlaff

发明人： Bruce McWilliams ,  Giles Humpston ,  Belgacem Haba ,  Robert Burtzlaff

IPC分类号： H01L23/48

CPC分类号： B81C1/00301 ,  B81B2207/095 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/48091 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/3011 ,  H03H3/007 ,  H03H9/1092 ,  H01L2924/00014 ,  H01L2924/00

摘要： A capped chip is provided which includes a chip having a front surface, a plurality of conductive features exposed at the front surface and a cap. The cap has an inner surface facing the front surface of the chip, an outer surface opposite the inner surface, and a through hole extending from the outer surface to the inner surface. A conductive interconnect extends at least partially through the through hole. The interconnect includes a conductive article which occupies a substantial portion of a volume of the interconnect and the interconnect further includes a flowable conductive medium which joins the conductive article to at least one of the plurality of conductive features of the chip or to the cap.

摘要翻译： 提供了一种封盖芯片，其包括具有前表面的芯片，在前表面处暴露的多个导电特征和盖。 盖具有面向芯片的前表面的内表面，与内表面相对的外表面，以及从外表面延伸到内表面的通孔。 导电互连件至少部分延伸穿过通孔。 互连件包括占据互连体积的主要部分的导电制品，并且互连件还包括将导电制品连接到芯片的多个导电特征中的至少一个或帽的至少一个的可流动导电介质。

公开(公告)号：US20050095835A1

公开(公告)日：2005-05-05

申请号：US10949674

申请日：2004-09-24

申请人： Giles Humpston ,  David Tuckerman ,  Bruce McWilliams ,  Belgacem Haba ,  Craig Mitchell

发明人： Giles Humpston ,  David Tuckerman ,  Bruce McWilliams ,  Belgacem Haba ,  Craig Mitchell

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/10 ,  H01L23/485 ,  H01L27/146 ,  H03H3/007 ,  H03H3/08 ,  H03H9/10 ,  H01L21/48

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： Capped chips and methods of forming a capped chip are provided in which electrical interconnects are made by conductive elements which extend from bond pads of a chip at least partially through a plurality of through holes of a cap. The electrical interconnects may be solid, so as to form seals extending across the through holes. In some cases, stud bumps extend from the bond pads, forming parts of the electrical interconnects. In some cases, a fusible conductive medium forms a part of the electrical interconnects.

摘要翻译： 提供了覆盖芯片和形成封盖芯片的方法，其中电互连通过至少部分地通过盖的多个通孔从芯片的焊盘延伸的导电元件制成。 电互连可以是固体的，以便形成延伸穿过通孔的密封件。 在一些情况下，螺柱凸起从接合焊盘延伸，形成电互连的部分。 在一些情况下，可熔导电介质形成电互连的一部分。

公开(公告)号：US20080032457A1

公开(公告)日：2008-02-07

申请号：US11904477

申请日：2007-09-27

申请人： Bruce McWilliams ,  Giles Humpston ,  Belgacem Haba ,  David Tuckerman

发明人： Bruce McWilliams ,  Giles Humpston ,  Belgacem Haba ,  David Tuckerman

IPC分类号： H01L21/00

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A method of making a plurality of sealed assemblies is provided which includes a) assembling a first element to a second element so that a bottom surface of the first element faces downwardly toward a front surface of the second element and a top surface of the first element faces upwardly away from the second element; and (b) forming ring seals surrounding regions of the front surface of the second element by introducing flowable material between the first element and the second element from the top surface of the first element through openings in the first element. A chip is provided which includes: (a) a body defining a front surface and one or more circuit elements on or within the body; (b) one or more bond pads exposed at the front surface in a bond pad region; and (c) a metallic ring exposed at the front surface, the ring substantially surrounding the bond pad region. Sealed chip assemblies are formed by sealing an array of the chips, e.g., in wafer form, to a cap element.

摘要翻译： 提供了一种制造多个密封组件的方法，其包括：a）将第一元件组装到第二元件，使得第一元件的底表面向下朝向第二元件的前表面并且第一元件的顶表面 面向上远离第二元件; 以及（b）通过从第一元件的顶表面通过第一元件中的开口引入第一元件和第二元件之间的可流动材料，形成围绕第二元件的前表面的区域的环形密封件。 提供了一种芯片，其包括：（a）主体，其在身体上或体内限定前表面和一个或多个电路元件; （b）在接合焊盘区域中的前表面处暴露的一个或多个接合焊盘; 和（c）在前表面露出的金属环，所述环基本上围绕所述接合焊盘区域。 密封的芯片组件通过将芯片的阵列（例如，晶片形式）密封到盖元件来形成。

公开(公告)号：US20050082653A1

公开(公告)日：2005-04-21

申请号：US10948976

申请日：2004-09-24

申请人： Bruce McWilliams ,  Giles Humpston ,  Belgacem Haba ,  David Tuckerman

发明人： Bruce McWilliams ,  Giles Humpston ,  Belgacem Haba ,  David Tuckerman

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/10 ,  H01L23/485 ,  H01L27/146 ,  H03H3/007 ,  H03H3/08 ,  H03H9/10 ,  H01L23/02

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A method of making a plurality of sealed assemblies is provided which includes a) assembling a first element to a second element so that a bottom surface of the first element faces downwardly toward a front surface of the second element and a top surface of the first element faces upwardly away from the second element; and (b) forming ring seals surrounding regions of the front surface of the second element by introducing flowable material between the first element and the second element from the top surface of the first element through openings in the first element. A chip is provided which includes: (a) a body defining a front surface and one or more circuit elements on or within the body; (b) one or more bond pads exposed at the front surface in a bond pad region; and (c) a metallic ring exposed at the front surface, the ring substantially surrounding the bond pad region. Sealed chip assemblies are formed by sealing an array of the chips, e.g., in wafer form, to a cap element.

摘要翻译： 提供了一种制造多个密封组件的方法，其包括：a）将第一元件组装到第二元件，使得第一元件的底表面向下朝向第二元件的前表面并且第一元件的顶表面 面向上远离第二元件; 以及（b）通过从第一元件的顶表面通过第一元件中的开口引入第一元件和第二元件之间的可流动材料，形成围绕第二元件的前表面的区域的环形密封件。 提供了一种芯片，其包括：（a）主体，其在身体上或体内限定前表面和一个或多个电路元件; （b）在接合焊盘区域中的前表面处暴露的一个或多个接合焊盘; 和（c）在前表面露出的金属环，所述环基本上围绕所述接合焊盘区域。 密封的芯片组件通过将芯片的阵列（例如，晶片形式）密封到盖元件来形成。

公开(公告)号：US20120241976A1

公开(公告)日：2012-09-27

申请号：US13488930

申请日：2012-06-05

申请人： Belgacem Haba ,  Giles Humpston ,  Moti Margalit

发明人： Belgacem Haba ,  Giles Humpston ,  Moti Margalit

IPC分类号： H01L23/48

CPC分类号： H01L21/76898 ,  H01L21/76805 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/12 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

摘要： A microelectronic unit can include a semiconductor element having a front surface, a microelectronic semiconductor device adjacent to the front surface, contacts at the front surface and a rear surface remote from the front surface. The semiconductor element can have through holes extending from the rear surface through the semiconductor element and through the contacts. A dielectric layer can line the through holes. A conductive layer may overlie the dielectric layer within the through holes. The conductive layer can conductively interconnect the contacts with unit contacts.

摘要翻译： 微电子单元可以包括具有前表面的半导体元件，与前表面相邻的微电子半导体器件，在前表面处的接触和远离前表面的后表面。 半导体元件可以具有从后表面穿过半导体元件并通过触点延伸的通孔。 电介质层可以对通孔进行排列。 导电层可覆盖通孔内的电介质层。 导电层可以将触点与单元触点导电互连。

公开(公告)号：US07719121B2

公开(公告)日：2010-05-18

申请号：US11581888

申请日：2006-10-17

申请人： Giles Humpston ,  Guilian Gao ,  Belgacem Haba

发明人： Giles Humpston ,  Guilian Gao ,  Belgacem Haba

IPC分类号： H01L23/48

CPC分类号： H01L23/4985 ,  H01L23/49811 ,  H01L24/48 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package includes a microelectronic element having contacts, a flexible substrate spaced from and overlying the microelectronic element and a plurality of conductive posts extending from the flexible substrate and projecting away from the microelectronic element. The conductive posts are electrically interconnected with the microelectronic element. Each conductive post has a conductive base that is in contact with the flexible substrate and a conductive tip that extends from the base, with the base of the conductive post having a larger diameter than the tip of the conductive post. In certain embodiments, the conductive base and the conductive tip have a cylindrical shape.

摘要翻译： 微电子封装包括具有触点的微电子元件，与微电子元件隔开并覆盖的柔性基板以及从柔性基板延伸并远离微电子元件突出的多个导电柱。 导电柱与微电子元件电互连。 每个导电柱具有与柔性基板接触的导电基底和从基部延伸的导电尖端，导电柱的基部具有比导电柱的尖端更大的直径。 在某些实施例中，导电基底和导电尖端具有圆柱形形状。

公开(公告)号：US07545029B2

公开(公告)日：2009-06-09

申请号：US11506472

申请日：2006-08-18

申请人： Stuart E. Wilson ,  Ronald Green ,  Richard Dewitt Crisp ,  Giles Humpston

发明人： Stuart E. Wilson ,  Ronald Green ,  Richard Dewitt Crisp ,  Giles Humpston

IPC分类号： H01L23/02 ,  H05K7/00 ,  H01L21/00

CPC分类号： H01L23/66 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/09701 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00

摘要： A stacked microelectronic assembly includes a base substrate having conductive elements projecting from a bottom surface thereof and a first microelectronic subassembly underlying a bottom surface of the base substrate. The first microelectronic subassembly includes a first dielectric substrate, a first microelectronic element connected with the first dielectric substrate and first conductive posts projecting from the first dielectric substrate toward the bottom surface of the base substrate for electrically interconnecting the first microelectronic element and the base substrate. The assembly also has a second microelectronic subassembly overlying the base substrate. The second microelectronic subassembly includes a second dielectric substrate, a second microelectronic element connected with the second dielectric substrate and second conductive posts projecting toward the top surface of the base substrate for electrically interconnecting the second microelectronic element and the base substrate. The first microelectronic subassembly has a first height and the conductive elements projecting from the bottom surface of the base substrate have a second height that is greater than the first height of the first microelectronic subassembly.

摘要翻译： 堆叠的微电子组件包括具有从其底表面突出的导电元件的基底基板和位于基底基底的底表面下方的第一微电子子组件。 第一微电子子组件包括第一电介质衬底，与第一电介质衬底连接的第一微电子元件和从第一电介质衬底向基底衬底的底表面突出的第一导电柱，用于将第一微电子元件和基底衬底电互连。 组件还具有覆盖在基底基板上的第二微电子子组件。 第二微电子子组件包括第二电介质衬底，与第二电介质衬底连接的第二微电子元件和朝向基底衬底的顶表面突出的第二导电柱，用于电连接第二微电子元件和基底衬底。 第一微电子子组件具有第一高度，并且从基底衬底的底表面突出的导电元件具有大于第一微电子子组件的第一高度的第二高度。