公开(公告)号：US07374969B2

公开(公告)日：2008-05-20

申请号：US11259707

申请日：2005-10-25

申请人： Byeong-Yeon Cho ,  Hee-Seok Lee ,  Kyung-Lae Jang

发明人： Byeong-Yeon Cho ,  Hee-Seok Lee ,  Kyung-Lae Jang

IPC分类号： H01L21/00 ,  H01L23/02

CPC分类号： H01L24/85 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2224/85913 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/06 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The present invention relates to a semiconductor package having a conductive molding compound to prevent static charge accumulation. By using a conductive molding compound heat conductivity is also increased and heat generated by the semiconductor chip is more effectively dissipated externally. Additionally, the conductive compound blocks electromagnetic waves making possible an optimal semiconductor package satisfying the electromagnetic compatibility (EMC) and increasing the reliability of the semiconductor chip especially when processing high-speed signals.

摘要翻译： 本发明涉及一种具有导电性成型化合物以防止静电积聚的半导体封装。 通过使用导电模塑料，导热性也增加，并且由半导体芯片产生的热量更有效地从外部消散。 此外，导电化合物阻止电磁波，使得能够实现满足电磁兼容性（EMC）的最佳半导体封装，并且特别是在处理高速信号时增加半导体芯片的可靠性。

公开(公告)号：US20060097404A1

公开(公告)日：2006-05-11

申请号：US11259707

申请日：2005-10-25

申请人： Byeong-Yeon Cho ,  Hee-Seok Lee ,  Kyung-Lae Jang

发明人： Byeong-Yeon Cho ,  Hee-Seok Lee ,  Kyung-Lae Jang

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L24/85 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2224/85913 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/06 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The present invention relates to a semiconductor package having a conductive molding compound to prevent static charge accumulation. By using a conductive molding compound heat conductivity is also increased and heat generated by the semiconductor chip is more effectively dissipated externally. Additionally, the conductive compound blocks electromagnetic waves making possible an optimal semiconductor package satisfying the electromagnetic compatibility (EMC) and increasing the reliability of the semiconductor chip especially when processing high-speed signals.

摘要翻译： 本发明涉及一种具有导电性成型化合物以防止静电积聚的半导体封装。 通过使用导电模塑料，导热性也增加，并且由半导体芯片产生的热量更有效地从外部消散。 此外，导电化合物阻止电磁波，使得能够实现满足电磁兼容性（EMC）的最佳半导体封装，并且特别是在处理高速信号时增加半导体芯片的可靠性。

公开(公告)号：US07330084B2

公开(公告)日：2008-02-12

申请号：US11296769

申请日：2005-12-06

申请人： Hee-Seok Lee ,  Kyung-Lae Jang ,  Tae-Je Cho ,  Ki-Won Choi

发明人： Hee-Seok Lee ,  Kyung-Lae Jang ,  Tae-Je Cho ,  Ki-Won Choi

IPC分类号： H01P3/08

CPC分类号： H01P3/003 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/4917 ,  H01L2224/49175 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/3025 ,  H01P3/08 ,  H05K1/0219 ,  H05K3/222 ,  H05K2201/09236 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013

摘要： A printed circuit board for a high-speed semiconductor package uses bonding wires as a shield structure, e.g., to shield an open portion of signal transmission lines, and thereby reduce the likelihood of coupling noises, e.g., between signal transmission lines.

摘要翻译： 用于高速半导体封装的印刷电路板使用接合线作为屏蔽结构，例如屏蔽信号传输线的开放部分，从而降低例如信号传输线之间耦合噪声的可能性。

公开(公告)号：US20050242426A1

公开(公告)日：2005-11-03

申请号：US11110443

申请日：2005-04-19

申请人： Heung-Kyu Kwon ,  Kyung-Lae Jang ,  Hee-Seok Lee

发明人： Heung-Kyu Kwon ,  Kyung-Lae Jang ,  Hee-Seok Lee

IPC分类号： H01L25/18 ,  H01L21/44 ,  H01L21/56 ,  H01L21/60 ,  H01L23/12 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/50 ,  H01L23/52 ,  H01L25/065 ,  H01L25/07

CPC分类号： H01L23/50 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49575 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/91 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16265 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48482 ,  H01L2224/48499 ,  H01L2224/48599 ,  H01L2224/48799 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/85051 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/00 ,  H01L2924/00012

摘要： In one embodiment, a semiconductor package comprises a base frame and a lower semiconductor chip electrically coupled to the base frame. The lower semiconductor chip has a first bond pad formed on a top surface thereof. The package further includes an upper semiconductor chip overlying the lower semiconductor chip. The upper semiconductor chip has a third bond pad formed on a bottom surface thereof. The package comprises a first conductive bump and a second conductive bump jointly coupling the first bond pad to the third bond pad.

摘要翻译： 在一个实施例中，半导体封装包括电连接到基架的底架和下半导体芯片。 下半导体芯片具有形成在其顶表面上的第一接合焊盘。 封装还包括覆盖下半导体芯片的上半导体芯片。 上半导体芯片具有形成在其底表面上的第三接合焊盘。 封装包括第一导电凸块和将第一接合焊盘联接到第三接合焊盘的第二导电凸块。

公开(公告)号：US20100117451A1

公开(公告)日：2010-05-13

申请号：US12654991

申请日：2010-01-12

申请人： Kyung-Lae Jang ,  Hee-Seok Lee

发明人： Kyung-Lae Jang ,  Hee-Seok Lee

IPC分类号： H02J4/00 ,  H01L21/60

CPC分类号： H01L23/49816 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/50 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06548 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  Y10T307/406 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A package circuit board having a reduced package size. The package circuit board may include a semiconductor substrate in place of a printed circuit board. The package circuit board may further include a microelectronic chip mounted on the semiconductor substrate, the microelectronic chip having at least one of active and passive elements formed on the semiconductor substrate semiconductor substrate.

公开(公告)号：US20060119448A1

公开(公告)日：2006-06-08

申请号：US11296769

申请日：2005-12-06

申请人： Hee-Seok Lee ,  Kyung-Lae Jang ,  Tae-Je Cho ,  Ki-Won Choi

发明人： Hee-Seok Lee ,  Kyung-Lae Jang ,  Tae-Je Cho ,  Ki-Won Choi

IPC分类号： H01P3/08

CPC分类号： H01P3/003 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/4917 ,  H01L2224/49175 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/3025 ,  H01P3/08 ,  H05K1/0219 ,  H05K3/222 ,  H05K2201/09236 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013

摘要： A printed circuit board for a high-speed semiconductor package uses bonding wires as a shield structure, e.g., to shield an open portion of signal transmission lines, and thereby reduce the likelihood of coupling noises, e.g., between signal transmission lines.

摘要翻译： 用于高速半导体封装的印刷电路板使用接合线作为屏蔽结构，例如屏蔽信号传输线的开放部分，从而降低例如信号传输线之间耦合噪声的可能性。

公开(公告)号：US07663221B2

公开(公告)日：2010-02-16

申请号：US11028553

申请日：2005-01-05

申请人： Kyung-Lae Jang ,  Hee-Seok Lee

发明人： Kyung-Lae Jang ,  Hee-Seok Lee

IPC分类号： H01L23/14 ,  H01L23/52 ,  H01L25/07 ,  H01L25/18 ,  H01L25/065 ,  H01L23/48 ,  H01L23/495

CPC分类号： H01L23/49816 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/50 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06548 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  Y10T307/406 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A package circuit board having a reduced package size. The package circuit board may include a semiconductor substrate in place of a printed circuit board. The package circuit board may further include a microelectronic chip mounted on the semiconductor substrate, the microelectronic chip having at least one of active and passive elements formed on the semiconductor substrate semiconductor substrate.

摘要翻译： 具有减小的封装尺寸的封装电路板。 封装电路板可以包括代替印刷电路板的半导体衬底。 封装电路板还可以包括安装在半导体衬底上的微电子芯片，该微电子芯片具有形成在半导体衬底半导体衬底上的有源和无源元件中的至少一个。

公开(公告)号：US20050146018A1

公开(公告)日：2005-07-07

申请号：US11028553

申请日：2005-01-05

申请人： Kyung-Lae Jang ,  Hee-Seok Lee

发明人： Kyung-Lae Jang ,  Hee-Seok Lee

IPC分类号： H01L23/14 ,  H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H01L23/52 ,  H01L23/58 ,  H01L23/66 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

CPC分类号： H01L23/49816 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/50 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06548 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  Y10T307/406 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A package circuit board having a reduced package size. The package circuit board may include a semiconductor substrate in place of a printed circuit board. The package circuit board may further include a microelectronic chip mounted on the semiconductor substrate, the microelectronic chip having at least one of active and passive elements formed on the semiconductor substrate semiconductor substrate.

摘要翻译： 具有减小的封装尺寸的封装电路板。 封装电路板可以包括代替印刷电路板的半导体衬底。 封装电路板还可以包括安装在半导体衬底上的微电子芯片，该微电子芯片具有形成在半导体衬底半导体衬底上的有源和无源元件中的至少一个。

公开(公告)号：US08253228B2

公开(公告)日：2012-08-28

申请号：US13045103

申请日：2011-03-10

申请人： Yong-Hoon Kim ,  Byeong-Yeon Cho ,  Hee-Seok Lee

发明人： Yong-Hoon Kim ,  Byeong-Yeon Cho ,  Hee-Seok Lee

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0652 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/00

摘要： A package on package structure includes a lower package and an upper package. The lower package includes a first semiconductor chip disposed in a chip region of an upper surface of a first substrate. The upper package includes a second semiconductor chip disposed on an upper surface of a second substrate, and a decoupling capacitor disposed in an outer region of a lower surface of the second substrate. The lower surface of the second substrate opposes the upper surface of the second substrate and faces the upper surface of the first substrate. The plane area of the second substrate is larger than the plane area of the first substrate. The outer region of the lower surface of the second substrate extends beyond a periphery of the first substrate.

摘要翻译： 包装结构上的包装包括下包装和上包装。 下封装包括设置在第一基板的上表面的芯片区域中的第一半导体芯片。 上部封装包括设置在第二基板的上表面上的第二半导体芯片和设置在第二基板的下表面的外部区域中的去耦电容器。 第二基板的下表面与第二基板的上表面相对并且面向第一基板的上表面。 第二基板的平面面积大于第一基板的平面面积。 第二基板的下表面的外部区域延伸超出第一基板的周边。

公开(公告)号：US20110241168A1

公开(公告)日：2011-10-06

申请号：US13045103

申请日：2011-03-10

申请人： YONG-HOON KIM ,  Byeong-Yeon Cho ,  Hee-Seok Lee

发明人： YONG-HOON KIM ,  Byeong-Yeon Cho ,  Hee-Seok Lee

IPC分类号： H01L23/58

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0652 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/00

摘要： A package on package structure includes a lower package and an upper package. The lower package includes a first semiconductor chip disposed in a chip region of an upper surface of a first substrate. The upper package includes a second semiconductor chip disposed on an upper surface of a second substrate, and a decoupling capacitor disposed in an outer region of a lower surface of the second substrate. The lower surface of the second substrate opposes the upper surface of the second substrate and faces the upper surface of the first substrate. The plane area of the second substrate is larger than the plane area of the first substrate. The outer region of the lower surface of the second substrate extends beyond a periphery of the first substrate.

摘要翻译： 包装结构上的包装包括下包装和上包装。 下封装包括设置在第一基板的上表面的芯片区域中的第一半导体芯片。 上部封装包括设置在第二基板的上表面上的第二半导体芯片和设置在第二基板的下表面的外部区域中的去耦电容器。 第二基板的下表面与第二基板的上表面相对并且面向第一基板的上表面。 第二基板的平面面积大于第一基板的平面面积。 第二基板的下表面的外部区域延伸超出第一基板的周边。