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公开(公告)号：US20060292848A1
公开(公告)日：2006-12-28
申请号：US11510608
申请日：2006-08-28
IPC分类号： H01L21/44
CPC分类号： H01L51/0023 , B82Y10/00 , H01L51/0595 , Y10S977/78 , Y10S977/781 , Y10S977/784 , Y10S977/932
摘要： Provided is a method for manufacturing a nano-gap electrode device comprising the steps of: forming a first electrode on a substrate; forming a spacer on a sidewall of the first electrode; forming a second electrode on an exposed substrate at a side of the spacer; and forming a nano-gap between the first electrode and the second electrode by removing the spacer, whereby it is possible to control the nano-gap position, width, shape, and etc., reproducibly, and manufacture a plurality of nano-gap electrode devices at the same time.
摘要翻译： 提供一种纳米间隙电极器件的制造方法，包括以下步骤：在衬底上形成第一电极; 在所述第一电极的侧壁上形成间隔物; 在所述间隔物的一侧的暴露的基板上形成第二电极; 并且通过去除间隔物在第一电极和第二电极之间形成纳米间隙，从而可以可再现地控制纳米间隙位置，宽度，形状等，并且制造多个纳米间隙电极 设备同时进行。
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公开(公告)号：US20050112860A1
公开(公告)日：2005-05-26
申请号：US10800704
申请日：2004-03-16
IPC分类号： H01L21/28 , H01L21/44 , H01L21/4763 , H01L31/0328 , H01L31/0336 , H01L31/072 , H01L31/109
CPC分类号： H01L51/0023 , B82Y10/00 , H01L51/0595 , Y10S977/78 , Y10S977/781 , Y10S977/784 , Y10S977/932
摘要： Provided is a method for manufacturing a nano-gap electrode device comprising the steps of: forming a first electrode on a substrate; forming a spacer on a sidewall of the first electrode; forming a second electrode on an exposed substrate at a side of the spacer; and forming a nano-gap between the first electrode and the second electrode by removing the spacer, whereby it is possible to control the nano-gap position, width, shape, and etc., reproducibly, and manufacture a plurality of nano-gap electrode devices at the same time.
摘要翻译： 提供一种纳米间隙电极器件的制造方法，包括以下步骤：在衬底上形成第一电极; 在所述第一电极的侧壁上形成间隔物; 在所述间隔物的一侧的暴露的基板上形成第二电极; 并且通过去除间隔物在第一电极和第二电极之间形成纳米间隙，从而可以可再现地控制纳米间隙位置，宽度，形状等，并且制造多个纳米间隙电极 设备同时进行。
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公开(公告)号：US20050156327A1
公开(公告)日：2005-07-21
申请号：US11038756
申请日：2005-01-19
IPC分类号： H01L21/60 , B23K3/06 , H01L21/48 , H01L21/607 , H01L23/485 , H01L23/488 , H01L23/49 , H01L23/498 , H01L23/544 , H05K1/02 , H05K3/34 , H05K7/10 , H01L23/52
CPC分类号： H05K1/0269 , B23K3/0623 , B23K2101/40 , H01L21/4853 , H01L23/49816 , H01L23/544 , H01L24/10 , H01L24/11 , H01L24/12 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/85 , H01L2223/5442 , H01L2223/54473 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/45693 , H01L2224/48 , H01L2224/8121 , H01L2224/81815 , H01L2224/85002 , H01L2224/85205 , H01L2224/85909 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H05K3/3436 , H05K7/1061 , H05K2201/10734 , H05K2203/041 , H05K2203/161 , H01L2924/00014 , H01L2924/00 , H01L2924/00015
摘要： The surface of a solder ball and a conductive wire for a semiconductor package are coated with a predetermined colorant. Various colorants may be used according to the diameter and metal composition of the solder ball and the conductive wire. The colorant is formed by mixing organic compound and dye of a predetermined color. Examples of organic compounds excellent in physicochemical bonding with metal include benzotriazole, alkylimidazole and benzimidazole. The solder ball is fabricated by coating an organic compound of a predetermined color on the surface of a typical solder ball. The conductive wire is fabricated by coating an organic compound of a predetermined color on a general conductive wire between heat process and winding. Moreover, the solder ball is evaporated in a reflowing step after bumped via flux and the conductive wire is evaporated in a wire bonding step so that the solder ball and the conductive wire return to their unique colors.
摘要翻译： 用预定的着色剂涂覆焊球的表面和用于半导体封装的导线。 可以根据焊球和导线的直径和金属组成使用各种着色剂。 通过混合有机化合物和预定颜色的染料形成着色剂。 具有与金属物理化学键合性优异的有机化合物的实例包括苯并三唑，烷基咪唑和苯并咪唑。 焊球通过在典型的焊球的表面上涂覆预定颜色的有机化合物来制造。 导线通过在热处理和绕组之间的一般导线上涂覆预定颜色的有机化合物来制造。 此外，焊料球在通过焊剂撞击之后以回流步骤蒸发，并且导线在引线接合步骤中蒸发，使得焊球和导线恢复到其独特的颜色。
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4.发明申请Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant 有权半导体封装和使用具有引线锁的引线框的方法，以将引线固定到密封剂公开(公告)号：US20080036055A1
公开(公告)日：2008-02-14
申请号：US11365246
申请日：2006-03-01
申请人： Jae Yee , Young Chung , Jae Lee , Terry Davis , Chung Han , Jae Ku , Jae Kwak , Sang Ryu
发明人： Jae Yee , Young Chung , Jae Lee , Terry Davis , Chung Han , Jae Ku , Jae Kwak , Sang Ryu
IPC分类号： H01L23/495 , H01L21/98
CPC分类号： H01L23/3107 , H01L23/4951 , H01L23/49541 , H01L23/49548 , H01L23/49551 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/05599 , H01L2224/29007 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/0106 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/3512 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the corners of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.
摘要翻译： 公开了一种用于制造半导体封装的引线框架。 引线框架的引线包括提供在每个内引线的自由端处的引线锁，其适于增加内引线与树脂封装件的结合力，从而有效地防止内引线的分离在所涉及的单个加工过程中发生 制造半导体封装。 还公开了使用引线框制造的半导体封装和用于半导体封装的制造方法。 引线框架包括桨，用于支撑桨的角的多个连杆，多个引线，其布置在桨的四个侧面或两个相对的侧面中，使得它们与相邻侧面间隔开 的叶片，同时垂直于桨叶的相关侧延伸，每个引线具有引线分离防止装置，其适于增加引线与随后模制的树脂封装件的结合力，以封装引线框架以制造半导体封装， 和用于支撑引线和连接条的阻挡条。 另外的封装实施例包括从引线向下延伸的暴露突起。 在焊球附着步骤之前，用激光照射暴露的突起以去除固化树脂。
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公开(公告)号：US20070060737A1
公开(公告)日：2007-03-15
申请号：US11518986
申请日：2006-09-12
IPC分类号： C08G63/19
CPC分类号： C08G63/193 , C08G63/547 , C08J5/18 , C08J2367/03 , C09D167/03 , C09D167/06
摘要： The present invention relates to a polyarylate prepared by a method comprising a step of copolymerizing divalent phenol, divalent aromatic carboxylic acid halide and the allyl bisphenol derivative. The polyarylate according to the invention is a novel polyarylate in which various functional groups can be introduced to the main chain of the polymer as well as the terminal of a polymer, and the concentration thereof can be adjusted. These functional groups allow improvement in the adhesion force by chemically bonding with the substrate or protective layer when coated, thus the polyarylate is suitably used for a film or a coating composition.
摘要翻译： 本发明涉及一种通过包括使二价苯酚，二价芳族羧酸卤化物与烯丙基双酚衍生物共聚的方法制备的多芳基化合物。 根据本发明的多芳基化合物是一种新的多芳基化合物，其中可以将各种官能团引入聚合物的主链以及聚合物的末端，并且可以调节其浓度。 这些官能团通过在涂布时与基材或保护层进行化学键合来改善粘附力，因此多芳基化合物适合用于膜或涂料组合物。
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公开(公告)号：US20050143237A1
公开(公告)日：2005-06-30
申请号：US11008668
申请日：2004-12-10
申请人： Sang Ryu
发明人： Sang Ryu
CPC分类号： B23Q3/15526 , B23Q3/15706 , Y10T483/179
摘要： A tool magazine feeder for an automatic tool changer for feeding a tool magazine to a spindle comprises a carriage horizontally movable, under the state of supporting the tool magazine, between a remote position where the carriage is separated from the spindle and a proximate position where the carriage is adjacent to the spindle, a driving mechanism for reciprocating the carriage from the remote position to the proximate position and vice versa, and a guide mechanism positioned between the carriage and the driving mechanism. The guide mechanism is provided with one or more rollers and one or more rails for guiding the carriage to horizontally move between the remote position and the proximate position.
摘要翻译： 一种用于将工具仓馈送到主轴的自动换刀装置的刀库输送器包括：在托架与主轴分离的远程位置与托架与主轴分离的远程位置之间水平移动的托架在支撑工具仓的状态下水平移动， 滑架与主轴相邻，用于使滑架从远程位置往复运动的驱动机构反之亦然，以及定位在滑架和驱动机构之间的引导机构。 引导机构设置有一个或多个辊和一个或多个轨道，用于引导托架在远程位置和邻近位置之间水平移动。
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公开(公告)号：US20070025226A1
公开(公告)日：2007-02-01
申请号：US11490405
申请日：2006-07-20
IPC分类号： G11B7/00
CPC分类号： H01L45/06 , G11C13/0004 , H01L45/1233 , H01L45/126 , H01L45/143 , H01L45/144 , H01L45/148 , H01L45/1683
摘要： Provided are a phase change memory device and a method of fabricating the same capable of maximizing a contact area of a phase change layer and a heating electrode. The memory device includes a heating electrode and a phase change layer. The heating electrode covers at least one side exposed by a pore and a portion of a surface of a lower electrode and includes a recess region. The phase change layer is stacked on the heating electrode filling up the recess region. The memory device may maximize a contact area of the phase change layer and the heating electrode, thereby greatly reducing power consumption.
摘要翻译： 提供一种相变存储器件及其制造方法，其能够最大化相变层和加热电极的接触面积。 存储装置包括加热电极和相变层。 加热电极覆盖由孔隙和下部电极的表面的一部分露出的至少一个侧面，并且包括凹部区域。 相变层层叠在填充凹部的加热电极上。 存储器件可以使相变层和加热电极的接触面积最大化，从而大大降低功耗。
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公开(公告)号：US20050142848A1
公开(公告)日：2005-06-30
申请号：US10878317
申请日：2004-06-29
IPC分类号： H01L21/31 , H01L21/22 , H01L21/311 , H01L21/38 , H01L21/4763 , H01L21/768
CPC分类号： H01L21/76831 , H01L21/31116 , H01L21/76807
摘要： The present invention discloses a method for forming an interlayer insulation film in a semiconductor device, comprising the steps of: sequentially forming a porous low dielectric insulation film and a capping layer on the semiconductor substrate on which a few elements of the semiconductor device have been formed; and forming damascene patterns in the porous low dielectric insulation film by an etching process, and forming a protection film for closing pores exposed during the etching process at the same time.
摘要翻译： 本发明公开了一种在半导体器件中形成层间绝缘膜的方法，包括以下步骤：在半导体衬底上依次形成多孔低介电绝缘膜和覆盖层，半导体衬底上形成有半导体器件的几个元件 ; 并通过蚀刻工艺在多孔低介电绝缘膜中形成镶嵌图案，并且同时形成用于封闭在蚀刻工艺期间暴露的孔的保护膜。
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公开(公告)号：US20050009264A1
公开(公告)日：2005-01-13
申请号：US10731144
申请日：2003-12-10
申请人： Sang Ryu
发明人： Sang Ryu
IPC分类号： H01L21/265 , H01L21/3065 , H01L21/308 , H01L21/76 , H01L21/762 , H01L21/8238
CPC分类号： H01L21/3065 , H01L21/3086 , H01L21/76237
摘要： The present invention is provided to form a trench in a semiconductor device, wherein by performing an ion implanting process to an area of a semiconductor substrate in which the trench would be formed to cause lattice defects in the area before forming the trench, an etching speed of the area is increased in subsequent trench forming processes. As a result, it is possible to prevent micro trenches from being formed in edge portions of patterns and to suppress a micro loading effect to be generated depending upon pattern sizes.
摘要翻译： 提供本发明以在半导体器件中形成沟槽，其中通过对形成沟槽的半导体衬底的区域执行离子注入工艺以在形成沟槽之前在区域中引起晶格缺陷，蚀刻速度 在随后的沟槽形成过程中增加了面积。 结果，可以防止在图案的边缘部分形成微沟槽并且抑制根据图案尺寸产生的微负载效应。
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公开(公告)号：US20050178131A1
公开(公告)日：2005-08-18
申请号：US11055202
申请日：2005-02-11
CPC分类号： F25D11/02 , F25D27/00 , F25D29/00 , F25D2400/10 , F25D2700/02 , F25D2700/123
摘要： A kimchi refrigerator having sensing devices to sense whether doors of the kimchi refrigerator are opened. The kimchi refrigerator includes a main body forming an external appearance, and including storage chambers opened at one surface for storing food; doors to open and close the opened surfaces of the storage chambers; and sensing devices to sense whether the doors are opened. Since the sensing devices detect whether the doors are opened and the opening time of the doors, and lamps to illuminate the inner portions of the storage chambers and alarm devices to inform a user of the opening of the doors for a designated time or more are turned on and off based on the results detected by the sensing devices, the kimchi refrigerator compensates for the leaked cold air due to the opening of the doors.
摘要翻译： 具有用于感测泡菜冰箱的门是否打开的感测装置的泡菜冰箱。 泡菜冰箱包括形成外观的主体，并且包括在一个表面上开放以储存食物的储存室; 用于打开和关闭存储室的打开表面的门; 以及感测装置以感测门是否打开。 由于感测装置检测到门是否被打开，门的打开时间以及照明存储室和报警装置的内部的指示时间或更长时间通知使用者打开门的指示灯 基于由感测装置检测到的结果的开/关，泡菜冰箱补偿由于打开门而导致的泄漏的冷空气。
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