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130 条记录 (耗时 0.03 秒)

    Sharpness enhanced equal bandwidth luminance bandwidth compression system
    1.
    发明授权
    Sharpness enhanced equal bandwidth luminance bandwidth compression system 失效
    锐度增强等宽带宽亮度带宽压缩系统

    公开(公告)号：US4646152A

    公开(公告)日：1987-02-24

    申请号：US697600

    申请日：1985-02-01

    申请人： Charles W. Eichelberger ,  Robert J. Wojnarowski ,  Theodore G. Mihran

    发明人： Charles W. Eichelberger ,  Robert J. Wojnarowski ,  Theodore G. Mihran

    IPC分类号： H04N5/14 ,  H04N7/08 ,  H04N7/084 ,  H04N5/38

    CPC分类号： H04N7/0806 ,  H04N5/142 ,  H04N7/084

    摘要： Circuitry for enhancing the sharpness of bandwidth compressed television signals provides equalization in only the transmitter with no equalization required in the receiver. The transmitter includes a linear phase delay and edge peaking circuit, a low pass filter and an equalization circuit. The linear phase delay and edge peaking circuit includes a tapped delay line which provides weighted output signals for differential phase delays. The weighted output signals of the tapped delay line are differentially combined to provide a combined output signal. This combined output signal and a signal from the tapped delay line are supplied to a peaking circuit. A clamping circuit is connected to limit the amplitude of high level signals in the combined output signal so that small transitions are peaked to a greater degree than large transitions.

    摘要翻译： 用于提高带宽压缩电视信号的清晰度的电路仅在发射机中提供均衡，而在接收机中不需要均衡。 发射机包括线性相位延迟和边缘峰化电路，低通滤波器和均衡电路。 线性相位延迟和边缘峰化电路包括抽头延迟线，其提供用于差分相位延迟的加权输出信号。 抽头延迟线的加权输出信号差分组合以提供组合输出信号。 该组合输出信号和来自抽头延迟线的信号被提供给峰值电路。 连接钳位电路以限制组合输出信号中的高电平信号的幅度，使得小转换比大转换更大程度地达到峰值。

    High density interconnect thermoplastic die attach material and solvent die attach processing
    3.
    发明授权
    High density interconnect thermoplastic die attach material and solvent die attach processing 失效
    高密度互连热塑性管芯附着材料和溶剂管芯附着加工

    公开(公告)号：US5348607A

    公开(公告)日：1994-09-20

    申请号：US20913

    申请日：1993-02-22

    申请人： Robert J. Wojnarowski ,  Charles W. Eichelberger

    发明人： Robert J. Wojnarowski ,  Charles W. Eichelberger

    IPC分类号： H01L21/58 ,  H01L23/538 ,  B32B31/00

    CPC分类号： H01L24/83 ,  H01L23/5389 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  Y10T156/109 ,  Y10T156/1092 ,  Y10T156/1111

    摘要： A mixture for affixing dice to a substrate includes a thermoplastic polyimide, a solvent for the polyimide, and a solvent which does not dissolve the polyimide but adds thixotropicity to the mixture. The mixture is applied to the substrate, the dice are placed thereon, and the solvents are evaporated to bond the dice to the substrate. The bond is radiation hard and exhibits high shear pull strength. A poor solvent for the polyimide, sprayed over the dice and exposed portions of die attach material, causes some polyimide to precipitate out of solution in the exposed portions of die attach material to form a grid that extends between the dice and prevents the dice from "swimming together" during high temperature processing. In a solvent die-attachment method, the substrate is first coated with a mixture of die attach material, and the mixture is dried. Spraying a solvent over the die attach material causes the material to soften so that the dice applied thereto may adhere. The die attach material is then dried to form the bond.

    摘要翻译： 用于将骰子固定到基底的混合物包括热塑性聚酰亚胺，聚酰亚胺的溶剂和不溶解聚酰亚胺但对混合物具有触变性的溶剂。 将混合物施加到基底上，将骰子放置在其上，并蒸发溶剂以将骰子结合到基底。 该粘合剂是辐射硬的并且表现出高的剪切拉力。 用于聚酰亚胺的不良溶剂喷涂在芯片附着材料的骰子和暴露部分上，导致一些聚酰亚胺从裸片附着材料的暴露部分中沉淀出溶液中以形成在骰子之间延伸的网格，并防止骰子“ 在高温加工过程中一起游泳。 在溶剂模具附着方法中，首先用基片附着材料的混合物涂覆基板，并将混合物干燥。 在模具附着材料上喷涂溶剂导致材料软化，使得施加到其上的骰子可以粘附。 然后将管芯附着材料干燥以形成粘合。

    Excimer laser patterning of a novel resist using masked and maskless process steps
    5.
    发明授权
    Excimer laser patterning of a novel resist using masked and maskless process steps 失效
    使用掩蔽和无掩模工艺步骤的新型抗蚀剂的准分子激光图案化

    公开(公告)号：US4842677A

    公开(公告)日：1989-06-27

    申请号：US224416

    申请日：1988-07-26

    申请人： Robert J. Wojnarowski ,  Charles W. Eichelberger

    发明人： Robert J. Wojnarowski ,  Charles W. Eichelberger

    IPC分类号： G03F7/11 ,  G03F7/095 ,  G03F7/20 ,  G03F7/26 ,  H01L21/027 ,  H01L23/538 ,  H05K3/00 ,  H05K3/06

    CPC分类号： H05K3/0082 ,  G03F7/095 ,  G03F7/2006 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K2203/0505 ,  H05K2203/0577 ,  H05K2203/107 ,  H05K3/0032 ,  H05K3/064

    摘要： A dual layer resist configuration is employed for photopatterning high resolution conductive patterns on underlying polymeric or ceramic substrates, particularly substrates exhibiting surface roughness and non-planar design features such as channels, bosses and ridges. More particularly, a thin underlayer of ablatable photoabsorptive polymer is disposed on a metal coated substrate, after which a thicker layer of substantially transparent material is disposed over the polymer. A beam of laser energy, such as that produced by an ultraviolet excimer layer, is directed through the upper layer and is absorbed by the lower layer which is ablated and simultaneously removes the thick layer above it. This results in the ability to etch high resolution features on polymeric and other substrates, particularly copper coated polyetherimide circuit boards. The resist system is also applicable to VLSI wafers even though such wafers usually do not exhibit surface roughness on the scale generally considered herein. It is also equally applicable in various high density interconnect systems used for the direct connection of chip devices. A mask for patterning and a method for making it are also seen to be desirable because of the high laser energy densities generally desired for thorough ablation. An alternate method is also disclosed which employs two laser exposure steps with the first step being a masked operation on only an ablatable layer and with the second step being an unmasked operation on a dual layer material.

    Cooking apparatus having internal pressurizing source and _integral heat source _
    8.
    发明授权
    Cooking apparatus having internal pressurizing source and _integral heat source _ 失效
    具有内部加压源和整体热源的烹饪设备

    公开(公告)号：US4430557A

    公开(公告)日：1984-02-07

    申请号：US336805

    申请日：1982-01-04

    申请人： Charles W. Eichelberger ,  Robert J. Wojnarowski ,  Thomas M. O'Loughlin

    发明人： Charles W. Eichelberger ,  Robert J. Wojnarowski ,  Thomas M. O'Loughlin

    IPC分类号： F24C7/04 ,  A47J27/00 ,  A47J27/16 ,  A47J37/06 ,  F27D11/02 ,  A21B1/00

    CPC分类号： A47J27/16 ,  A47J37/0623 ,  A47J37/0629

    摘要： A self-standing cooking apparatus is disclosed which consists of a pressurizable vessel having a door which can be latched and sealed, an integral steam-pressure source and integral upper and lower heating rod elements which serve as broil elements and bake elements, respectively, and a water-filled tray which can be disposed above the upper heating rod. An electrical control circuit enables selective energization of the bake and broil heat elements by continuous or controlled duration pulses of current which control the proportion of infrared energy that will be produced by the heating rods. The oven can be operated under pressure with the heating rods applying infrared radiation to the foodstuff being cooked in order to obtain browning or crisping of the foodstuff which is cooked at elevated pressure. The oven can also be operated in a conventional bake mode, a conventional broil mode, a steam cooking mode, a sealed cooking and warming mode and a toasting mode. Reinforcing fins lying in parallel planes are secured to and encircle the exterior of the container to provide necessary additional strength for the pressurizable vessel walls to withstand a maximum design pressure.

    摘要翻译： 公开了一种独立的烹饪设备，其包括具有可锁定和密封的门的可加压容器，分别用作烤肉元件和烘烤元件的整体蒸汽压力源和整体的上下加热棒元件，以及 可以设置在上加热棒上方的充水托盘。 电控制电路能够通过连续或受控持续的电流脉冲来选择性地激励烘烤和烘烤加热元件，从而控制由加热棒产生的红外能量的比例。 烘箱可以在压力下操作，加热棒将红外辐射施加到烹饪的食品上，以获得在升高的压力下烹饪的食物的褐变或脆化。 烘箱也可以以常规烘烤模式，常规烘烤模式，蒸汽烹饪模式，密封烹饪和加温模式以及烘烤模式操作。 位于平行平面上的加强肋被固定在容器的外部并且环绕容器的外部，以便为可加压容器壁承受最大设计压力提供必要的附加强度。

    Fabrication of electrical conductor by replacement of metallic powder in polymer with more noble metal
    9.
    发明授权
    Fabrication of electrical conductor by replacement of metallic powder in polymer with more noble metal 失效
    通过用更贵金属代替聚合物中的金属粉末来制造电导体

    公开(公告)号：US4404237A

    公开(公告)日：1983-09-13

    申请号：US220342

    申请日：1980-12-29

    申请人： Charles W. Eichelberger ,  Robert J. Wojnarowski

    发明人： Charles W. Eichelberger ,  Robert J. Wojnarowski

    IPC分类号： H05K1/09 ,  H05K3/24 ,  H05K3/12 ,  H05K3/18

    CPC分类号： H05K3/246 ,  H05K1/095

    摘要： A low-cost conductor, e.g. a printed circuit, is prepared by applying a mixture of a metallic powder and polymer on a substrate and curing the polymer, followed by an augmentation replacement reaction being effected to replace some of the metallic powder with a more noble metal in such a way that the total volume of deposited metal on the surface exceeds that of the original metal powder at that surface. This procedure produces contiguous layer of conducting metal on the substrate. The conductors thus formed can easily be soldered without leaching using a conventional tin-lead solders.

    摘要翻译： 低成本导体，例如 通过将金属粉末和聚合物的混合物施加到基底上并固化聚合物来制备印刷电路，然后进行增强置换反应以用更贵金属代替一些金属粉末，使得 表面上沉积金属的总体积超过了该表面的原始金属粉末的总体积。 该过程在衬底上产生连续的导电金属层。 如此形成的导体可以容易地使用常规的锡铅焊料进行浸出而不进行浸出。