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    Wafer level package structure with a heat slug
    1.
    发明授权
    Wafer level package structure with a heat slug 有权
    具有散热片的晶圆级封装结构

    公开(公告)号：US06946729B2

    公开(公告)日：2005-09-20

    申请号：US10417693

    申请日：2003-04-17

    申请人： Chun-Chi Lee ,  Su Tao

    发明人： Chun-Chi Lee ,  Su Tao

    IPC分类号： H01L23/31 ,  H01L23/433 ,  H01L23/34 ,  H01L23/02 ,  H01L23/48 ,  H01L23/495 ,  H05K7/20

    CPC分类号： H01L24/49 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

    摘要： A wafer level package structure and a method for packaging said wafer level package structure are described. The wafer level package structure at least comprises a die, a heat slug covering said die, a carrier for supporting said heat slug and said die, a plurality of wires electrically connecting said die and said carrier, and a mould compound encapsulating said die, said carrier, said heat slug and said wires. The method comprises the steps of: (a)providing a heat slug metal with a plurality of openings; (b)mounting said heat slug metal onto a wafer to dispose said openings on corresponding bonding pads of the wafer so as to expose said bonding pads; (c)sawing said combined heat slug metal and wafer into a plurality of die units; (d)attaching said die unit onto a carrier; (e)electrically connecting a plurality of wires to said die unit and said carrier; (f)encapsulating said wired die unit and said carrier. In the present invention, the heat slug metal and wafer can be sawed into a plurality of die units at the same time to improve the defect of the complicated process of individually sawing heat slug metal and wafer and individually combining heat slug metal and wafer in the conventional method.

    摘要翻译： 描述了晶片级封装结构和用于封装晶片级封装结构的方法。 晶片级封装结构至少包括一个管芯，一个覆盖所述管芯的散热片，一个用于支撑所述加热块和所述管芯的载体，多个电连接所述管芯和所述载体的电线以及封装所述管芯的模具化合物， 载体，所述热塞和所述电线。 该方法包括以下步骤：（a）提供具有多个开口的热块金属; （b）将所述加热块金属安装在晶片上以将所述开口布置在所述晶片的对应的焊盘上，以暴露所述焊盘; （c）将所述组合的热块金属和晶片锯切成多个模具单元; （d）将所述模具单元附接到载体上; （e）将多根电线电连接到所述模具单元和所述载体上; （f）封装所述有线芯片单元和所述载体。 在本发明中，可以同时将散热块金属和晶片锯成多个模具单元，以改善单独锯切热芯金属和晶片的复杂工艺的缺陷，并且将热块金属和晶片分别组合在 常规方法。