公开(公告)号：USD593993S1

公开(公告)日：2009-06-09

申请号：US29326882

申请日：2008-10-27

申请人： Han Kim ,  Eui-Hoon Kim

设计人： Han Kim ,  Eui-Hoon Kim

公开(公告)号：US08853560B2

公开(公告)日：2014-10-07

申请号：US13411005

申请日：2012-03-02

申请人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

发明人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

IPC分类号： H05K1/11 ,  H05K1/02

CPC分类号： H05K1/0236 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/115 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T428/12465

摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.

摘要翻译： 公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。

公开(公告)号：US08699234B2

公开(公告)日：2014-04-15

申请号：US12984935

申请日：2011-01-05

申请人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

发明人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

IPC分类号： H05K1/18

CPC分类号： H05K1/0236 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/3025 ,  H05K3/4694

摘要： An EMI noise shield board, in which an EBG structure is inserted, includes a first board portion and a second board portion. The first board portion has an upper surface, on which an electronic part is disposed, and a circuit for transferring a signal and power to the electronic part. The second board portion is located on a lower surface of the first board portion. The electromagnetic bandgap structure is inserted into the second board portion, and has a band stop frequency property such that an EMI noise transferred from the first board portion is shielded from being radiated to the outside of the EMI noise shield board.

摘要翻译： 其中插入有EBG结构的EMI噪声屏蔽板包括第一板部分和第二板部分。 第一板部分具有设置有电子部件的上表面和用于将信号和电力传送到电子部件的电路。 第二板部分位于第一板部分的下表面上。 电磁带隙结构被插入到第二板部分中，并且具有阻挡频率特性，使得从第一板部分传送的EMI噪声被屏蔽而不被辐射到EMI噪声屏蔽板的外部。

公开(公告)号：US08432706B2

公开(公告)日：2013-04-30

申请号：US12654541

申请日：2009-12-22

申请人： Han Kim ,  Chang-Sup Ryu

发明人： Han Kim ,  Chang-Sup Ryu

IPC分类号： H05K1/11

CPC分类号： H05K1/0237 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/3025 ,  H01Q1/526 ,  H05K1/0224 ,  H05K1/0236 ,  H05K1/0298 ,  H05K1/144 ,  H05K1/183 ,  H05K9/0009 ,  H05K9/0052 ,  H05K2201/09681 ,  H05K2201/10371

摘要： A printed circuit board and an electronic product are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a first board, which has an electronic component mounted thereon, and a second board, which is positioned on an upper side of the first board and covers at least a portion of an upper surface of the first board and in which an EBG structure is inserted into the second board such that a noise radiating upwards from the first board is shielded. Thus, the printed circuit board can readily absorb various frequencies, be easily applied without any antenna effect and be cost-effective in manufacturing.

摘要翻译： 公开了印刷电路板和电子产品。 根据本发明的实施例，印刷电路板包括：第一板，其上安装有电子部件;第二板，其位于第一板的上侧，并且覆盖至少一部分 第一板的上表面，并且其中EBG结构插入到第二板中，使得从第一板向上辐射的噪声被屏蔽。 因此，印刷电路板可以容易地吸收各种频率，容易应用而没有任何天线效应，并且在制造中是成本有效的。

公开(公告)号：US08368488B2

公开(公告)日：2013-02-05

申请号：US12155941

申请日：2008-06-11

申请人： Han Kim ,  Hyung-Sik Choi ,  Sang-Hoon Kim ,  Joon-Sung Kim

发明人： Han Kim ,  Hyung-Sik Choi ,  Sang-Hoon Kim ,  Joon-Sung Kim

IPC分类号： H01P1/203

CPC分类号： H05K1/116 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2224/0401

摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer, and an odd number of vias can be serially connected through a metal line between the first metal layer and the metal plate. This electromagnetic bandgap structure can have a small size and a low bandgap frequency.

摘要翻译： 公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构层叠有第一金属层，第一介电层，金属板，第二介电层和第二金属层，并且可以串联奇数个通孔 通过第一金属层和金属板之间的金属线连接。 该电磁带隙结构可以具有小尺寸和低带隙频率。

公开(公告)号：US08289099B2

公开(公告)日：2012-10-16

申请号：US12568362

申请日：2009-09-28

申请人： Han Kim ,  Ja-Bu Koo ,  Dae-Hyun Park

发明人： Han Kim ,  Ja-Bu Koo ,  Dae-Hyun Park

IPC分类号： H03H7/00

CPC分类号： H01P1/2005 ,  H01P1/203 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure includes: first conductive plates, placed on a first planar surface, in which the first conductive plates are lined up in a first direction; second conductive plates, placed on a second planar surface and arranged at an area corresponding to an area in which the first conductive plates are disposed, in which the second conductive plates are lined up in the first direction; a first stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the first planar surface; and a second stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the second planar surface.

摘要翻译： 电磁带隙结构包括：第一导电板，放置在第一平面上，第一导电板沿第一方向排列; 第二导电板，放置在第二平坦表面上并且布置在与设置有第一导电板的区域相对应的区域中，其中第二导电板沿第一方向排列; 第一缝合通孔，将任何两个相邻的导电部分彼此电连接，并且其中两个相邻的导电部分沿与第一平坦表面上的第一方向不同的方向排列; 以及第二缝合通孔，将任何两个相邻的导电部彼此电连接，并且其中两个相邻的导电部分在与第二平面上的第一方向不同的方向上排列。

公开(公告)号：US20110315440A1

公开(公告)日：2011-12-29

申请号：US13137632

申请日：2011-08-30

申请人： Han Kim

发明人： Han Kim

IPC分类号： H05K1/11

CPC分类号： H01P1/2005 ,  H01Q15/006 ,  H01Q15/008 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/0969

摘要： An electromagnetic bandgap structure and a printed circuit board that have a mushroom type structure. The electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, layer-built on the first metal layer; a mushroom type structure having a metal plate layer-built on the first dielectric layer and a via of which one end is connected to the metal plate; a second dielectric layer, layer-built on the metal plate and the first dielectric layer; and a second metal layer, layer-built on the second dielectric layer, wherein the other end of the via is placed in a hole formed on the first metal layer and is connected to the first metal layer through a metal line.

摘要翻译： 具有蘑菇型结构的电磁带隙结构和印刷电路板。 电磁带隙结构包括第一金属层; 第一电介质层，其被构建在第一金属层上; 具有建立在第一电介质层上的金属板层的蘑菇型结构和其一端连接到金属板的通孔; 第二电介质层，层叠在金属板和第一介电层上; 以及第二金属层，其构造在所述第二电介质层上，其中所述通孔的另一端位于形成在所述第一金属层上的孔中，并且通过金属线连接到所述第一金属层。

公开(公告)号：US20110197409A1

公开(公告)日：2011-08-18

申请号：US13064847

申请日：2011-04-20

申请人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

发明人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

IPC分类号： H01G7/00

CPC分类号： H05K1/162 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09563 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method of fabricating a cavity capacitor embedded in a printed circuit board including two conductive layers to be used as a power layer and a ground layer, respectively, and a first dielectric layer, placed between the two conductive layers, the method including: removing an upper conductive layer and the first dielectric layer excluding a lower conductive layer of the two conductive layers to allow a cavity to be formed between the two conductive layers, the lower conductive layer being supposed to be used as any one of electrodes of the cavity capacitor; stacking a dielectric material on the cavity to allow a second dielectric layer having a lower stepped portion than the first dielectric layer to be formed in the cavity; and stacking a conductive material on an upper part of the second dielectric layer and side parts of the cavity to allow the upper conductive layer to be used as the other electrode of the cavity capacitor.

摘要翻译： 一种嵌入在印刷电路板中的空腔电容器的方法，包括分别用作功率层和接地层的两个导电层和放置在两个导电层之间的第一介电层，所述方法包括： 上导电层和除了两个导电层的下导电层之外的第一电介质层，以允许在两个导电层之间形成腔，下导电层假定用作空腔电容器的任一电极; 在所述空腔上堆叠电介质材料以允许在所述空腔中形成具有比所述第一电介质层更低的台阶部分的第二电介质层; 并且在第二电介质层的上部和空腔的侧部上堆叠导电材料，以允许上部导电层用作空腔电容器的另一个电极。

公开(公告)号：US20110067914A1

公开(公告)日：2011-03-24

申请号：US12654361

申请日：2009-12-17

申请人： Hyo-Jic Jung ,  Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Dae-Hyun Park

发明人： Hyo-Jic Jung ,  Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Dae-Hyun Park

IPC分类号： H05K9/00 ,  H05K1/11

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

摘要： Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductor and a second conductor arranged on different planar surfaces, a third conductor arranged on a same planar surface that is different from a planar surface where the second conductor is arranged, and a first stitching via unit configured to connect the first conductor to the third connector through the planar surface where the second conductor is arranged and being electrically separated from the second conductor. The first conductor can include a first plate, a second plate spaced from the first plate, and a second stitching unit configured to electrically connect the first plate to the second plate through a planar surface that is different from a planar surface where the first plate and the second plate are arranged.

摘要翻译： 公开了一种印刷电路板，其中插入用于阻挡噪声的电磁带隙结构。 电磁带隙结构可以包括布置在不同平面上的第一导体和第二导体，布置在与布置第二导体的平面不同的相同平面上的第三导体，以及第一缝合通孔单元， 通过布置第二导体的平面表面将第一导体连接到第三连接器，并与第二导体电分离。 第一导体可以包括第一板，与第一板间隔开的第二板，以及第二缝合单元，其被配置为通过与第一板和第二板的平坦表面不同的平面表面将第一板电连接到第二板 布置第二板。

公开(公告)号：US07888599B2

公开(公告)日：2011-02-15

申请号：US12203081

申请日：2008-09-02

申请人： Young Woo Kim ,  Byoung Youl Min ,  Chang Myung Ryu ,  Woo Lim Chae ,  Han Kim

发明人： Young Woo Kim ,  Byoung Youl Min ,  Chang Myung Ryu ,  Woo Lim Chae ,  Han Kim

IPC分类号： H05K1/00

CPC分类号： H05K1/162 ,  H05K3/0047 ,  H05K3/427 ,  H05K2201/0187 ,  H05K2201/09645 ,  H05K2201/09836 ,  H05K2201/09981 ,  H05K2203/1476 ,  Y10T29/49155 ,  Y10T29/49156

摘要： Disclosed is a PCB including an embedded capacitor and a method of fabricating the same. The long embedded capacitor is formed through an insulating layer, making a high capacitance and various capacitance designs possible.

摘要翻译： 公开了一种包括嵌入式电容器的PCB及其制造方法。 长的嵌入式电容器通过绝缘层形成，使得高电容和各种电容设计成为可能。