公开(公告)号：US5113000A

公开(公告)日：1992-05-12

申请号：US622663

申请日：1990-12-05

申请人： Hisao Motegi ,  Takeshi Sunaga ,  Michio Zembayashi

发明人： Hisao Motegi ,  Takeshi Sunaga ,  Michio Zembayashi

IPC分类号： C07F7/12 ,  C07F7/18

CPC分类号： C07F7/1836 ,  C07F7/12 ,  C07F7/182

摘要： An organosilicon compound represented by the general formula: ##STR1## where R.sup.1 represents a substituted or non-substituted monovalent hydrocarbon group, X represents a chloromethyl group, (meth)acryloxymethyl group, glycidoxymethyl group or aminomethyl group, Y represents a hydrolyzable group or hydroxyl group, n represents a number of 1, 2 or 3. The compound is useful, for example, for the improvement of adhesion between the organic and inorganic materials.

摘要翻译： 由以下通式表示的有机硅化合物：其中R1表示取代或未取代的单价烃基，X表示氯甲基，（甲基）丙烯酰氧基甲基，缩水甘油氧基甲基或氨基甲基，Y表示可水解基团或羟基 基团，n表示1,2或3.该化合物可用于例如改善有机和无机材料之间的粘合性。

公开(公告)号：US5059707A

公开(公告)日：1991-10-22

申请号：US499875

申请日：1990-03-27

申请人： Hisao Motegi ,  Takeshi Sunaga ,  Michio Zenbayashi

发明人： Hisao Motegi ,  Takeshi Sunaga ,  Michio Zenbayashi

IPC分类号： C07F7/08 ,  C08G18/38 ,  C08G18/61 ,  C08G63/695 ,  C08G77/16 ,  C08G77/22 ,  C08G77/38 ,  C08G77/50

CPC分类号： C08G77/38 ,  C07F7/0852 ,  C08G18/3893 ,  C08G18/61 ,  C08G63/6954 ,  C08G77/16 ,  C08G77/50

摘要： A hydroxyl group-containing organosilicon compound represented by formula (I) ##STR1## wherein R which may be the same or different each represents an alkyl group, an aryl group, or an alkenyl group, and n is 0 or an integer of 1 to 1,000. The compound can be suitably used for modification of surface properties of synthetic resins.

摘要翻译： 由式（I）表示的含羟基的有机硅化合物（I）其中R可以相同或不同，各自表示烷基，芳基或烯基，n为0或整数 为1至1,000。 该化合物可适用于合成树脂表面性能的改性。

公开(公告)号：US5115069A

公开(公告)日：1992-05-19

申请号：US499740

申请日：1990-03-27

申请人： Hisao Motegi ,  Takeshi Sunaga ,  Michio Zenbayashi

发明人： Hisao Motegi ,  Takeshi Sunaga ,  Michio Zenbayashi

IPC分类号： C07F7/08 ,  C08G77/14 ,  C08G77/22 ,  C08G77/38

CPC分类号： C08G77/14 ,  C07F7/0852 ,  C08G77/38

摘要： A glycidoxy group-containing organosilicon compound represented by formula (I) ##STR1## wherein R which may be the same or different each represents an alkyl group, an aryl group, or an alkenyl group, and n is 0 or an integer of 1 to 1,000. The compound is useful for modification of interfacial properties of various synthetic resins such as epoxy resins, polyesters, polyurethanes, polyamides and polyimides.

摘要翻译： 由式（I）表示的含缩水甘油氧基的有机硅化合物其中R可以相同或不同，各自表示烷基，芳基或烯基，n为0或整数 为1至1,000。 该化合物可用于改性各种合成树脂如环氧树脂，聚酯，聚氨酯，聚酰胺和聚酰亚胺的界面性能。

公开(公告)号：US20140021627A1

公开(公告)日：2014-01-23

申请号：US14009993

申请日：2012-04-02

申请人： Akihiro Kimura ,  Takeshi Sunaga

发明人： Akihiro Kimura ,  Takeshi Sunaga

IPC分类号： H01L23/00

CPC分类号： H01L24/81 ,  H01L21/52 ,  H01L21/56 ,  H01L21/568 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/71 ,  H01L24/90 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/11005 ,  H01L2224/1146 ,  H01L2224/16104 ,  H01L2224/16221 ,  H01L2224/16225 ,  H01L2224/16501 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2924/15174 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.

摘要翻译： 半导体器件设置有具有多个电极的半导体元件，与多个电极电连接的多个端子和覆盖该半导体元件的密封树脂。 密封树脂覆盖多个端子，使得半导体元件的厚度方向的底面露出。 作为多个端子之一的第一端子被设置在与从厚度方向观察时与多个电极中的一个电极重叠的位置。 半导体器件设置有与第一端子和第一电极接触的导电连接构件。

公开(公告)号：US4580523A

公开(公告)日：1986-04-08

申请号：US703620

申请日：1985-02-21

申请人： Takeshi Sunaga ,  Kiyoshi Suzuki ,  Takayuki Yuzawa

发明人： Takeshi Sunaga ,  Kiyoshi Suzuki ,  Takayuki Yuzawa

IPC分类号： B23K1/08 ,  B23K1/16 ,  B23K3/06 ,  H01L23/50 ,  H05K3/34 ,  B05C13/00

CPC分类号： B23K3/0676 ,  H01L2924/0002 ,  Y10S269/903

摘要： A jig apparatus for arraying and supporting work to be soldered wherein a plurality of lower supporting bars for supporting the lower side of a work are arranged so as to extend in a frame designed to be mounted on a conveyor holder of an automatic soldering line, upper supporting bars are arranged so as to extend above and in parallel with the lower supporting bars to press the work from the upper side thereof. The upper supporting bars have one end fitted to the frame. A gate member supports the other end of the upper supporting bars and movable up and down with respect to the frame. Work insertion openings are formed in the frame such as to oppose the gate member. The lower supporting bars are made of elongated channel members with a substantially U-shaped cross-section, each of the elongated channel members having holes formed in the floor thereof.

摘要翻译： 一种用于排列和支撑要焊接的工件的夹具装置，其中用于支撑工件的下侧的多个下支撑杆布置成在设计成安装在自动焊接线的传送器保持器上的框架中延伸，上部 支撑杆布置成在下支撑杆的上方并与其平行地延伸，以将工件从其上侧按压。 上支撑杆的一端安装在框架上。 门构件支撑上支撑杆的另一端并相对于框架上下移动。 工作插入开口形成在框架中以与门构件相对。 下支撑杆由具有大致U形横截面的细长通道构件制成，每个细长通道构件具有形成在其底板中的孔。

公开(公告)号：US20140027891A1

公开(公告)日：2014-01-30

申请号：US14110131

申请日：2012-04-03

申请人： Akihiro Kimura ,  Takeshi Sunaga ,  Shouji Yasunaga ,  Akihiro Koga

发明人： Akihiro Kimura ,  Takeshi Sunaga ,  Shouji Yasunaga ,  Akihiro Koga

IPC分类号： H01L21/48 ,  H01L23/495

CPC分类号： H01L23/49568 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/4882 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/49175 ,  H01L2224/49177 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed

摘要翻译： 一种方法包括以下步骤：制备包括多个管芯焊盘的引线框架，并制备多个半导体芯片; 将每个所述半导体芯片设置在所述芯片焊盘的相应一个上; 形成密封树脂以覆盖芯片焊盘和半导体芯片; 并且通过在形成密封树脂之后通过作为粘合剂层的树脂片将散热板压靠在模片垫上而将散热板附接到模片垫

公开(公告)号：US20080311376A1

公开(公告)日：2008-12-18

申请号：US11658340

申请日：2005-07-29

申请人： Mizuho Matsuda ,  Kazutaka Kamitani ,  Takeshi Sunaga ,  Takeshi Yabuta

发明人： Mizuho Matsuda ,  Kazutaka Kamitani ,  Takeshi Sunaga ,  Takeshi Yabuta

IPC分类号： B32B5/18 ,  B05D5/06

CPC分类号： C03C17/42 ,  C03C1/008 ,  C03C17/007 ,  C03C2217/425 ,  C03C2217/478 ,  Y10T428/249985

摘要： The present invention improves abrasion resistance and persistence of anti-fogging properties of an anti-fogging article. The anti-fogging article of the present invention includes an article, a porous film formed on the surface thereof, and a hydrophilic film formed thereon. The porous film contains inorganic fine particles and a binder. The binder covers at least a part of surfaces of the inorganic fine particles and is interposed between the inorganic fine particles. The binder contains a metal oxide as its main component and a hydrophilic organic group other than an alkoxyl group. The hydrophilic film contains a hydrophilic organic polymer.

摘要翻译： 本发明提高了防雾制品的耐磨性和防雾性能的持续性。 本发明的防雾物品包括物品，在其表面上形成的多孔膜和在其上形成的亲水膜。 多孔膜含有无机微粒和粘合剂。 粘合剂覆盖无机细颗粒的至少一部分表面，并且介于无机细颗粒之间。 粘合剂含有作为主要成分的金属氧化物和除烷氧基以外的亲水性有机基团。 亲水性膜含有亲水性有机聚合物。

公开(公告)号：US6090873A

公开(公告)日：2000-07-18

申请号：US750745

申请日：1996-12-20

申请人： Junko Okibe ,  Minoru Inoue ,  Motoaki Haruna ,  Ayumu Yasuda ,  Takeshi Sunaga ,  Yasuyo Iwabuchi ,  Norio Sato

发明人： Junko Okibe ,  Minoru Inoue ,  Motoaki Haruna ,  Ayumu Yasuda ,  Takeshi Sunaga ,  Yasuyo Iwabuchi ,  Norio Sato

IPC分类号： C03C17/00 ,  C04B41/49 ,  C04B41/50 ,  C04B41/52 ,  C04B41/64 ,  C04B41/65 ,  C04B41/70 ,  C08L83/04 ,  C09D133/06 ,  C09D183/04 ,  C09D183/07 ,  C08K3/34

CPC分类号： C04B41/009 ,  C03C17/009 ,  C04B41/495 ,  C04B41/5035 ,  C04B41/52 ,  C04B41/64 ,  C04B41/65 ,  C04B41/70 ,  C09D133/06 ,  C09D183/04 ,  C04B2111/2038 ,  C08L2205/02 ,  C08L83/04

摘要： A coating resin composition is able to form a coating film having not only high hardness and weatherability but also high toughness, and can be cured both at room temperature and by heating curing, and further which is good at storage stability.The coating resin composition consists essentially of a silica-dispersed oligomer solution of organosilane prepared by partially hydrolyzing a hydrolyzable organosilane represented by a formula R.sup.1.sub.n SiX.sub.4-n, in colloidal silica dispersed in an organic solvent, water or a mixture thereof, and an acrylic resin which is a copolymer of acrylate or methacrylate represented by a formula, CH.sub.2 .dbd.CR.sup.2 (COOR.sup.3), and a curing catalyst. This composition is used by separating the components into two solutions and then mixing thereof as required. A resin-coated article comprises a cured resin layer of the coating resin composition on the surface of a substrate.

摘要翻译： PCT No.PCT / JP96 / 01036 Sec。 371日期1997年04月30日 102（e）1997年4月30日PCT PCT 1996年4月16日PCT公布。 公开号WO96 / 33243 日期1996年10月24日涂料树脂组合物能够形成不仅具有高硬度和耐候性，而且具有高韧性的涂膜，并且可以在室温下固化并通过加热固化，进一步具有良好的储存稳定性。 涂料树脂组合物基本上由分散在有机溶剂中的胶体二氧化硅，水或其混合物中的部分水解由式R1nSiX4-n表示的可水解有机硅烷，水或其混合物的丙烯酸树脂部分水解制备的有机硅烷的二氧化硅分散的低聚物溶液组成， 是由式CH 2 = CR 2（COOR 3）表示的丙烯酸酯或甲基丙烯酸酯与固化催化剂的共聚物。 通过将组分分离成两种溶液然后根据需要进行混合来使用该组合物。 树脂涂布制品包括在基材表面上的涂覆树脂组合物的固化树脂层。

公开(公告)号：US09324677B2

公开(公告)日：2016-04-26

申请号：US14009993

申请日：2012-04-02

申请人： Akihiro Kimura ,  Takeshi Sunaga

发明人： Akihiro Kimura ,  Takeshi Sunaga

IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L21/56 ,  H01L23/495 ,  H01L25/065 ,  H01L23/31

CPC分类号： H01L24/81 ,  H01L21/52 ,  H01L21/56 ,  H01L21/568 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/71 ,  H01L24/90 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/11005 ,  H01L2224/1146 ,  H01L2224/16104 ,  H01L2224/16221 ,  H01L2224/16225 ,  H01L2224/16501 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2924/15174 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.

摘要翻译： 半导体器件设置有具有多个电极的半导体元件，与多个电极电连接的多个端子和覆盖该半导体元件的密封树脂。 密封树脂覆盖多个端子，使得半导体元件的厚度方向的底面露出。 作为多个端子之一的第一端子被设置在与从厚度方向观察时与多个电极中的一个电极重叠的位置。 半导体器件设置有与第一端子和第一电极接触的导电连接构件。

公开(公告)号：US09093434B2

公开(公告)日：2015-07-28

申请号：US14110131

申请日：2012-04-03

申请人： Akihiro Kimura ,  Takeshi Sunaga ,  Shouji Yasunaga ,  Akihiro Koga

发明人： Akihiro Kimura ,  Takeshi Sunaga ,  Shouji Yasunaga ,  Akihiro Koga

IPC分类号： H01L21/48 ,  H01L23/495 ,  H01L23/31 ,  H01L23/433 ,  H01L21/56 ,  H01L23/36 ,  H01L23/00

CPC分类号： H01L23/49568 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/4882 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/49175 ,  H01L2224/49177 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.

摘要翻译： 一种方法包括以下步骤：制备包括多个管芯焊盘的引线框架，并制备多个半导体芯片; 将每个所述半导体芯片设置在所述芯片焊盘的相应一个上; 形成密封树脂以覆盖芯片焊盘和半导体芯片; 以及通过在形成密封树脂之后通过作为粘合剂层的树脂片将散热板压靠在冲模焊盘上而将散热板附接到模具衬垫。