Method for fabricating nitride semiconductor device
    4.
    发明授权
    Method for fabricating nitride semiconductor device 有权
    氮化物半导体器件的制造方法

    公开(公告)号:US06518082B1

    公开(公告)日:2003-02-11

    申请号:US09805767

    申请日:2001-03-16

    IPC分类号: H01L2100

    摘要: First, the substrate temperature is set to 1020° C., and an n-type cladding layer (14) made of n-type Al0.1Ga0.9N, an n-type optical guide layer (15) made of n-type GaN, and a flatness maintenance layer (16) made of n-type Al0.2Ga0.8N for maintaining the surface flatness of the n-type optical guide layer (15) by suppressing re-evaporation of the constituent atoms of the n-type optical guide layer (15), are grown in this order on a substrate (11) made of sapphire. Then, the supply of a group III material gas is stopped, the substrate temperature is decreased to 780° C., and the carrier gas is switched from a hydrogen gas to a nitrogen gas. Then, an active layer (17) having a multiple quantum well structure is grown by introducing NH3 as a group V source and selectively introducing TMI and TMG as a group III source.

    摘要翻译: 首先,将衬底温度设定为1020℃,由n型Al 0.1 Ga 0.9 N构成的n型覆层(14),由n型GaN构成的n型光导层(15) 以及由n型Al 0.2 Ga 0.8 N制成的平面维持层(16),用于通过抑制n型光导体(15)的构成原子的再蒸发来维持n型光导层(15)的表面平坦度 引导层(15)依次生长在由蓝宝石制成的基板(11)上。 然后,停止供给III族原料气体,将基板温度降低至780℃,并将载气从氢气切换为氮气。 然后,通过引入NH 3作为V族源并选择性地引入作为III族源的TMI和TMG,生长具有多量子阱结构的活性层(17)。