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公开(公告)号:US20130256914A1
公开(公告)日:2013-10-03
申请号:US13586629
申请日:2012-08-15
IPC分类号: H01L25/00 , H01L21/768
CPC分类号: H01L24/81 , H01L21/56 , H01L23/3114 , H01L23/3121 , H01L23/49811 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/85 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/04042 , H01L2224/05557 , H01L2224/05571 , H01L2224/05611 , H01L2224/05613 , H01L2224/05616 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06155 , H01L2224/131 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/81192 , H01L2224/85 , H01L2225/0651 , H01L2225/06513 , H01L2225/06541 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/15311 , H01L2924/15321 , H01L2924/181 , H01L2924/18161 , H01L2924/00 , H01L2224/45099 , H01L2924/014 , H01L2224/05552 , H01L2924/00012
摘要: The described embodiments of forming bonding structures for package on package involves removing a portion of connectors and molding compound of the lower package. The described bonding mechanisms enable easier placement and alignment of connectors of an upper package to with connector of a lower package. As a result, the process window of the bonding process is wider. In addition, the bonding structures have smoother join profile and planar joint plane. As a result, the bonding structures are less likely to crack and also are less likely to crack. Both the yield and the form factor of the package on package structure are improved.
摘要翻译: 所形成的用于包装在包装上的粘合结构的实施例包括去除连接器的一部分和下封装的模塑料。 所描述的接合机构使得能够更容易地将上部封装的连接器放置和对准到具有较低封装的连接器。 结果,接合过程的过程窗口更宽。 此外,接合结构具有更平滑的接合轮廓和平面接合平面。 结果,接合结构不太可能破裂,也不易破裂。 包装结构上的包装的产量和形状因数均得到改善。
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公开(公告)号:US20140048926A1
公开(公告)日:2014-02-20
申请号:US13585500
申请日:2012-08-14
申请人: Tsung-Ding WANG , Jung Wei CHENG , Bo-I LEE
发明人: Tsung-Ding WANG , Jung Wei CHENG , Bo-I LEE
IPC分类号: H01L23/485 , H01L21/60
CPC分类号: H01L23/3185 , H01L21/302 , H01L21/561 , H01L21/565 , H01L21/6836 , H01L21/78 , H01L23/3114 , H01L23/3178 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/94 , H01L2221/6834 , H01L2224/0401 , H01L2224/05009 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05572 , H01L2224/0558 , H01L2224/05611 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05681 , H01L2224/05686 , H01L2224/11334 , H01L2224/1134 , H01L2224/11849 , H01L2224/1191 , H01L2224/13005 , H01L2224/13022 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/94 , H01L2924/10156 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/04941 , H01L2924/04953 , H01L2224/11 , H01L2224/03 , H01L2924/206 , H01L2924/00 , H01L2924/014 , H01L2924/01047
摘要: A semiconductor package includes a passivation layer overlying a semiconductor substrate, a bump overlying the passivation layer, and a molding compound layer overlying the passivation layer and covering a lower portion of the bump. A sidewall of the passivation layer is covered by the molding compound layer.
摘要翻译: 半导体封装包括覆盖半导体衬底的钝化层,覆盖钝化层的凸块以及覆盖钝化层并覆盖凸块下部的模塑复合层。 钝化层的侧壁被模塑料层覆盖。
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