摘要:
A method of preventing diffusion penetration of the dopant used to dope polysilicon gate material in a MOSFET is disclosed. Atomic nitrogen is introduced into the substrate prior to gate oxide growth. The nitrogen later diffuses upward into the gate oxide and blocks subsequent ion implanted gate dopants from penetrating to the substrate. Low dosages of atomic nitrogen implantation, while not significantly affecting gate oxide growth rate, produce significant improvements in the damage immunity of thin gate oxides.
摘要:
An electrophoretic display and a driving method thereof are provided. The electrophoretic display includes a display panel, a storage unit and a timing controller. The display panel has a plurality of sub pixels. The storage unit stores a plurality of sets of multiple-grayscale driving waveforms, in which the driving voltage scales of driving waveforms corresponding to a same grayscale in the sets of multiple-grayscale driving waveforms are different from each other. The timing controller is coupled to the storage unit and the display panel and receives an image signal, and when the image signal transmits a multiple-grayscale frame, the timing controller sequentially adopts the sets of multiple-grayscale driving waveforms to drive the sub pixels.
摘要:
A method for fabricating a bipolar transistor includes forming a vertical sequence of semiconductor layers, forming an implant mask on the last formed semiconductor layer, and implanting dopant ions into a portion of one or more of the semiconductor layers. The sequence of semiconductor layers includes a collector layer, a base layer that is in contact with the collector layer, and an emitter layer that is in contact with the base layer. The implanting uses a process in which the implant mask stops dopant ions from penetrating into a portion of the sequence of layers.
摘要:
An integrated circuit includes a semiconductor substrate with semiconductor devices formed therein and thereon, a first wiring layer located over the substrate, a second wiring layer located on the first wiring layer, and a capacitor. The capacitor has metal-based charge-storage electrodes that extend through the second wiring layer and at least part of the first wiring layer. The wiring layers have interconnect wire embedded therein.
摘要:
A complementary device consisting of a PMOS TFT transistor and an NMOS FET transistor uses a conducting layer to shunt drain regions of the transistors to eliminate any detrimental diode or p-n junction effects. The use of the conducting layer significantly improves the current drive capabilities of the PMOS TFT when the complementary device is used to design SRAM cells with NMOS pull-down transistors.
摘要:
A method for fabricating a multi-level integrated circuit is disclosed which utilizes a grid pattern from which portions corresponding to the metal layer are selectively removed to form a mask which is subsequently used to deposit dummy features in the open areas between metal lines, thereby to allow the deposition of a substantially planar dielectric surface over the metal layers and dummy features.
摘要:
The longitudinal edges of the overlying channel layer of a thin-film transistor are substantially aligned with the longitudinal edges of the underlying polysilicon gate layer. As a result of this line-on-line arrangement of the channel and gate layers, integration area is minimized so that optimum integration density is achieved. Source-to-drain on current is increased as the result of the increased channel width gained from the sidewall section of the polysilicon gate, which may occur as a result of the permissible lateral extension of the body (channel) layer over one longitudinal edge of the channel gate layer due to a misalignment in lithography or processing delta.
摘要:
The present invention provides a method for adhering dielectric layers to metals, in particular inert metals, using an adhesive layer comprising silicon-rich silicon nitride. Good adhesion is achieved at temperatures of less than 300° C., thereby facilitating the fabrication of semiconductor structures containing II-VI and III-V semiconductors.
摘要:
A method for fabricating a bipolar transistor includes forming a vertical sequence of semiconductor layers, forming an implant mask on the last formed semiconductor layer, and implanting dopant ions into a portion of one or more of the semiconductor layers. The sequence of semiconductor layers includes a collector layer, a base layer that is in contact with the collector layer, and an emitter layer that is in contact with the base layer. The implanting uses a process in which the implant mask stops dopant ions from penetrating into a portion of the sequence of layers.
摘要:
An integrated circuit device having reduced-height gate stack is fabricated by using a patterned oxide hard mask to pattern the underlying metal layer. The oxide mask is removed and the patterned metal is subsequently used as a mask to etch the polysilicon layer.