公开(公告)号：US5234153A

公开(公告)日：1993-08-10

申请号：US938195

申请日：1992-08-28

申请人： Donlad D. Bacon ,  Avishay Katz ,  Chien-Hsun Lee ,  King L. Tai ,  Yiu-Man Wong

发明人： Donlad D. Bacon ,  Avishay Katz ,  Chien-Hsun Lee ,  King L. Tai ,  Yiu-Man Wong

IPC分类号： H01L21/52 ,  B23K20/02 ,  B23K20/233 ,  B23K35/00 ,  H01L21/58 ,  H01L21/60 ,  H01L23/373 ,  H01L33/40 ,  H01L33/62 ,  H01S5/00 ,  H01S5/02 ,  H01S5/022

CPC分类号： H01L24/83 ,  B23K20/023 ,  B23K20/233 ,  B23K35/001 ,  H01L23/3732 ,  H01L24/29 ,  H01S5/022 ,  B23K2035/008 ,  H01L2224/04026 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/32014 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/157 ,  H01L33/40 ,  H01L33/62 ,  H01S5/02272 ,  H01S5/02484

摘要： A laser device is bonded to a diamond submount by means of a procedure including (1) codepositing an auxiliary layer, on a layer of barrier metal that has been deposited overlying the submount, followed by (2) depositing a wetting layer on the auxiliary layer, and (3) by depositing a solder layer comprising alternating metallic layers, preferably of gold and tin sufficient to form an overall tin-rich gold-tin eutectic composition. The barrier metal is typically W, Mo, Cr, or Ru. Prior to bonding, a conventional metallization such as Ti-Pt-Au (three layers) is deposited on the laser device's bottom ohmic contact, typically comprising Ge. Then, during bonding, the solder layer is brought into physical contact with the laser device's metallization under enough heat and pressure, followed by cooling, to form a permanent joint between them. The thickness of the solder layer is advantageously less than approximately 5 .mu.m. The wetting layer is preferably the intermetallic compound Ni.sub.3 Sn.sub.4, and the auxiliary layer is formed by codepositing the metallic components of this intermetallic together with the barrier metal.

公开(公告)号：US4703288A

公开(公告)日：1987-10-27

申请号：US719533

申请日：1985-04-03

申请人： Robert C. Frye ,  King L. Tai

发明人： Robert C. Frye ,  King L. Tai

IPC分类号： H01L21/822 ,  H01L21/3205 ,  H01L23/52 ,  H01L23/538 ,  H01L23/66 ,  H01L27/04 ,  H01P3/08

CPC分类号： H01L23/538 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011

摘要： In wafer-scale-integrated assemblies, microminiature transmission lines are utilized as interconnects on the wafer. The extremely small cross-sectional area of a typical such line results in its total line resistance being relatively large. Such a line exhibits signal reflections and resonances. In practice, it is not feasible to eliminate these effects by conventional load termination techniques. As a result, the frequency at which digital signals can be transmitted over such a line is typically limited to well below its so-called resonance limit. In accordance with a feature of the invention, the structural parameters of each line are selected to meet specified design criteria that ensure optimal high-frequency performance of the line.

摘要翻译： 在晶片级集成组件中，微型传输线被用作晶片上的互连。 典型的这种线的极小的横截面积导致其总线路电阻相对较大。 这样一条线表现出信号反射和谐振。 在实践中，通过传统的负载终止技术消除这些影响是不可行的。 结果，数字信号可以通过这种线传输的频率通常被限制在远远低于其所谓的共振极限。 根据本发明的特征，选择每条线的结构参数以满足确保线路的最佳高频性能的规定设计标准。

公开(公告)号：US5043794A

公开(公告)日：1991-08-27

申请号：US587308

申请日：1990-09-24

申请人： King L. Tai ,  John Thomson, Jr.

发明人： King L. Tai ,  John Thomson, Jr.

IPC分类号： H01L23/34 ,  H01L23/12 ,  H01L23/13 ,  H01L23/36 ,  H01L23/367 ,  H01L23/52 ,  H01L25/00 ,  H01L25/04 ,  H01L25/065 ,  H01L25/07 ,  H01L25/10 ,  H01L25/18 ,  H05K7/20

CPC分类号： H01L23/3672 ,  H01L23/13 ,  H01L25/105 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/49109 ,  H01L2225/1005 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2225/1094 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01066 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15156 ,  H01L2924/1532 ,  H01L2924/1627

摘要： In accordance with the present invention, an integrated circuit package comprises a thermally conductive plate for receiving an integrated circuit and an open rectangular structure of conductor and insulator for surrounding the sides of the circuit and presenting one or more linear arrays of conductive connectors extending laterally through the rectangular structure. Preferably the rectangular structure also includes transverse contacts. Advantageously the plate includes extensions beyond the rectangular structure for acting as cooling fins on opposing sides of the rectangular structure. The linear arrays and cooling fins are preferably on different pairs of parallel sides.

摘要翻译： 根据本发明，集成电路封装包括用于接收集成电路的导热板和用于围绕电路的侧面的导体和绝缘体的开放的矩形结构，并且呈现一个或多个横向延伸的导电连接器线性阵列 矩形结构。 优选地，矩形结构还包括横向接触。 有利地，板包括超过矩形结构的延伸部，用作在矩形结构的相对侧上的冷却片。 线性阵列和冷却片优选地在不同的平行侧对上。

公开(公告)号：US5000532A

公开(公告)日：1991-03-19

申请号：US431941

申请日：1989-11-06

申请人： Richard T. Kraetsch ,  Richard J. Pimpinella ,  Leonard W. Schaper ,  King L. Tai

发明人： Richard T. Kraetsch ,  Richard J. Pimpinella ,  Leonard W. Schaper ,  King L. Tai

IPC分类号： G02B6/35 ,  G02B6/36

CPC分类号： G02B6/3508 ,  G02B6/355 ,  G02B6/3572 ,  G02B6/3582 ,  G02B6/3652 ,  G02B6/3692

摘要： A precisely aligned optical fiber switch assembly. A base member has a vee groove for supporting a fixed optical fiber and a second optical fiber in optical alignment with the fixed fiber. The groove contains sections of different dimensions that receive and align sheathed portions of the fibers and groove sections that receive and align unsheathed portions of the fibers. First aligning means on the base member longitudinally position the fixed and second fibers in the groove. Covering means mate with the base member for covering at least part of the sheathed portions of the fibers. Aligning means position the covering means precisely with respect to the base member.

摘要翻译： 精密对准的光纤开关组件。 基座构件具有用于支撑固定光纤的vee槽和与固定光纤对准的第二光纤。 凹槽包含不同尺寸的部分，其接收和对准纤维的护套部分和容纳和对准纤维未固化部分的凹槽部分。 基体上的第一对准装置将固定和第二纤维纵向定位在槽中。 覆盖装置与基部构件配合以覆盖纤维的至少一部分护套部分。 对准装置将覆盖装置相对于基座构件精确地定位。

公开(公告)号：US4946236A

公开(公告)日：1990-08-07

申请号：US358912

申请日：1989-05-30

申请人： Mindaugas F. Dautartas ,  Yinon Degani ,  Richard T. Kraetsch ,  Richard J. Pimpinella ,  King L. Tai

发明人： Mindaugas F. Dautartas ,  Yinon Degani ,  Richard T. Kraetsch ,  Richard J. Pimpinella ,  King L. Tai

IPC分类号： G02B6/38 ,  G02B6/35 ,  G02B26/08

CPC分类号： G02B6/3508 ,  G02B6/3558 ,  G02B6/3562 ,  G02B6/3572

摘要： An m-input/n-output (e.g., 2.times.2) optical fiber switch is disclosed which alters the location of the fibers by the application of an external force. Illustratively, the switch uses a housing with a diamond-shaped opening extending therethrough, with pairs of optical fibers positioned in orthogonally located V-grooves. Upon the application of an external force, the fibers are moved into the remaining, vacant V-grooves formed by the diamond-shaped opening. In a preferred embodiment, a (2.times.2) switch is magnetically activated.

公开(公告)号：US5481205A

公开(公告)日：1996-01-02

申请号：US344393

申请日：1994-11-23

申请人： Robert C. Frye ,  Maureen Y. Lau ,  King L. Tai

发明人： Robert C. Frye ,  Maureen Y. Lau ,  King L. Tai

IPC分类号： H01L21/66 ,  G01R1/067 ,  G01R1/073 ,  G01R31/26 ,  H01L27/10 ,  H05K3/32 ,  G01R1/06 ,  H01L23/48

CPC分类号： H05K3/325 ,  G01R1/07307 ,  G01R1/06738 ,  H01L2924/0002

摘要： A given testing substrate for fast-testing many integrated-circuit electronic devices, one after the other, has a set of mutually insulated collated wiring areas that can be aligned with solder-bump I/O pads of the electronic devices. At the surface of each of the corrugated areas is located a layer that is an electrically conductive durable oxide, or that is itself durable, electrically conductive, and non-oxidizable. During testing, the solder-bump I/O pads of the electronic device being tested are aligned with and pressed against the corrugated wiring areas of the given substrate. Alternatively, the electronic devices being of the electrically programmable variety, such as EPROMs, programming voltages can be delivered to each of the devices, one after the other, through the corrugated wiring areas of a single substrate.

摘要翻译： 给定的用于快速测试许多集成电路电子器件的测试基板，一个接一个地具有一组可以与电子器件的焊料凸块I / O焊盘对准的相互绝缘的整理布线区域。 在每个波纹区域的表面上设置有导电耐用氧化物的层，或者其本身是耐用的，导电的和不可氧化的。 在测试期间，正在测试的电子器件的焊料凸块I / O焊盘与给定衬底的波纹布线区域对准并压紧。 或者，可以通过单个基板的波纹布线区域，一个接一个地将诸如EPROM的编程电压的电可编程品种的电子装置传送到每个装置。

公开(公告)号：US4670770A

公开(公告)日：1987-06-02

申请号：US582079

申请日：1984-02-17

申请人： King L. Tai

发明人： King L. Tai

IPC分类号： H01L23/14 ,  H01L23/485 ,  H01L23/538 ,  H01L23/64 ,  H01L29/06 ,  H01L29/04

CPC分类号： H01L24/02 ,  H01L23/147 ,  H01L23/538 ,  H01L23/5384 ,  H01L23/642 ,  H01L29/0657 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/01067 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15156 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107

摘要： In the interest of enhanced yield in the manufacture of "wafer-scale" integrated circuits an assembly of integrated circuit chips is made by placing chips on a substrate. Chips have beveled edges as produced by crystallographically anisotropic chemical etching, and the substrate has wells, grooves, or openings having sloping walls. Chips are positioned on the substrate by bringing sloping walls and beveled edges in juxtaposition, and circuitry on chips is connected to circuitry on the substrate.

摘要翻译： 为了在“晶片级”集成电路的制造中提高产量的优点，通过将芯片放置在衬底上来制成集成电路芯片的组件。 芯片具有通过晶体学各向异性化学蚀刻产生的斜边，并且基板具有具有倾斜壁的孔，凹槽或开口。 通过使倾斜的壁和倾斜的边缘并置来将芯片定位在基板上，并且芯片上的电路连接到基板上的电路。

公开(公告)号：US4496448A

公开(公告)日：1985-01-29

申请号：US541459

申请日：1983-10-13

申请人： King L. Tai ,  Frederick Vratny

发明人： King L. Tai ,  Frederick Vratny

IPC分类号： H01L21/302 ,  H01J37/32 ,  H01L21/3065 ,  C23C15/00

CPC分类号： H01J37/32174 ,  H01J37/32082 ,  H01J37/3299 ,  H01J2237/3341 ,  H01J2237/3345

摘要： A method and apparatus for fabricating a device is disclosed, which method involves a new reactive ion etching technique. Both a high etch rate and, for example, a high etch selectivity are simultaneously achieved with the inventive reactive ion etching technique by discharging an electrode of the reactive ion etching apparatus in response to a preselected criterion, e.g., a magnitude of a DC bias at said electrode which equals, or exceeds, a preselected value.

摘要翻译： 公开了一种用于制造器件的方法和装置，该方法包括新的反应离子蚀刻技术。 通过本发明的反应离子蚀刻技术，通过根据预先选择的标准放电反应离子蚀刻设备的电极，例如，高的蚀刻速率和例如高的蚀刻选择性 所述电极等于或超过预选值。

公开(公告)号：US4454221A

公开(公告)日：1984-06-12

申请号：US366646

申请日：1982-04-08

申请人： Cheng-Hsuan Chen ,  Edith C. Ong ,  James C. Phillips ,  King L. Tai

发明人： Cheng-Hsuan Chen ,  Edith C. Ong ,  James C. Phillips ,  King L. Tai

IPC分类号： H01L21/306 ,  G03F7/004 ,  G03F7/20 ,  G03F7/32 ,  H01L21/027 ,  H01L21/311 ,  G03C5/00

CPC分类号： G03F7/0043 ,  G03F7/32 ,  H01L21/31111

摘要： A method for enhancing linewidth control during the patterning of a substrate with a resist is disclosed. Resists used in the invention have chemically separated structures characterized by two types of regions of different chemical composition, which different types of regions are interspersed among each other. Because the resists used in the present invention have chemically separated structures, anisotropic wet development of these resists is achievable with an appropriate bicomponent wet developer. Consequently, after exposure, the image formed in a thin, upper layer of the resist is transferred with vertical walls through the thickness of the resist.

摘要翻译： 公开了一种在用抗蚀剂图案化衬底的过程中增强线宽控制的方法。 用于本发明的抗蚀剂具有化学分离的结构，其特征在于两种不同化学组成的区域，其中不同类型的区域彼此散布。 因为本发明中使用的抗蚀剂具有化学分离的结构，所以用适当的双组分湿式显影剂可以实现这些抗蚀剂的各向异性湿法显影。 因此，在曝光之后，形成在抗蚀剂的较薄上层的图像通过抗蚀剂的厚度以垂直壁转印。

公开(公告)号：US5622305A

公开(公告)日：1997-04-22

申请号：US438296

申请日：1995-05-10

申请人： Donald D. Bacon ,  Cheng-Hsuan Chen ,  Ho S. Chen ,  Avishay Katz ,  King L. Tai

发明人： Donald D. Bacon ,  Cheng-Hsuan Chen ,  Ho S. Chen ,  Avishay Katz ,  King L. Tai

IPC分类号： B23K35/00 ,  H01L21/58 ,  H01L23/14 ,  H01L23/373 ,  B23K31/02 ,  B23K1/20

CPC分类号： H01L24/83 ,  B23K35/001 ,  H01L23/147 ,  H01L23/3732 ,  H01L24/29 ,  B23K2035/008 ,  B23K35/007 ,  H01L2224/04026 ,  H01L2224/2908 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/07802 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T428/12819

摘要： A method for bonding one body to another, such as a laser device to a submount, uses a metallic layer composed of a Group VB metal, such as niobium, sandwiched between a non-metallic layer and solder layer formed by an approximate Au-Sn eutectic layer. Advantageously the Group VB layer is formed at a submount temperature of less than approximately 201.degree. C., advantageously less than approximately 125.degree. C., and preferably less than approximately 101.degree. C.--advantageously to a thickness in the approximate range 0.05 .mu.m to 0.2 .mu.m, or even thinner if pinholes do not develop. The non-metallic layer is located on one of the bodies, and the other body has a metallic coating advantageously capped with an Au layer.

摘要翻译： 将一体与另一体接合的方法，例如激光装置到基台，使用由诸如铌的VB族金属组成的金属层，夹在非金属层和由近似Au-Sn形成的焊料层之间 共晶层。 有利地，VB族VB层形成在小于约201℃，有利地小于约125℃，优选小于约101℃的底层温度下，有利地为约0.05μm的厚度 至0.2μm，如果针孔不发展，甚至更薄。 非金属层位于其中一个主体上，另一个主体具有有利于用Au层覆盖的金属涂层。