Method of breaking a brittle substrate
    2.
    发明申请
    Method of breaking a brittle substrate 有权
    破碎脆性基材的方法

    公开(公告)号:US20050263503A1

    公开(公告)日:2005-12-01

    申请号:US10524982

    申请日:2003-07-18

    摘要: The invention relates to a method of breaking a substrate of a brittle material, the method comprising the steps of providing a substrate (1) of a brittle material, heating the substrate with a laser beam (3) to create a heated spot on the substrate, moving the laser beam and the substrate with respect to each other to create a line of heated spots on the substrate (2), cooling the heated spots on the substrate by locally applying a cooling medium (4) behind the heated spots such that a micro-crack is propagated in the line of heated spots, and breaking the substrate along the line of the propagated micro-cracks by applying a mechanical force on the substrate wherein, the cooling medium comprises an aqueous surfactant solution. The surfactants will connect to the broken siloxane bonds inside the surface cracks. Then recombination and healing of the broken siloxane bonds will not occur and the required breaking load will remain constant over time.

    摘要翻译: 本发明涉及一种破碎脆性材料的基材的方法,所述方法包括以下步骤:提供脆性材料的基材(1),用激光束(3)加热基材以在基材上产生加热点 相对于彼此移动激光束和衬底以在衬底(2)上产生一线加热点,通过在加热点之后局部施加冷却介质(4)来冷却衬底上的加热点,使得 微裂纹在加热点的线中传播,并且通过在基底上施加机械力来破坏基底,沿着传播的微裂纹的线,其中冷却介质包含表面活性剂水溶液。 表面活性剂将连接到表面裂纹内的破裂的硅氧烷键。 然后,破裂的硅氧烷键的复合和愈合将不会发生,并且所需的断裂载荷随时间保持恒定。

    Method of manufacturing an electronic device
    4.
    发明申请
    Method of manufacturing an electronic device 审中-公开
    制造电子装置的方法

    公开(公告)号:US20070037411A1

    公开(公告)日:2007-02-15

    申请号:US11583276

    申请日:2006-10-18

    IPC分类号: H01L21/4757

    摘要: The electronic device with a layer of mesoporous silica can be obtained by applying a composition comprising alkoxysilane, a surfactant and a solvent onto a substrate, and by subsequently removing the surfactant and the solvent. The customary dehydroxylation treatment is not necessary if the composition contains a mixture of tetra-alkoxysilane, particularly teatraethoxyorthosilicate (TEOS), and an alkyl-substituted alkoxysilane, particularly a phenyl-substituted, methyl-substituted or ethyl-substituted trialkoxysilane. If both silanes are present in a molar ratio of approximately 1:1, a layer with a dielectric constant of 2.5 or less is obtained.

    摘要翻译: 具有介孔二氧化硅层的电子器件可以通过将包含烷氧基硅烷,表面活性剂和溶剂的组合物施加到基材上,并随后除去表面活性剂和溶剂来获得。 如果组合物含有四烷氧基硅烷,特别是原硅酸甲酯(TEOS)和烷基取代的烷氧基硅烷,特别是苯基取代的甲基取代或乙基取代的三烷氧基硅烷的混合物,则常规的脱羟基化处理是不必要的。 如果两种硅烷以约1:1的摩尔比存在,则获得介电常数为2.5或更小的层。

    Light-transmitting substrate provided with a light-absorbing coating
    8.
    发明申请
    Light-transmitting substrate provided with a light-absorbing coating 审中-公开
    具有光吸收涂层的透光性基板

    公开(公告)号:US20060091810A1

    公开(公告)日:2006-05-04

    申请号:US10530496

    申请日:2003-10-02

    IPC分类号: H01J61/35

    摘要: Disclosed is a light-transmitting substrate that is at least partly provided with a light-absorbing coating. Said coating comprises silver or gold particles that are incorporated in a sol-gel matrix. In order to improve the transmittance in red and to reduce the amount of silver and gold particles, a blue-absorbing compound is added to the coating. Furthermore, an electric lamp is disclosed, said lamp comprising a light-transmitting lamp vessel that accommodates a light source. Said lamp vessel comprises the above light-transmitting substrate. Moreover, a light-absorbing coating is disclosed.

    摘要翻译: 公开了至少部分设置有光吸收涂层的透光性基板。 所述涂层包含掺入溶胶 - 凝胶基质中的银或金颗粒。 为了提高红色的透射率和减少银和金颗粒的量,将蓝色吸收化合物加入到涂层中。 此外,公开了一种电灯,所述灯包括容纳光源的透光灯容器。 所述灯容器包括上述透光基板。 此外,公开了一种光吸收涂层。