公开(公告)号：US5565706A

公开(公告)日：1996-10-15

申请号：US407081

申请日：1995-03-20

申请人： Osamu Miura ,  Akio Takahashi ,  Takao Miwa ,  Masahiro Suzuki ,  Ryuji Watanabe ,  Junichi Katagiri ,  Yoichi Daiko ,  Tsutomu Imai ,  Haruo Akahoshi

发明人： Osamu Miura ,  Akio Takahashi ,  Takao Miwa ,  Masahiro Suzuki ,  Ryuji Watanabe ,  Junichi Katagiri ,  Yoichi Daiko ,  Tsutomu Imai ,  Haruo Akahoshi

IPC分类号： H01L23/13 ,  H01L23/538 ,  H01L25/065 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/13 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011

摘要： A thin and high-density package board used with general-purpose mainframe computers and high-speed processors is provided. On a ceramic substrate on which memory LSIs and a logic LSI with only elements formed without multilayer wiring are mounted, a multilayer wiring layer insuring signal transfer of the LSIs is formed, providing a thin package board.

摘要翻译： 提供了一种用于通用大型计算机和高速处理器的薄型和高密度封装板。 在其上安装有仅具有不具有多层布线的元件的存储器LSI和逻辑LSI的陶瓷基板上，形成确保LSI的信号传输的多层布线层，从而提供薄的封装板。

公开(公告)号：US5768108A

公开(公告)日：1998-06-16

申请号：US720028

申请日：1996-09-27

申请人： Osamu Miura ,  Kunio Miyazaki ,  Akio Takahashi ,  Motoyo Wajima ,  Ryuji Watanabe ,  Takao Miwa ,  Yuichi Satsu ,  Shigeo Amagi

发明人： Osamu Miura ,  Kunio Miyazaki ,  Akio Takahashi ,  Motoyo Wajima ,  Ryuji Watanabe ,  Takao Miwa ,  Yuichi Satsu ,  Shigeo Amagi

IPC分类号： H05K1/05 ,  H01L21/48 ,  H01L23/538 ,  H05K1/11 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K1/00 ,  H05K1/09 ,  H05K1/16

CPC分类号： H01L21/4857 ,  H01L23/5385 ,  H05K3/4641 ,  H01L2224/16225 ,  H05K1/113 ,  H05K2201/068 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4623

摘要： A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high reliability, and also a method of producing such a board are provided. The multi-layer wiring structure includes a complex of at least two sub-assemblies each having wiring layers formed respectively on opposite sides of a core material of a low thermal expansive metal through an insulation layer in such a manner that the wiring layers correspond in area ratio to each other. The sub-assemblies are connected to one another by conductors via through holes. In this structure, the wiring structure having the core material of a low thermal expansive metal is used as a base, and therefore a dimensional change of a board is small, and microscopic wiring layers can be formed, and the reliability of connection between the sub-assemblies is enhanced. Furthermore, the board can be produced at low costs.

摘要翻译： 在电子计算机，工作站等中使用用于安装电子装置的多层布线结构，特别是具有微细布线层的多层封装板，该板具有优异的尺寸稳定性和 高可靠性，以及制造这种基板的方法。 多层布线结构包括至少两个子组件的复合体，每个子组件具有通过绝缘层分别形成在低热膨胀金属的芯材的相对侧上的布线层，使得布线层对应于区域 相互之间的比例。 子组件通过导体经由通孔彼此连接。 在这种结构中，将具有低热膨胀金属的芯材的布线结构用作基底，因此板的尺寸变化小，并且可以形成微细的布线层，并且子层之间的连接的可靠性 大会组合得到增强。 此外，该板可以低成本生产。

公开(公告)号：US6028364A

公开(公告)日：2000-02-22

申请号：US809233

申请日：1997-03-19

申请人： Masahiko Ogino ,  Akira Nagai ,  Shuji Eguchi ,  Toshiaki Ishii ,  Masanori Segawa ,  Haruo Akahoshi ,  Akio Takahashi ,  Takao Miwa ,  Naotaka Tanaka ,  Ichirou Anjou

发明人： Masahiko Ogino ,  Akira Nagai ,  Shuji Eguchi ,  Toshiaki Ishii ,  Masanori Segawa ,  Haruo Akahoshi ,  Akio Takahashi ,  Takao Miwa ,  Naotaka Tanaka ,  Ichirou Anjou

IPC分类号： H01L23/498 ,  H01L23/48 ,  H01L23/52 ,  H05K1/00 ,  H05K7/20

CPC分类号： H01L23/49827 ,  H01L23/49816 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/12042 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351

摘要： A semiconductor device has a multi-layered wiring structure having a conductor layer to be electrically connected to a packaging substrate, the structure being provided on a circuit formation surface of a semiconductor chip; and ball-like terminals disposed in a grid array on the surface of the multi-layered wiring structure on the packaging substrate side, wherein the multi-layered wiring structure includes a buffer layer for relieving a thermal stress produced between the semiconductor chip and the packaging substrate, after packaging thereof, and multiple wiring layers. In this semiconductor device, the wiring distance is shorter than that of a conventional semiconductor device, so that an inductance component becomes smaller, to thereby increase the signal speed; the distance between a ground layer and a power supply layer is shortened, to reduce noise produced upon operation, and also a thermal stress upon packaging is relieved by the buffer layer of the multi-layered wiring structure, resulting in the improved connection reliability; and the number of terminals per unit is increased because of elimination of wire bonding.

摘要翻译： PCT No.PCT / JP95 / 00714 Sec。 371日期1997年3月19日 102（e）1997年3月19日PCT提交1995年4月12日PCT公布。 出版物WO96 / 09645 日期：1996年3月28日半导体器件具有多层布线结构，具有与封装基板电连接的导体层，该结构设置在半导体芯片的电路形成面上; 以及设置在所述多层布线结构体的所述封装基板侧的表面上的栅格阵列中的球状端子，其中所述多层布线结构包括用于缓解在所述半导体芯片和所述封装之间产生的热应力的缓冲层 基板，其包装之后，以及多个布线层。 在该半导体装置中，布线距离短于以往的半导体装置，因此电感成分变小，信号速度变高; 接地层和电源层之间的距离缩短，以减少操作时产生的噪声，并且通过多层布线结构的缓冲层减轻了包装上的热应力，从而提高了连接可靠性; 并且由于引线接合的消除，每单元的端子数量增加。

公开(公告)号：US06423571B1

公开(公告)日：2002-07-23

申请号：US09884378

申请日：2001-06-20

申请人： Masahiko Ogino ,  Akira Nagai ,  Shuji Eguchi ,  Toshiaki Ishii ,  Masanori Segawa ,  Haruo Akahoshi ,  Akio Takahashi ,  Takao Miwa ,  Naotaka Tanaka ,  Ichirou Anjou

发明人： Masahiko Ogino ,  Akira Nagai ,  Shuji Eguchi ,  Toshiaki Ishii ,  Masanori Segawa ,  Haruo Akahoshi ,  Akio Takahashi ,  Takao Miwa ,  Naotaka Tanaka ,  Ichirou Anjou

IPC分类号： H01L2144

摘要： A method of forming a semiconductor device having a multi-layered wiring structure that includes a conductor layer to be electrically connected to a packaging substrate, with the multi-layered wiring structure being provided on a circuit formation surface of a semiconductor chip. Ball-like terminals are formed, disposed in a grid array on the surface of the multi-layered wiring structure on the packaging substrate side. The multi-layered wiring structure is formed to include a buffer layer for relieving a thermal stress provided between the semiconductor chip and the packaging substrate, due to the packaging procedure. In the semiconductor device formed, the wiring distance is shorter than that of a conventional semiconductor device, so that an inductance component becomes smaller, to thereby increase signal speed. The distance between a ground layer and a power supply layer is shortened, to reduce noise produced upon operation, and also a thermal stress upon packaging is relieved by the buffer layer of the multi-layered wiring structure, resulting in improved connection reliability, and the number of terminals per unit can be increased, because of elimination of wire bonding. The buffer layer can be made of an elastomer, and can have a modulus of elasticity of 10 kg/mm2 or less.

公开(公告)号：US5133989A

公开(公告)日：1992-07-28

申请号：US416279

申请日：1989-09-27

申请人： Shunichi Numata ,  Takao Miwa ,  Takayoshi Ikeda ,  Koji Fujisaki ,  Hisae Shimanoki ,  Kunio Miyazaki ,  Osamu Miura ,  Ryuji Watanabe ,  Toshio Miyamoto ,  Yukio Okoshi

发明人： Shunichi Numata ,  Takao Miwa ,  Takayoshi Ikeda ,  Koji Fujisaki ,  Hisae Shimanoki ,  Kunio Miyazaki ,  Osamu Miura ,  Ryuji Watanabe ,  Toshio Miyamoto ,  Yukio Okoshi

IPC分类号： B32B15/088 ,  B32B15/08 ,  C08G73/10 ,  H01B1/22 ,  H01B3/30 ,  H01L21/48 ,  H01L23/14 ,  H05K1/03

CPC分类号： H05K1/0346 ,  H01B1/22 ,  H01B3/306 ,  H01L21/481 ,  H01L23/145 ,  H01L2224/16225 ,  H01L2924/12044 ,  Y10T428/31681

摘要： The present invention provides a process for producing a metal-polyimide composite material such as a wiring board. In production thereof, deterioration of polyamide film due to oxidation during imidization of a polyimide precursor in contact with metal such as copper or silver can be prevented. The present invention is characterized by using a polyimide precursor having an acidic functional group which is masked. Examples of the polyamide precursor are polyamic acid epoxy adducts, amido polyamic acids, silylated polyamic acids, etc.

公开(公告)号：US5686191A

公开(公告)日：1997-11-11

申请号：US553240

申请日：1995-11-07

申请人： Takao Miwa ,  Masahiro Suzuki ,  Akio Takahashi ,  Yoshiaki Okabe ,  Yuichi Satsu ,  Shin Nishimura

发明人： Takao Miwa ,  Masahiro Suzuki ,  Akio Takahashi ,  Yoshiaki Okabe ,  Yuichi Satsu ,  Shin Nishimura

IPC分类号： C08G73/10 ,  C08K5/3415 ,  C08L79/08 ,  C09J179/08 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46 ,  B32B27/06

CPC分类号： H05K3/4655 ,  C08G73/1039 ,  C08G73/1071 ,  C08K5/3415 ,  C08L79/08 ,  C09J179/08 ,  H05K1/0306 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K3/386 ,  H05K3/4605 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721

摘要： A thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10.sup.7 to 10.sup.2 dyne/cm.sup.2 during heat curing thereof is suitable for forming an adhesive film used in a thin film wiring board having excellent heat resistance and high reliability.

摘要翻译： 包含（A）热固性聚酰亚胺和（B）双马来酰亚胺并且在其热固化期间显示出107至102达因/ cm 2的弹性模量的热固性树脂组合物适用于形成具有优异的薄膜布线板中使用的粘合剂膜 耐热性和高可靠性。

公开(公告)号：US5633112A

公开(公告)日：1997-05-27

申请号：US319788

申请日：1994-10-07

申请人： Takao Miwa ,  Yoshiaki Okabe ,  Mina Ishida ,  Akio Takahashi ,  Shunichi Numata

发明人： Takao Miwa ,  Yoshiaki Okabe ,  Mina Ishida ,  Akio Takahashi ,  Shunichi Numata

IPC分类号： G03F7/004 ,  G03F7/021 ,  G03F7/039 ,  H01L21/027

CPC分类号： G03F7/0212 ,  G03F7/0045

摘要： A photosensitive resin composition comprising (a) a polymer having carboxyl groups (b) a photoacid generator which generates an acid when irradiated with light, and (c) an aliphatic amine is capable of development with ease by use of a wide variety of aqueous solvents.

摘要翻译： 一种感光性树脂组合物，其包含（a）具有羧基的聚合物（b）光照产生酸的光酸产生剂，（c）脂肪族胺可以通过使用多种水性溶剂容易地显影 。

公开(公告)号：US07790248B2

公开(公告)日：2010-09-07

申请号：US11708462

申请日：2007-02-21

申请人： Yasushi Tomioka ,  Takao Miwa ,  Katsumi Kondo ,  Hisao Yokokura

发明人： Yasushi Tomioka ,  Takao Miwa ,  Katsumi Kondo ,  Hisao Yokokura

IPC分类号： G02F1/1337 ,  C09K19/56

CPC分类号： G02F1/134363 ,  G02F1/1337 ,  G02F1/133784 ,  G02F1/133788 ,  G02F2001/133397 ,  G02F2202/023 ,  Y10T428/10 ,  Y10T428/1005 ,  Y10T428/1018 ,  Y10T428/1023

摘要： An active matrix type liquid crystal display apparatus has a pair of substrates, at least one of the substrates being transparent; a liquid crystal layer arranged between the pair of substrates; and electrode structure for generating an electric field having a dominant component parallel to a surface of the substrate and passing through the liquid crystal layer, the electrode structure being formed on one of the pair of substrates; a pair of alignment layers formed on respective surfaces in contact with the liquid crystal layer of the pair of substrates; and a pair of polarizing plates arranged so as to sandwich the pair of substrates, wherein the glass transition temperature Tg of a boundary surface between said liquid crystal layer and the alignment layer is higher than the nematic-isotropic phase transition temperature T(N−I) of a liquid crystal composite forming the liquid crystal layer.

摘要翻译： 有源矩阵型液晶显示装置具有一对基板，至少一个基板是透明的; 布置在所述一对基板之间的液晶层; 以及电极结构，用于产生具有平行于所述基板的表面的主要分量并通过所述液晶层的电场，所述电极结构形成在所述一对基板中的一个基板上; 一对取向层，形成在与所述一对基板的液晶层接触的各表面上; 以及一对偏振片，其被布置成夹持所述一对基板，其中所述液晶层和所述取向层之间的边界面的玻璃化转变温度Tg高于向列相向相变温度T（N-1 ）形成液晶层的液晶复合体。

公开(公告)号：US07586755B2

公开(公告)日：2009-09-08

申请号：US11834452

申请日：2007-08-06

申请人： Toshiya Satoh ,  Masahiko Ogino ,  Takao Miwa ,  Takashi Naitou ,  Takashi Namekawa ,  Toshihide Nabatame ,  Shigehisa Motowaki

发明人： Toshiya Satoh ,  Masahiko Ogino ,  Takao Miwa ,  Takashi Naitou ,  Takashi Namekawa ,  Toshihide Nabatame ,  Shigehisa Motowaki

IPC分类号： H05K7/00

CPC分类号： H01L27/13 ,  H01F17/0006 ,  H01L23/49822 ,  H01L23/49827 ,  H01L27/016 ,  H01L27/0676 ,  H01L27/08 ,  H01L2224/16 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/19011 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/28 ,  H05K3/3457 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/09536 ,  H05K2201/09827 ,  H01L2924/00

摘要： Through an improvement of module size increase due to mounting a single passive element on a substrate and an increase in the mounting cost, to provide a highly reliable, high performance and small sized electronic circuit component which permits to integrate a variety of electronic parts such as capacitors, inductors and resistors in a high density with low cost.The electronic circuit component comprises an insulator substrate, a plurality of electrodes having different areas provided on the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a metal terminal part of a part of the metal wiring and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.

摘要翻译： 通过在基板上安装单个无源元件并增加安装成本来改善模块尺寸增加，提供高可靠性，高性能和小尺寸的电子电路元件，其允许将各种电子部件如 电容器，电感器和电阻器，高密度，低成本。 电子电路部件包括绝缘体基板，设置在绝缘体基板上的具有不同区域的多个电极，选自被夹在电极之间的电介质材料的电容器元件中的一个或多个元件，电感元件和电阻元件，连接 所述元件，所述金属布线的一部分的金属端子部分和覆盖所述元件的有机绝缘体材料以及除了所述金属端子部分之外的所述金属布线部分的周边。

公开(公告)号：US20060177664A1

公开(公告)日：2006-08-10

申请号：US11224096

申请日：2005-09-13

申请人： Takashi Naitou ,  Motoyuki Miyata ,  Hiroyuki Akata ,  Yuichi Sawai ,  Osamu Shiono ,  Tatsumi Hirano ,  Hiroki Yamamoto ,  Hideto Momose ,  Takao Miwa ,  Yuzo Kozono

发明人： Takashi Naitou ,  Motoyuki Miyata ,  Hiroyuki Akata ,  Yuichi Sawai ,  Osamu Shiono ,  Tatsumi Hirano ,  Hiroki Yamamoto ,  Hideto Momose ,  Takao Miwa ,  Yuzo Kozono

IPC分类号： B32B17/00 ,  B32B17/06

CPC分类号： B32B17/10174 ,  B32B17/10036 ,  B32B17/10045 ,  B32B17/10788 ,  C03C3/083 ,  C03C3/085 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C3/095 ,  Y10T428/315

摘要： The present invention is envisioned to provide a high-strength glass which is applicable to the objective of size and weight reduction. At a surface portion of the glass containing a rare earth element, a heterogeneous phase containing at least said rare earth element is formed.

摘要翻译： 本发明设想提供一种适用于尺寸和重量减轻的目的的高强度玻璃。 在含有稀土元素的玻璃的表面部分，形成至少包含所述稀土元素的非均相。