公开(公告)号：US20070196011A1

公开(公告)日：2007-08-23

申请号：US11610468

申请日：2006-12-13

申请人： Damon Cox ,  Todd Egan ,  Randhir Thakur ,  Arkadii Samoilov ,  Per-Ove Hansson

发明人： Damon Cox ,  Todd Egan ,  Randhir Thakur ,  Arkadii Samoilov ,  Per-Ove Hansson

IPC分类号： H01L21/66 ,  G06K9/00

CPC分类号： G01N21/33 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/67161 ,  H01L21/67167 ,  H01L21/67196 ,  H01L21/67207 ,  H01L21/67745

摘要： Aspects of the invention generally provide an apparatus and method for processing substrates using a multi-chamber processing system that is adapted to process substrates and analyze the results of the processes performed on the substrate. In one aspect of the invention, one or more analysis steps and/or pre-processing steps are performed on the substrate to provide data for processes performed on subsequent substrates. In one aspect of the invention, a system controller and one or more analysis devices are utilized to monitor and control a process chamber recipe and/or a process sequence to reduce substrate scrap due to defects in the formed device and device performance variability issues. Embodiments of the present invention also generally provide methods and a system for repeatably and reliably forming semiconductor devices used in a variety of applications.

摘要翻译： 本发明的方面通常提供一种使用多室处理系统来处理衬底的装置和方法，所述多室处理系统适于处理衬底并分析在衬底上执行的工艺的结果。 在本发明的一个方面，在衬底上执行一个或多个分析步骤和/或预处理步骤以提供在后续衬底上执行的处理的数据。 在本发明的一个方面，系统控制器和一个或多个分析装置用于监测和控制处理室配方和/或处理顺序，以减少由于所形成的装置中的缺陷和装置性能变异性问题引起的衬底废料。 本发明的实施例还通常提供了用于可重复且可靠地形成用于各种应用的半导体器件的方法和系统。

公开(公告)号：US20070134821A1

公开(公告)日：2007-06-14

申请号：US11460864

申请日：2006-07-28

申请人： Randhir Thakur ,  Arkadii Samoilov ,  Per-Ove Hansson

发明人： Randhir Thakur ,  Arkadii Samoilov ,  Per-Ove Hansson

IPC分类号： B08B6/00 ,  H01L21/00 ,  C23C16/00

CPC分类号： C23C16/4584 ,  B08B6/00 ,  B08B7/0057 ,  C23C16/45546 ,  C23C16/45593 ,  C23C16/481 ,  C23C16/54 ,  H01L21/67017 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/67167 ,  H01L21/6719 ,  H01L21/67207 ,  H01L21/67745 ,  H01L21/67757 ,  H01L21/67781

摘要： Aspects of the invention generally provide an apparatus and method for processing substrates using a multi-chamber processing system that is adapted to process substrates and analyze the results of the processes performed on the substrate. In one aspect of the invention, one or more analysis steps and/or precleaning steps are utilized to reduce the effect of queue time on device yield. In one aspect of the invention, a system controller and the one or more analysis chambers are utilized to monitor and control a process chamber recipe and/or a process sequence to reduce substrate scrap due to defects in the formed device and device performance variability issues. Embodiments of the present invention also generally provide methods and a system for repeatably and reliably forming semiconductor devices used in a variety of applications.

摘要翻译： 本发明的方面通常提供一种使用多室处理系统来处理衬底的装置和方法，所述多室处理系统适于处理衬底并分析在衬底上执行的工艺的结果。 在本发明的一个方面，利用一个或多个分析步骤和/或预清洗步骤来减少队列时间对设备产量的影响。 在本发明的一个方面，系统控制器和一个或多个分析室用于监测和控制处理室配方和/或处理顺序，以减少由于所形成的器件和器件性能变异性问题中的缺陷引起的衬底废料。 本发明的实施例还通常提供了用于可重复且可靠地形成用于各种应用的半导体器件的方法和系统。

公开(公告)号：US07579232B1

公开(公告)日：2009-08-25

申请号：US12216924

申请日：2008-07-11

申请人： Er-Xuan Ping ,  Randhir Thakur ,  Klaus Scheugraf

发明人： Er-Xuan Ping ,  Randhir Thakur ,  Klaus Scheugraf

IPC分类号： H01L21/8234 ,  H01L21/8222 ,  H01L21/425

CPC分类号： H01L27/1021 ,  H01L21/7688 ,  H01L27/101

摘要： A method of making a semiconductor device includes forming a pillar shaped semiconductor device surrounded by an insulating layer such that a contact hole in the insulating layer exposes an upper surface of the semiconductor device. The method also includes forming a shadow mask layer over the insulating layer such that a portion of the shadow mask layer overhangs a portion of the contact hole, forming a conductive layer such that a first portion of the conductive layer is located on the upper surface of the semiconductor device exposed in the contact hole and a second portion of the conductive layer is located over the shadow mask layer, and removing the shadow mask layer and the second portion of the conductive layer.

摘要翻译： 制造半导体器件的方法包括形成由绝缘层包围的柱状半导体器件，使得绝缘层中的接触孔露出半导体器件的上表面。 该方法还包括在绝缘层上形成荫罩层，使得阴影掩模层的一部分悬垂在接触孔的一部分上，形成导电层，使得导电层的第一部分位于 暴露在接触孔中的半导体器件和导电层的第二部分位于荫罩层之上，并且去除荫罩层和导电层的第二部分。

公开(公告)号：US20070232031A1

公开(公告)日：2007-10-04

申请号：US11805428

申请日：2007-05-22

申请人： Kaushal Singh ,  David Carlson ,  Manish Hemkar ,  Satheesh Kuppurao ,  Randhir Thakur

发明人： Kaushal Singh ,  David Carlson ,  Manish Hemkar ,  Satheesh Kuppurao ,  Randhir Thakur

IPC分类号： H01L21/20

CPC分类号： H01L21/0262 ,  C23C16/482 ,  C30B25/105 ,  C30B29/06 ,  H01L21/02381 ,  H01L21/02532 ,  H01L21/02639 ,  H01L21/02661

摘要： A method of preparing a clean substrate surface for blanket or selective epitaxial deposition of silicon-containing and/or germanium-containing films. In addition, a method of growing the silicon-containing and/or germanium-containing films, where both the substrate cleaning method and the film growth method are carried out at a temperature below 750° C., and typically at a temperature from about 700° C. to about 500° C. The cleaning method and the film growth method employ the use of radiation having a wavelength ranging from about 310 nm to about 120 nm in the processing volume in which the silicon-containing film is grown. Use of this radiation in combination with particular partial pressure ranges for the reactive cleaning or film-forming component species enable the substrate cleaning and epitaxial film growth at temperatures below those previously known in the industry.

摘要翻译： 一种制备用于覆盖或选择性外延沉积含硅和/或含锗膜的清洁衬底表面的方法。 此外，生长含硅和/或含锗膜的方法，其中基板清洗方法和膜生长方法都在低于750℃的温度下进行，通常在约700℃的温度下进行 ℃至约500℃。清洁方法和膜生长方法在其中生长含硅膜的处理体积中使用波长为约310nm至约120nm的辐射。 将该辐射与用于反应性清洁或成膜组分物质的特定分压范围的组合的使用使得能够在低于工业以前已知的温度下进行基材清洗和外延膜生长。

公开(公告)号：US20070087506A1

公开(公告)日：2007-04-19

申请号：US11538765

申请日：2006-10-04

申请人： Randhir Thakur

发明人： Randhir Thakur

IPC分类号： H01L21/336

CPC分类号： H01L21/28211 ,  H01L21/02046 ,  H01L21/02049 ,  H01L21/02052 ,  H01L21/0214 ,  H01L21/02238 ,  H01L21/02255 ,  H01L21/02312 ,  H01L21/02332 ,  H01L21/02337 ,  H01L21/28202 ,  H01L21/3144 ,  H01L21/31604 ,  H01L21/31662 ,  H01L21/31675 ,  H01L21/76221 ,  H01L29/40114 ,  H01L29/518

摘要： In the formation of semiconductor devices, a processing method is provided, including steps for forming an oxide layer. The embodied methods involve a series of oxidation steps, with optional interposed cleanings, as well as an optional conditioning step after oxidation. In a preferred embodiment, these steps are clustered and transportation between the clustered process chambers takes place in a controlled environment such as nitrogen or a vacuum. In some embodiments, the method provides an oxide layer to be used as part of the device, such as a tunnel oxide for a flash-EEPROM, or as a general gate oxide. Alternatively, the steps can be used to sculpt through oxidation various levels of a substrate, thereby allowing for embedded memory architecture. Cleaning between oxidation steps offers the advantage of providing a more defect-free oxide layer or providing access to a more defect-free level of substrate.

公开(公告)号：US06955996B2

公开(公告)日：2005-10-18

申请号：US10624817

申请日：2003-07-22

申请人： Daniel F Gealy ,  Dave Chapek ,  Scott DeBoer ,  Husam N. Al-Shareef ,  Randhir Thakur

发明人： Daniel F Gealy ,  Dave Chapek ,  Scott DeBoer ,  Husam N. Al-Shareef ,  Randhir Thakur

IPC分类号： C30B33/00 ,  H01L21/316 ,  H01L21/31 ,  H01L21/469

CPC分类号： H01L21/28202 ,  C30B33/005 ,  H01L21/02183 ,  H01L21/02197 ,  H01L21/02271 ,  H01L21/31662 ,  H01L29/518 ,  Y10S438/903

摘要： A method and apparatus for preventing N2O from becoming super critical during a high pressure oxidation stage within a high pressure oxidation furnace are disclosed. The method and apparatus utilize a catalyst to catalytically disassociate N2O as it enters the high pressure oxidation furnace. This catalyst is used in an environment of between five atmospheres and 25 atmospheres N2O and a temperature range of 600° to 750° C., which are the conditions that lead to the N2O going super critical. By preventing the N2O from becoming super critical, the reaction is controlled that prevents both temperature and pressure spikes. The catalyst can be selected from the group of noble transition metals and their oxides. This group can comprise palladium, platinum, iridium, rhodium, nickel, silver, and gold.

公开(公告)号：US06930015B2

公开(公告)日：2005-08-16

申请号：US10319938

申请日：2002-12-16

申请人： Er-Xuan Ping ,  Randhir Thakur

发明人： Er-Xuan Ping ,  Randhir Thakur

IPC分类号： H01L21/00 ,  H01L21/02 ,  H01L21/20 ,  H01L21/8242 ,  H01L21/84

CPC分类号： H01L21/02667 ,  H01L21/02532 ,  H01L21/0257 ,  H01L21/02645 ,  H01L21/2022 ,  H01L27/1085 ,  H01L28/84 ,  H01L28/90

摘要： Methods of forming a roughened surface through diffusion-enhanced crystallization of an amorphous material are disclosed. In one aspect, conductive hemispherical grain silicon can be formed through dopant diffusion-enhanced crystallization of one or more layers of amorphous silicon. To further enhance uniformity in the formation of the hemispherical grain silicon, the exposed surface of the amorphous silicon can be seeded before crystallization to further enhance uniformity of the surface structures formed in the hemispherical grain silicon.

摘要翻译： 公开了通过非晶材料的扩散增强结晶形成粗糙表面的方法。 在一个方面，可以通过一个或多个非晶硅层的掺杂剂扩散增强结晶来形成导电半球形晶粒硅。 为了进一步提高半球形晶粒硅的形成的均匀性，可以在结晶之前将非晶硅的暴露表面接种，以进一步增强在半球形晶粒硅中形成的表面结构的均匀性。

公开(公告)号：US06927169B2

公开(公告)日：2005-08-09

申请号：US10325353

申请日：2002-12-19

申请人： Dan Maydan ,  Randhir Thakur

发明人： Dan Maydan ,  Randhir Thakur

IPC分类号： H01L21/28 ,  H01L21/314 ,  H01L21/316 ,  H01L21/84 ,  H01L21/311

CPC分类号： H01L21/0214 ,  H01L21/02238 ,  H01L21/02255 ,  H01L21/02332 ,  H01L21/02337 ,  H01L21/28247 ,  H01L21/3144 ,  H01L21/31662 ,  H01L21/84

摘要： A method and apparatus for the formation of oxide in a manner having a planarizing effect on underlying material, e.g., silicon. In particular, an oxide having a nonuniform thickness profile is grown on the underlying material. The nonuniform thickness profile of the oxide is selected according to the nonuniform profile of the underlying material. Subsequent removal of the oxide leaves behind a planarized surface of the underlying material, as compared to the pre-oxidized surface.

摘要翻译： 用于以对下层材料例如硅具有平坦化作用的方式形成氧化物的方法和装置。 特别地，在下层材料上生长具有不均匀厚度分布的氧化物。 根据下层材料的不均匀轮廓选择氧化物的不均匀厚度分布。 与预氧化表面相比，随后将氧化物除去在下面的材料的平坦化表面之后。

公开(公告)号：US06511892B1

公开(公告)日：2003-01-28

申请号：US09138879

申请日：1998-08-24

申请人： Er-Xuan Ping ,  Randhir Thakur

发明人： Er-Xuan Ping ,  Randhir Thakur

IPC分类号： H01L2120

CPC分类号： H01L21/02667 ,  H01L21/02532 ,  H01L21/0257 ,  H01L21/02645 ,  H01L21/2022 ,  H01L27/1085 ,  H01L28/84 ,  H01L28/90

摘要： Methods of forming a roughened surface through diffusion-enhanced crystallization of an amorphous material are disclosed. In one aspect, conductive hemispherical grain silicon can be formed through dopant diffusion-enhanced crystallization of one or more layers of amorphous silicon. To further enhance uniformity in the formation of the hemispherical grain silicon, the exposed surface of the amorphous silicon can be seeded before crystallization to further enhance uniformity of the surface structures formed in the hemispherical grain silicon.

摘要翻译： 公开了通过非晶材料的扩散增强结晶形成粗糙表面的方法。 在一个方面，可以通过一个或多个非晶硅层的掺杂剂扩散增强结晶来形成导电半球形晶粒硅。 为了进一步提高半球形晶粒硅的形成的均匀性，可以在结晶之前将非晶硅的暴露表面接种，以进一步增强在半球形晶粒硅中形成的表面结构的均匀性。

公开(公告)号：US06451661B1

公开(公告)日：2002-09-17

申请号：US09415213

申请日：1999-10-12

申请人： Scott J. DeBoer ,  Husam Al-Shareef ,  Randhir Thakur

发明人： Scott J. DeBoer ,  Husam Al-Shareef ,  Randhir Thakur

IPC分类号： H01L2120

CPC分类号： H01L27/10852 ,  H01L21/31604 ,  H01L27/10811 ,  H01L27/10888 ,  H01L28/55 ,  H01L28/91

摘要： A capacitor having a double sided electrode for enhanced capacitance. In one embodiment, the double sided electrode capacitor is a stacked container capacitor used in a dynamic random access memory circuit. The double sided electrode is preferably formed of a conductive metal, provided that an oxide of the metal is conductive. The double sided electrode capacitor provides a capacitor that has high storage capacitance which provides an increased efficiency for a cell without an increase in the size of the cell.

摘要翻译： 具有用于增强电容的双面电极的电容器。 在一个实施例中，双面电极电容器是用于动态随机存取存储器电路中的层叠容器电容器。 双面电极优选由导电金属形成，只要金属的氧化物是导电的。 双面电极电容器提供具有高存储电容的电容器，其在不增加电池尺寸的情况下为电池提供增加的效率。