公开(公告)号：US09129846B2

公开(公告)日：2015-09-08

申请号：US14511149

申请日：2014-10-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： In-sang Song ,  In-Ku Kang ,  Joon-hee Lee ,  Kyung-man Kim

IPC: H01L23/52 ,  H01L25/10

CPC classification number: H01L25/105 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/60 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0235 ,  H01L2224/02379 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05008 ,  H01L2224/05012 ,  H01L2224/05548 ,  H01L2224/05558 ,  H01L2224/05564 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/06135 ,  H01L2224/29034 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/454 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48148 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/4866 ,  H01L2224/48666 ,  H01L2224/48681 ,  H01L2224/48684 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/4876 ,  H01L2224/48766 ,  H01L2224/48781 ,  H01L2224/48784 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/4886 ,  H01L2224/48866 ,  H01L2224/48881 ,  H01L2224/48884 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83365 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/8546 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/10333 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/14511 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The semiconductor package includes: a package substrate comprising a bonding pad; a plurality of semiconductor chips stacked on the package substrate; and a bonding wire configured to electrically connect the semiconductor chips and the bonding pad. For at least one of the plurality of semiconductor chips: the semiconductor chip comprises: a semiconductor device; a first pad electrically connected to the semiconductor device; a conductive pattern; and a second pad electrically connected to the first pad, spaced apart from the conductive pattern, and extending over the conductive pattern; and the bonding wire is connected to the second pad.

Abstract translation: 半导体封装包括：封装衬底，其包括焊盘; 堆叠在所述封装基板上的多个半导体芯片; 以及被配置为电连接半导体芯片和接合焊盘的接合线。 对于所述多个半导体芯片中的至少一个半导体芯片，所述半导体芯片包括：半导体器件; 电连接到所述半导体器件的第一焊盘; 导电图案; 以及第二焊盘，其电连接到所述第一焊盘，与所述导电图案间隔开并且延伸穿过所述导电图案; 并且接合线连接到第二焊盘。

公开(公告)号：US09872180B2

公开(公告)日：2018-01-16

申请号：US14842243

申请日：2015-09-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Duk-Il Kim ,  In-Ku Kang ,  Yu-Seung Kim ,  Bong-Hyun Lee ,  Dong-Ho Jang

IPC: H04W40/24 ,  H04W12/08 ,  H04M15/00 ,  H04W4/24 ,  H04W4/00

CPC classification number: H04W12/08 ,  H04L12/1407 ,  H04M15/60 ,  H04M15/66 ,  H04W4/24 ,  H04W4/50

Abstract: A method for managing network access is provided. The method includes determining whether there is a network connection request from at least one application, checking at least one attribute information item of the application, determining an access point name (APN) corresponding to the application based on the at least one attribute information item, and transmitting and receiving data of the application to/from a network using the determined APN.

公开(公告)号：US08890330B2

公开(公告)日：2014-11-18

申请号：US13690678

申请日：2012-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyung-Man Kim ,  In-Ku Kang ,  Ji-Hyun Lee

IPC: H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L23/34 ,  H01L29/40 ,  H01L25/18 ,  H01L23/49 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49 ,  H01L23/3128 ,  H01L24/00 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/484 ,  H01L2224/4911 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: Provided are semiconductor packages and electronic systems including the same. A first memory chip may be stacked on a first portion of a substrate. A controller chip may be stacked on a second portion of the substrate, which is different from the first portion. At least one first bonding wire may directly connect the first memory chip with the controller chip. At least one second bonding wire may directly connect the first memory chip with the substrate, and may be electrically connected with the at least one first bonding wire.

Abstract translation: 提供半导体封装和包括其的电子系统。 第一存储器芯片可以堆叠在衬底的第一部分上。 控制器芯片可以堆叠在与第一部分不同的基板的第二部分上。 至少一个第一接合线可以将第一存储器芯片与控制器芯片直接连接。 至少一个第二接合线可以将第一存储器芯片与衬底直接连接，并且可以与至少一个第一接合线电连接。