Semiconductor memory device and method of fabricating the same
    10.
    发明申请
    Semiconductor memory device and method of fabricating the same 有权
    半导体存储器件及其制造方法

    公开(公告)号:US20070108433A1

    公开(公告)日:2007-05-17

    申请号:US11650972

    申请日:2007-01-09

    IPC分类号: H01L47/00

    摘要: In a semiconductor memory device and a method of fabricating the same, a semiconductor memory device having a transistor and a data storing portion includes a heating portion interposed between the transistor and the data storing portion and a metal interconnection layer connected to the data storing portion, wherein the data storing portion includes a chalcogenide material layer, which undergoes a phase change due to a heating of the heating portion, for storing data therein.

    摘要翻译: 在半导体存储器件及其制造方法中,具有晶体管和数据存储部分的半导体存储器件包括夹在晶体管和数据存储部分之间的加热部分和连接到数据存储部分的金属互连层, 其中所述数据存储部分包括由于所述加热部分的加热而发生相变的硫族化物材料层,用于在其中存储数据。