公开(公告)号：US20100133664A1

公开(公告)日：2010-06-03

申请号：US12651740

申请日：2010-01-04

申请人： Seiichi Nakatani ,  Tsutomu Mitani

发明人： Seiichi Nakatani ,  Tsutomu Mitani

IPC分类号： H01L23/552

CPC分类号： H05K1/02 ,  H01L23/3128 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025 ,  H05K1/181 ,  H05K2201/10098 ,  H05K2201/1053 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A module that can not only achieve the reduction in size and manufacturing cost but also be impervious to noise due to electromagnetic waves, and a mounted structure using the same are provided. A module (1) includes a substrate (12) and a plurality of semiconductor packages (11a, 11b), each including a semiconductor chip (10), mounted on the substrate (12). Each of the plurality of semiconductor packages (11a, 11b) includes a first radio communication element (16) for transmitting and receiving a signal between the semiconductor chips (10) in the plurality of semiconductor packages (11a, 11b) by radio communication, and the first radio communication element (16) is constituted independently of the semiconductor chip (10).

摘要翻译： 提供了一种模块，其不仅可以实现尺寸和制造成本的降低，而且还可以防止由电磁波引起的噪声，并且提供使用其的安装结构。 模块（1）包括基板（12）和多个半导体封装（11a，11b），每个半导体封装包括安装在基板（12）上的半导体芯片（10）。 多个半导体封装（11a，11b）中的每一个包括用于通过无线电通信在多个半导体封装（11a，11b）中的半导体芯片（10）之间发送和接收信号的第一无线电通信元件（16），以及 第一无线电通信元件（16）独立于半导体芯片（10）构成。

公开(公告)号：US07667974B2

公开(公告)日：2010-02-23

申请号：US10564114

申请日：2005-01-20

申请人： Seiichi Nakatani ,  Tsutomu Mitani

发明人： Seiichi Nakatani ,  Tsutomu Mitani

IPC分类号： H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC分类号： H05K1/02 ,  H01L23/3128 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025 ,  H05K1/181 ,  H05K2201/10098 ,  H05K2201/1053 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A module that can not only achieve the reduction in size and manufacturing cost but also be impervious to noise due to electromagnetic waves, and a mounted structure using the same are provided. A module (1) includes a substrate (12) and a plurality of semiconductor packages (11a, 11b), each including a semiconductor chip (10), mounted on the substrate (12). Each of the plurality of semiconductor packages (11a, 11b) includes a first radio communication element (16) for transmitting and receiving a signal between the semiconductor chips (10) in the plurality of semiconductor packages (11a, 11b) by radio communication, and the first radio communication element (16) is constituted independently of the semiconductor chip (10).

公开(公告)号：US20080048307A1

公开(公告)日：2008-02-28

申请号：US10564114

申请日：2005-01-20

申请人： Seiichi Nakatani ,  Tsutomu Mitani

发明人： Seiichi Nakatani ,  Tsutomu Mitani

IPC分类号： H01L23/02

CPC分类号： H05K1/02 ,  H01L23/3128 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025 ,  H05K1/181 ,  H05K2201/10098 ,  H05K2201/1053 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A module that can not only achieve the reduction in size and manufacturing cost but also be impervious to noise due to electromagnetic waves, and a mounted structure using the same are provided. A module (1) includes a substrate (12) and a plurality of semiconductor packages (11a, 11b), each including a semiconductor chip (10), mounted on the substrate (12). Each of the plurality of semiconductor packages (11a, 11b) includes a first radio communication element (16) for transmitting and receiving a signal between the semiconductor chips (10) in the plurality of semiconductor packages (11a, 11b) by radio communication, and the first radio communication element (16) is constituted independently of the semiconductor chip (10).

摘要翻译： 提供了一种模块，其不仅可以实现尺寸和制造成本的降低，而且还可以防止由电磁波引起的噪声，并且提供使用其的安装结构。 模块（1）包括基板（12）和安装在基板（12）上的包括半导体芯片（10）的多个半导体封装（11a，11b）。 多个半导体封装（11a，11b）中的每一个包括用于在多个半导体封装（11a，11b）中的半导体芯片（10）之间发送和接收信号的第一无线电通信元件（16），通过 无线电通信，并且第一无线电通信元件（16）独立于半导体芯片（10）构成。

公开(公告)号：US07859855B2

公开(公告)日：2010-12-28

申请号：US12651740

申请日：2010-01-04

申请人： Seiichi Nakatani ,  Tsutomu Mitani

发明人： Seiichi Nakatani ,  Tsutomu Mitani

IPC分类号： H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC分类号： H05K1/02 ,  H01L23/3128 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025 ,  H05K1/181 ,  H05K2201/10098 ,  H05K2201/1053 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A module that can not only achieve the reduction in size and manufacturing cost but also be impervious to noise due to electromagnetic waves, and a mounted structure using the same are provided. A module (1) includes a substrate (12) and a plurality of semiconductor packages (11a, 11b), each including a semiconductor chip (10), mounted on the substrate (12). Each of the plurality of semiconductor packages (11a, 11b) includes a first radio communication element (16) for transmitting and receiving a signal between the semiconductor chips (10) in the plurality of semiconductor packages (11a, 11b) by radio communication, and the first radio communication element (16) is constituted independently of the semiconductor chip (10).

摘要翻译： 提供了一种模块，其不仅可以实现尺寸和制造成本的降低，而且还可以防止由电磁波引起的噪声，并且提供使用其的安装结构。 模块（1）包括基板（12）和多个半导体封装（11a，11b），每个半导体封装包括安装在基板（12）上的半导体芯片（10）。 多个半导体封装（11a，11b）中的每一个包括用于通过无线电通信在多个半导体封装（11a，11b）中的半导体芯片（10）之间发送和接收信号的第一无线电通信元件（16），以及 第一无线电通信元件（16）独立于半导体芯片（10）构成。

公开(公告)号：US08435842B2

公开(公告)日：2013-05-07

申请号：US12681399

申请日：2009-07-30

申请人： Koichi Hirano ,  Seiichi Nakatani ,  Tatsuo Ogawa

发明人： Koichi Hirano ,  Seiichi Nakatani ,  Tatsuo Ogawa

IPC分类号： H01L21/00

CPC分类号： H01L51/0541 ,  H01L51/0004 ,  H01L51/0022 ,  H01L51/0097 ,  H01L51/107 ,  Y02E10/549 ,  Y02P70/521

摘要： A method for manufacturing a flexible semiconductor device comprises (i) forming an insulating film on the upper surface of a resin film, (ii) forming a pattern of extraction electrodes on the upper surface of the resin film, (iii) forming a semiconductor layer on the insulating film in such a manner that the semiconductor layer is in contact with the pattern of extraction electrodes, and (iv) forming a sealing resin layer on the upper surface of the resin film in such a manner that the sealing resin layer covers the semiconductor layer and the pattern of extraction electrodes, wherein at least one of the stepsof the above steps (i) to (iv) is carried out by a printing method. With this manufacturing method, various layers can be formed by a simple printing process without using a vacuum process, photolithography, or the like.

摘要翻译： 一种制造柔性半导体器件的方法包括：（i）在树脂膜的上表面上形成绝缘膜，（ii）在树脂膜的上表面上形成提取电极的图案，（iii）形成半导体层 以使得半导体层与提取电极的图案接触的方式在绝缘膜上，以及（iv）在树脂膜的上表面上形成密封树脂层，使得密封树脂层覆盖 半导体层和提取电极的图案，其中通过印刷方法进行上述步骤（i）至（iv）中的步骤中的至少一个。 利用该制造方法，可以通过简单的印刷工艺形成各种层，而不使用真空工艺，光刻等。

公开(公告)号：US08343822B2

公开(公告)日：2013-01-01

申请号：US12681445

申请日：2009-07-30

申请人： Koichi Hirano ,  Seiichi Nakatani ,  Tatsuo Ogawa ,  Takashi Ichiryu ,  Takeshi Suzuki

发明人： Koichi Hirano ,  Seiichi Nakatani ,  Tatsuo Ogawa ,  Takashi Ichiryu ,  Takeshi Suzuki

IPC分类号： H01L21/84 ,  H01L21/00

CPC分类号： H01L29/78651 ,  H01L27/1218 ,  H01L27/124 ,  H01L27/1266 ,  H01L29/41733 ,  H01L29/42384 ,  H01L29/78603 ,  H01L29/7869

摘要： A method for manufacturing a flexible semiconductor device includes (i) forming an insulating film on the upper surface of metal foil, (ii) forming an extraction electrode pattern on the upper surface of the metal foil, (iii) forming a semiconductor layer on the insulating film such that the semiconductor layer is in contact with the extraction electrode pattern, (iv) forming a sealing resin layer on the upper surface of the metal foil such that the sealing resin layer covers the semiconductor layer and the extraction electrode pattern, and (v) forming electrodes by etching the metal foil, the metal foil being used as a support for the insulating film, the extraction electrode pattern, the semiconductor layer, and the sealing resin layer formed in (i) to (iv) and used as a constituent material for the electrodes in (v). The metal foil need not be stripped, and a high-temperature process can be used.

摘要翻译： 一种制造柔性半导体器件的方法包括：（i）在金属箔的上表面上形成绝缘膜，（ii）在金属箔的上表面上形成引出电极图案，（iii）在金属箔的上表面上形成半导体层 绝缘膜，使得半导体层与引出电极图案接触，（iv）在金属箔的上表面上形成密封树脂层，使得密封树脂层覆盖半导体层和引出电极图案，和（ v）通过蚀刻金属箔形成电极，金属箔用作绝缘膜的支撑体，引出电极图案，半导体层和形成在（i）至（iv）中的密封树脂层，并用作 （v）中的电极的构成材料。 金属箔不需要剥离，可以使用高温工艺。

公开(公告)号：US08143617B2

公开(公告)日：2012-03-27

申请号：US12667297

申请日：2008-07-01

申请人： Yoshihisa Yamashita ,  Seiichi Nakatani

发明人： Yoshihisa Yamashita ,  Seiichi Nakatani

IPC分类号： H01L29/41 ,  H01L29/786 ,  H01L29/06 ,  H01L51/30 ,  H01L51/50 ,  H01L51/52

CPC分类号： H01L51/057 ,  B82Y10/00 ,  H01L27/3274 ,  H01L51/0004

摘要： A semiconductor device having semiconductor elements disposed with higher density and a method for manufacturing the same are provided. An image display device employing the semiconductor device is also provided. A semiconductor device comprises a resin film having a through hole; and a semiconductor element comprising a gate electrode disposed on the inner wall of the through hole, an insulating layer that covers the gate electrode within the through hole, an organic semiconductor disposed on the insulating layer within the through hole, and a source electrode and a drain electrode which are electrically connected to the organic semiconductor.

摘要翻译： 提供了具有以更高密度设置的半导体元件的半导体器件及其制造方法。 还提供了采用半导体器件的图像显示装置。 半导体器件包括具有通孔的树脂膜; 以及半导体元件，包括设置在通孔的内壁上的栅电极，覆盖通孔内的栅电极的绝缘层，设置在通孔内的绝缘层上的有机半导体，以及源电极和 电极与有机半导体电连接。

公开(公告)号：US08097958B2

公开(公告)日：2012-01-17

申请号：US12298464

申请日：2007-04-18

申请人： Susumu Sawada ,  Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae

发明人： Susumu Sawada ,  Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/323 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/31 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16501 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/8192 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83886 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/361 ,  H05K3/363 ,  H05K2203/083 ,  H05K2203/087 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/29311 ,  H01L2924/00014 ,  H01L2924/00015

摘要： A connection structure (package 10) has a first plate body 101 and a second plate body; in the first plate body 101, a wiring pattern having a plurality of connection terminals 102 is formed, and the second plate body has at least two connection terminals (electrode terminals 104) arranged facing the connection terminals of the first plate body 101. The connection terminals of the first and second plate bodies are connection terminals formed as projections on the surfaces of the first and second plate bodies. A conductive substance 108 is accumulated to cover at least a part of each side face of the connection terminals opposed to each other of the first and second plate bodies, and the connection terminals thus opposed are connected to each other via the conductive substance. The package thus formed is ready for a high-pin-count, narrow-pitch configuration of a next-generation semiconductor chip, and exhibits excellent productivity and reliability. The present invention is advantageous for such a package, for a connection structure applicable to the production of the package, and for a method of producing the connection structure.

摘要翻译： 连接结构（封装10）具有第一板体101和第二板体; 在第一板体101中，形成具有多个连接端子102的布线图案，第二板体具有面对第一板体101的连接端子配置的至少两个连接端子（电极端子104）。连接 第一和第二板体的端子是在第一和第二板体的表面上形成为突起的连接端子。 聚集导电物质108以覆盖第一和第二板体彼此相对的连接端子的每个侧面的至少一部分，并且由此相对的连接端子经由导电物质彼此连接。 这样形成的封装准备好用于下一代半导体芯片的高引脚数，窄间距配置，并且表现出优异的生产率和可靠性。 本发明对于这种包装，对于适用于包装的生产的连接结构以及制造连接结构的方法是有利的。

公开(公告)号：US08071425B2

公开(公告)日：2011-12-06

申请号：US12764455

申请日：2010-04-21

申请人： Seiichi Nakatani ,  Takashi Kitae ,  Yoshihisa Yamashita ,  Takashi Ichiryu ,  Seiji Karashima

发明人： Seiichi Nakatani ,  Takashi Kitae ,  Yoshihisa Yamashita ,  Takashi Ichiryu ,  Seiji Karashima

IPC分类号： H01L21/52

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/83007 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2224/83874 ,  H01L2224/8388 ,  H01L2224/83888 ,  H01L2224/9201 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/0695 ,  H01L2224/05599

摘要： The flip chip mounted body of the present invention includes: a circuit board (213) having a plurality of connection terminals (211); a semiconductor chip (206) having a plurality of electrode terminals (207) that are disposed opposing the connection terminals (211); and a porous sheet (205) having a box shape that is provided on an opposite side of a formation surface of the electrode terminal (207) of the semiconductor chip (206), is folded on an outer periphery of the semiconductor chip (206) on the formation surface side of the electrode terminal (207) and is in contact with the circuit board (213), wherein the connection terminal (211) of the circuit board (213) and the electrode terminal (207) of the semiconductor chip (206) are connected electrically via a solder layer (215), and the circuit board (213) and the semiconductor chip (206) are fixed by a resin (217). Thereby, the flip chip mounted body with excellent productivity and reliability that can mount the semiconductor chip on the circuit board, and a method and an apparatus for mounting the flip chip mounted body are provided.

摘要翻译： 本发明的倒装芯片安装体包括：具有多个连接端子（211​​）的电路板（213）; 具有与所述连接端子相对设置的多个电极端子（207）的半导体芯片（206）。 在所述半导体芯片（206）的外周折叠具有设置在所述半导体芯片（206）的所述电极端子（207）的形成面的相反侧的盒状的多孔片（205） 在电极端子（207）的形成面侧与电路基板（213）接触，电路基板（213）的连接端子（211​​）和半导体芯片的电极端子（207） 206）通过焊料层（215）电连接，并且电路板（213）和半导体芯片（206）由树脂（217）固定。 因此，提供了将半导体芯片安装在电路板上的优异的生产率和可靠性的倒装芯片安装体以及安装倒装芯片安装体的方法和装置。

公开(公告)号：US08064213B2

公开(公告)日：2011-11-22

申请号：US11043123

申请日：2005-01-27

申请人： Toshiyuki Asahi ,  Seiji Karashima ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Tousaku Nishiyama

发明人： Toshiyuki Asahi ,  Seiji Karashima ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Tousaku Nishiyama

IPC分类号： H05K1/18

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/49805 ,  H01L23/5389 ,  H01L24/48 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/165 ,  H01L25/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0284 ,  H05K1/183 ,  H05K1/187 ,  H05K3/20 ,  H05K3/403 ,  H05K2203/302 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A module with a built-in component is provided which can be produced without a via-forming step. The module with a built-in component 100 includes an insulating sheet substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10b and a side surface 10c which connects these surfaces. At least one wiring 20 extends from the upper surface to the lower surface through the side surface, and an electronic component 32 is disposed within the sheet substrate.

摘要翻译： 提供具有内置部件的模块，其可以在没有通孔形成步骤的情况下制造。 具有内置部件100的模块包括绝缘片基板10，其具有上表面10a，与上表面10b相对的下表面10b和连接这些表面的侧表面10c。 至少一个布线20通过侧面从上表面延伸到下表面，并且电子部件32设置在片状基板内。