公开(公告)号：US08049325B2

公开(公告)日：2011-11-01

申请号：US12472725

申请日：2009-05-27

申请人： Shin Mu-Seob ,  Tae-Hun Kim ,  Min-Gi Hong ,  Shin Kim ,  Tae-Hun Yoon

发明人： Shin Mu-Seob ,  Tae-Hun Kim ,  Min-Gi Hong ,  Shin Kim ,  Tae-Hun Yoon

IPC分类号： H01L23/538

CPC分类号： H01L23/13 ,  H01L23/49816 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/16145 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An integrated circuit substrate includes an integrated circuit chip having a plurality of electrically conductive pads on a surface thereof and a printed circuit board mounted to the integrated circuit chip. The printed circuit board includes an alternating arrangement of first and second electrically conductive bond fingers. These first and second bond fingers are elevated at first and second different heights, respectively, relative to the plurality of electrically conductive pads. The printed circuit board also includes a first plurality of electrically insulating pedestals supporting respective ones of the first electrically conductive bond fingers at elevated heights relative to the second electrically conductive bond fingers. First and second pluralities of electrical interconnects (e.g., wires, beam leads) are also provided. The first plurality of electrical interconnects operate to electrically connect first ones of the plurality of electrically conductive pads to respective ones of the first electrically conductive bond fingers. The second plurality of electrical interconnects electrically connect second ones of the plurality of electrically conductive pads to respective ones of the second electrically conductive bond fingers.

摘要翻译： 集成电路基板包括在其表面上具有多个导电焊盘的集成电路芯片和安装到集成电路芯片的印刷电路板。 印刷电路板包括第一和第二导电键合指状物的交替布置。 这些第一和第二粘结指相对于多个导电垫分别在第一和第二不同的高度处升高。 印刷电路板还包括第一多个电绝缘基座，其相对于第二导电粘合指状件在升高的高度处支撑相应的第一导电键合指状物。 还提供了第一和第二多个电互连（例如，电线，光束引线）。 第一多个电互连操作以将多个导电焊盘中的第一个导电焊盘电连接到相应的第一导电焊接指状物。 所述第二多个电互连将所述多个导电焊盘中的第二导电焊盘电连接到所述第二导电焊接指中的相应导电焊盘。

公开(公告)号：US20100127381A1

公开(公告)日：2010-05-27

申请号：US12472725

申请日：2009-05-27

申请人： Mu-Seob Shin ,  Tae-Hun Kim ,  Min-Gi Hong ,  Shin Kim ,  Tae-Sung Yoon

发明人： Mu-Seob Shin ,  Tae-Hun Kim ,  Min-Gi Hong ,  Shin Kim ,  Tae-Sung Yoon

IPC分类号： H01L23/538 ,  H01L23/50 ,  H01L23/482

CPC分类号： H01L23/13 ,  H01L23/49816 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/16145 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An integrated circuit substrate includes an integrated circuit chip having a plurality of electrically conductive pads on a surface thereof and a printed circuit board mounted to the integrated circuit chip. The printed circuit board includes an alternating arrangement of first and second electrically conductive bond fingers. These first and second bond fingers are elevated at first and second different heights, respectively, relative to the plurality of electrically conductive pads. The printed circuit board also includes a first plurality of electrically insulating pedestals supporting respective ones of the first electrically conductive bond fingers at elevated heights relative to the second electrically conductive bond fingers. First and second pluralities of electrical interconnects (e.g., wires, beam leads) are also provided. The first plurality of electrical interconnects operate to electrically connect first ones of the plurality of electrically conductive pads to respective ones of the first electrically conductive bond fingers. The second plurality of electrical interconnects electrically connect second ones of the plurality of electrically conductive pads to respective ones of the second electrically conductive bond fingers.

摘要翻译： 集成电路基板包括在其表面上具有多个导电焊盘的集成电路芯片和安装到集成电路芯片的印刷电路板。 印刷电路板包括第一和第二导电键合指状物的交替布置。 这些第一和第二粘结指相对于多个导电垫分别在第一和第二不同的高度处升高。 印刷电路板还包括第一多个电绝缘基座，其相对于第二导电粘合指状件在升高的高度处支撑相应的第一导电键合指状物。 还提供了第一和第二多个电互连（例如，电线，光束引线）。 第一多个电互连操作以将多个导电焊盘中的第一个导电焊盘电连接到相应的第一导电焊接指状物。 所述第二多个电互连将所述多个导电焊盘中的第二导电焊盘电连接到所述第二导电焊接指中的相应导电焊盘。

公开(公告)号：US09136446B2

公开(公告)日：2015-09-15

申请号：US13361555

申请日：2012-01-30

申请人： Shin Kim

发明人： Shin Kim

IPC分类号： H01L33/00 ,  H01L33/58 ,  H01L33/62 ,  H01L33/38 ,  H01L33/46 ,  H01L33/42

CPC分类号： H01L33/58 ,  H01L33/38 ,  H01L33/42 ,  H01L33/44 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2933/0083 ,  H01L2924/00014 ,  H01L2924/00

摘要： Embodiments provide a light emitting device including a light emitting structure having a first conduction type semiconductor layer, an active layer, and a second conduction type semiconductor layer, a metal filter of an irregular pattern on the light emitting structure, and openings between the irregular patterns in the metal filter.

摘要翻译： 实施例提供一种发光器件，其包括具有第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构，发光结构上的不规则图案的金属滤光器，以及不规则图案之间的开口 在金属过滤器中。

公开(公告)号：US20110171882A1

公开(公告)日：2011-07-14

申请号：US12985048

申请日：2011-01-05

申请人： Jong-sun Ahn ,  In-seak Hwang ,  Soo-young Tak ,  Shin Kim ,  One-moon Chang

发明人： Jong-sun Ahn ,  In-seak Hwang ,  Soo-young Tak ,  Shin Kim ,  One-moon Chang

IPC分类号： B24B41/06 ,  B24B49/00

CPC分类号： B24B37/10 ,  B24B49/12

摘要： A chemical-mechanical polishing (CMP) apparatus for manufacturing a semiconductor device. The apparatus includes: a spin chuck for supporting and rotating a semiconductor wafer; a polisher comprising a polishing pad for planarizing a surface of the semiconductor wafer, the polisher moving along the surface of the semiconductor wafer by a polishing arm; and a polisher supporting device for supporting the polisher and maintaining the polisher in a horizontal state, while polishing an edge part of the surface of the semiconductor wafer, in order to improve polishing uniformity of a center part and the edge part of the semiconductor wafer. Accordingly, polishing uniformity of the center part and edge part of the semiconductor wafer may be improved, and a height of the polisher supporting device may be optimized according to a polishing degree. Also, the polisher may be easily supported, wear and tear of the support head may be minimized, and the support head may function as a conditioner.

摘要翻译： 一种用于制造半导体器件的化学机械抛光（CMP）装置。 该装置包括：用于支撑和旋转半导体晶片的旋转卡盘; 抛光机，包括用于平坦化半导体晶片的表面的抛光垫，抛光机通过抛光臂沿着半导体晶片的表面移动; 以及用于在抛光半导体晶片的表面的边缘部分的同时在支撑抛光机并将抛光机保持在水平状态的抛光机支撑装置，以便改善半导体晶片的中心部分和边缘部分的抛光均匀性。 因此，可以提高半导体晶片的中心部分和边缘部分的抛光均匀性，并且可以根据抛光度来优化抛光机支撑装置的高度。 此外，可以容易地支撑抛光机，可以使支撑头的磨损和撕裂最小化，并且支撑头可用作调节器。

公开(公告)号：US20070102816A1

公开(公告)日：2007-05-10

申请号：US11431703

申请日：2006-05-11

申请人： Shin Kim

发明人： Shin Kim

IPC分类号： H01L23/48

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1815 ,  H05K2201/09745 ,  H05K2201/10977 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2224/05599

摘要： A board structure, a ball grid array (BGA) package and method thereof and a solder ball and method thereof. The example solder ball may include a solder portion and a grooved connection portion, formed through a partitioning process, configured to fit a corresponding protruding portion on a board. The example BGA package may include a plurality of the example solder balls. The example board structure may include the example BGA package connected to the board via the grooved connection portions and the protruding portions.

摘要翻译： 板结构，球栅阵列（BGA）封装及其方法和焊球及其方法。 示例性焊球可以包括通过分隔工艺形成的焊接部分和带槽的连接部分，其被配置为将相应的突出部分装配在电路板上。 示例性BGA封装可以包括多个示例性焊球。 示例板结构可以包括通过带槽连接部分和突出部分连接到板的示例性BGA封装。

公开(公告)号：US20050249560A1

公开(公告)日：2005-11-10

申请号：US11118165

申请日：2005-04-28

申请人： Hwan Lee ,  Seo Pyun ,  Sang Lee ,  Byung Jin ,  Sang Lee ,  Tae Um ,  Yong Shim ,  Shin Kim

发明人： Hwan Lee ,  Seo Pyun ,  Sang Lee ,  Byung Jin ,  Sang Lee ,  Tae Um ,  Yong Shim ,  Shin Kim

IPC分类号： B23D61/00 ,  B23D61/04 ,  B28D1/12

CPC分类号： B23D61/04 ,  B28D1/121 ,  Y10T407/26

摘要： Disclosed is a diamond tool having a metal plate inserted therein. Between abrasive layers containing diamond particles is inserted a ferrous or non-ferrous metal plate having a wear resistance lower than that of the abrasive layers such that a concave groove is spontaneously formed during a cutting process, thereby reducing the contact load with a workpiece to thereby avoid vibration (wobbling) of a shank, and providing a discharge path for smoothly removing cutting chips and the cooling water. In addition, the content of abrasives and the wear resistance of bonding material are uniformly constituted so that the shrinkage rate does not need to be considered during sintering and the manufacturing process can be simplified, thereby reducing the manufacturing cost and improving the productivity therefor. Furthermore, the area of the metal plate can be controlled, thereby enabling an easy design conforming to the working conditions with a workpiece.

摘要翻译： 公开了一种金刚石工具，其中插入有金属板。 在含有金刚石颗粒的研磨层之间插入耐磨性低于研磨层的耐磨性的铁或非铁金属板，使得在切割过程中自发形成凹槽，从而减少与工件的接触载荷 避免柄的振动（摆动），并且提供用于平滑地去除切屑和冷却水的排出路径。 此外，研磨剂的含量和接合材料的耐磨性均匀地构成，使得在烧结期间不需要考虑收缩率，并且可以简化制造过程，从而降低制造成本并提高其生产率。 此外，可以控制金属板的面积，从而能够使与工件的工作条件相一致的简单设计。

公开(公告)号：US09239389B2

公开(公告)日：2016-01-19

申请号：US13616137

申请日：2012-09-14

申请人： Yeon Kyu Jeong ,  Shin Kim ,  Jeong Hun Kim ,  Jong Owan Kim ,  Sang Sik Yoon ,  Dong Hun Lee ,  Jea Yun So

发明人： Yeon Kyu Jeong ,  Shin Kim ,  Jeong Hun Kim ,  Jong Owan Kim ,  Sang Sik Yoon ,  Dong Hun Lee ,  Jea Yun So

IPC分类号： G02B17/08 ,  G01S17/00 ,  G05D1/02 ,  G01S17/88 ,  G01S17/93 ,  G01S7/481

CPC分类号： G01S17/00 ,  G01S7/4813 ,  G01S7/4814 ,  G01S7/4816 ,  G01S17/88 ,  G01S17/936 ,  G02B17/0808 ,  G05D1/0238 ,  G05D1/0248 ,  G05D2201/0203

摘要： An obstacle sensor includes a line light irradiating unit including a light-emitting unit, a light-emitting driving unit to drive the light-emitting unit, and a first conical mirror, an apex of which is disposed towards the light-emitting unit in a light irradiation direction of the light-emitting unit and which converts light emitted from the light-emitting unit into line light irradiated in all directions, and a reflected light receiving unit including a second conical mirror to condense light, that is irradiated from the first conical mirror and is then reflected from an obstacle, a lens, that is spaced from the apex of the second conical mirror by a predetermined distance and transmits the reflected light, an imaging unit to image the reflected light that passes through the lens, an image processing unit, and an obstacle sensing control unit.

摘要翻译： 障碍传感器包括：行光照射单元，包括发光单元，驱动发光单元的发光驱动单元;以及第一锥形反射镜，其顶点设置在发光单元中 发光单元的光照射方向，并将从发光单元发射的光转换为沿所有方向照射的线光;以及反射光接收单元，包括第二锥形镜以使光从第一锥形 然后从与第二锥形反射镜的顶点隔开预定距离的障碍物，透镜反射并透射反射光，成像单元对通过透镜的反射光进行成像，图像处理 单元和障碍物感测控制单元。

公开(公告)号：US20070150070A1

公开(公告)日：2007-06-28

申请号：US11317419

申请日：2005-12-22

申请人： Shin Kim ,  Moo Moon ,  Jae Ahn

发明人： Shin Kim ,  Moo Moon ,  Jae Ahn

IPC分类号： A61F2/78 ,  A61F2/28

CPC分类号： A61F2/2814 ,  A61F2/30749 ,  A61F2/60 ,  A61F2002/30143 ,  A61F2002/30225 ,  A61F2002/30367 ,  A61F2002/30377 ,  A61F2002/30433 ,  A61F2002/30443 ,  A61F2002/30474 ,  A61F2002/30785 ,  A61F2002/30789 ,  A61F2002/30794 ,  A61F2002/30795 ,  A61F2002/7887 ,  A61F2220/0025 ,  A61F2220/0033 ,  A61F2220/0041 ,  A61F2230/0017 ,  A61F2230/0069

摘要： Disclosed herein is an implant device for osseointegration to endure weight. This implant device includes an insert-type implant inserted into an amputated end of a thighbone or a lower leg bone of a leg of a patient; a load dispersing adaptor having a cap shape, encompassing both the implant and the amputated end of the leg simultaneously at a lower end of the implant; a load support plate having a plate shape, coupled with the lower surface of the adaptor, whose diameter is widened, on which a plurality of muscle fixing holes are dispersedly formed; and a coupling screw, which couples the load dispersing adaptor with the insert-type implant at a bottom of the load dispersing plate through screw-coupling.

摘要翻译： 本文公开了一种用于骨整合以承受体重的植入装置。 该植入装置包括插入患者腿部的大腿骨或小腿骨的截肢端的插入式植入物; 具有帽形状的负载分散适配器，同时在所述植入物的下端同时包围所述植入物和所述腿的截肢端; 具有平板形状的负载支撑板，其与直径扩大的适配器的下表面联接，多个肌肉固定孔分散在其上形成; 以及联接螺钉，其通过螺纹联接将负载分散适配器与插入式植入物连接在负载分散板的底部。

公开(公告)号：US20050198104A1

公开(公告)日：2005-09-08

申请号：US11044557

申请日：2005-01-27

申请人： Oh Kwon ,  Jae Hahm ,  Sang Kim ,  Jong Lee ,  Hyung Park ,  Kyung Park ,  Shin Kim ,  Kwang Koh

发明人： Oh Kwon ,  Jae Hahm ,  Sang Kim ,  Jong Lee ,  Hyung Park ,  Kyung Park ,  Shin Kim ,  Kwang Koh

IPC分类号： G06F15/163 ,  G06F15/16

CPC分类号： G06F9/5072

摘要： Disclosed is a file-based grid MPI job allocation system for a middleware-based grid computing system in which computers having a plurality of resources including an MPI program are distributed and connected to each other through a network, wherein the grid MPI job allocation system differentiates functions of a middleware and the MPI program, thereby achieving MPI initialization without intervention of a separate arbitration process. The job submission service module generates a file containing an address, a port number, etc. of each node, which are necessary for the MPI initialization, and sends the file to the job execution service module of the corresponding node. Each job execution service module executes the MPI job, and the MPI program waits for the generation of the file and then performs initialization by using the information in the file. The present invention clearly differentiates the jobs to be done by the MPI program and by the job submission service module in the middleware, thereby enabling the MPI program to be executed in the grid computing system regardless of the design of the middleware.

摘要翻译： 公开了一种用于基于中间件的网格计算系统的基于文件的网格MPI作业分配系统，其中包括MPI程序的多个资源的计算机通过网络分布并彼此连接，其中网格MPI作业分配系统区分 中间件和MPI程序的功能，从而实现MPI初始化，而不需要单独的仲裁过程。 作业提交服务模块生成包含MPI初始化所需的每个节点的地址，端口号等的文件，并将该文件发送到相应节点的作业执行服务模块。 每个作业执行服务模块执行MPI作业，并且MPI程序等待文件的生成，然后使用文件中的信息执行初始化。 本发明明确区分由MPI程序和作业提交服务模块在中间件中完成的作业，从而使得能够在网格计算系统中执行MPI程序，而不管中间件的设计如何。

公开(公告)号：US06876074B2

公开(公告)日：2005-04-05

申请号：US10201805

申请日：2002-07-23

申请人： Shin Kim

发明人： Shin Kim

IPC分类号： H01L23/14 ,  H01L23/02 ,  H01L23/31 ,  H01L23/34 ,  H01L23/48 ,  H01L23/498 ,  H01L25/10 ,  H01L29/40

CPC分类号： H01L23/3114 ,  H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A Chip Scale Package (CSP) type unit package including a semiconductor chip and a double wiring substrate, the double wiring substrate including an adhesive and a flexible tape having an upper surface with a first wiring pattern, a lower surface with a second wiring pattern and a plurality of vias electrically connecting portions of the first and second wiring patterns. Additionally, the unit package may be stacked on a conventional base package or on another unit package, where stacked packages are electrically interconnected.

摘要翻译： 一种包括半导体芯片和双重布线基板的芯片级封装（CSP）型单元封装，所述双重布线基板包括粘合剂和具有第一布线图案的上表面的柔性带，具有第二布线图案的下表面和 电连接第一和第二布线图案的多个通孔。 另外，单元封装可以堆叠在传统的基底封装上或者堆叠的封装电互连的另一个单元封装上。