-
1.发明申请METHODS OF FORMING ULTRA THIN PACKAGE STRUCTURES INCLUDING LOW TEMPERATURE SOLDER AND STRUCTURES FORMED THERBY 有权形成超低密度包装结构的方法，包括低温焊料和形成的结构公开(公告)号：US20140175644A1
公开(公告)日：2014-06-26
申请号：US13721329
申请日：2012-12-20
申请人： Sriram Srinivasan , Ram S. Viswanath , Paul R. Start , Rajen S. Sidhu , Rajasekaran Swaminathan
发明人： Sriram Srinivasan , Ram S. Viswanath , Paul R. Start , Rajen S. Sidhu , Rajasekaran Swaminathan
IPC分类号： H01L23/00 , H01L23/498
CPC分类号： H01L24/81 , H01L23/3675 , H01L23/42 , H01L23/49816 , H01L23/49838 , H01L23/562 , H01L24/13 , H01L24/16 , H01L2224/131 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/32245 , H01L2224/73253 , H01L2224/81203 , H01L2224/8121 , H01L2224/81801 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01083 , H01L2924/01322 , H01L2924/014 , H01L2924/1436 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/20105 , H01L2924/2064 , H01L2924/20643 , H01L2924/3511 , H01L2924/3512 , H01L2924/00014 , H01L2924/00
摘要： Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include attaching a device to a patch substrate, wherein the assembled device and patch substrate comprise a warpage, attaching the assembled device and patch substrate to an interposer to form a package structure, and then reflowing the package structure at a temperature below about 200 degrees Celsius to form a substantially flat package structure.
摘要翻译： 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法和结构可以包括将装置附接到贴片基板，其中组装的装置和贴片基板包括翘曲，将组装的装置和贴片基板附接到插入件以形成封装结构，然后在温度下回流封装结构 低于大约200摄氏度以形成基本平坦的包装结构。
-
公开(公告)号：US20140191419A1
公开(公告)日：2014-07-10
申请号：US13995917
申请日：2011-12-22
申请人： Debendra Mallik , Ram S. Viswanath , Sriram Srinivasan , Mark T. Bohr , Andrew W. Yeoh , Sairam Agraharam
发明人： Debendra Mallik , Ram S. Viswanath , Sriram Srinivasan , Mark T. Bohr , Andrew W. Yeoh , Sairam Agraharam
IPC分类号： H01L25/065 , H01L23/498
CPC分类号： H01L23/49838 , H01L23/13 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L25/0652 , H01L25/0657 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2225/06513 , H01L2225/06517 , H01L2225/06544 , H01L2225/06555 , H01L2225/06562 , H01L2924/1461 , H01L2924/15151 , H01L2924/15311 , H01L2924/00
摘要： 3D integrated circuit packages with window interposers and methods to form such semiconductor packages are described. For example, a semiconductor package includes a substrate. A top semiconductor die is disposed above the substrate. An interposer having a window is disposed between and interconnected to the substrate and the top semiconductor die. A bottom semiconductor die is disposed in the window of the interposer and interconnected to the top semiconductor die. In another example, a semiconductor package includes a substrate. A top semiconductor die is disposed above the substrate. An interposer is disposed between and interconnected to the substrate and the top semiconductor die. A bottom semiconductor die is disposed in a same plane as the interposer and interconnected to the top semiconductor die.
摘要翻译： 描述了具有窗口插入件的3D集成电路封装和形成这种半导体封装的方法。 例如，半导体封装包括衬底。 顶部半导体管芯设置在衬底上方。 具有窗口的插入件设置在基板和顶部半导体管芯之间并与之互连。 底部半导体管芯设置在插入件的窗口中并且互连到顶部半导体管芯。 在另一示例中，半导体封装包括衬底。 顶部半导体管芯设置在衬底上方。 插入器设置在衬底和顶部半导体管芯之间并且互连到衬底和顶部半导体管芯。 底部半导体管芯设置在与插入器相同的平面中并且互连到顶部半导体管芯。
-
公开(公告)号：US09129958B2
公开(公告)日：2015-09-08
申请号：US13995917
申请日：2011-12-22
申请人： Debendra Mallik , Ram S. Viswanath , Sriram Srinivasan , Mark T. Bohr , Andrew W. Yeoh , Sairam Agraharam
发明人： Debendra Mallik , Ram S. Viswanath , Sriram Srinivasan , Mark T. Bohr , Andrew W. Yeoh , Sairam Agraharam
IPC分类号： H01L23/48 , H01L23/498 , H01L23/13 , H01L25/065
CPC分类号： H01L23/49838 , H01L23/13 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L25/0652 , H01L25/0657 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2225/06513 , H01L2225/06517 , H01L2225/06544 , H01L2225/06555 , H01L2225/06562 , H01L2924/1461 , H01L2924/15151 , H01L2924/15311 , H01L2924/00
摘要： 3D integrated circuit packages with window interposers and methods to form such semiconductor packages are described. For example, a semiconductor package includes a substrate. A top semiconductor die is disposed above the substrate. An interposer having a window is disposed between and interconnected to the substrate and the top semiconductor die. A bottom semiconductor die is disposed in the window of the interposer and interconnected to the top semiconductor die. In another example, a semiconductor package includes a substrate. A top semiconductor die is disposed above the substrate. An interposer is disposed between and interconnected to the substrate and the top semiconductor die. A bottom semiconductor die is disposed in a same plane as the interposer and interconnected to the top semiconductor die.
摘要翻译： 描述了具有窗口插入件的3D集成电路封装和形成这种半导体封装的方法。 例如，半导体封装包括衬底。 顶部半导体管芯设置在衬底上方。 具有窗口的插入件设置在基板和顶部半导体管芯之间并与之互连。 底部半导体管芯设置在插入件的窗口中并且互连到顶部半导体管芯。 在另一示例中，半导体封装包括衬底。 顶部半导体管芯设置在衬底上方。 插入器设置在衬底和顶部半导体管芯之间并且互连到衬底和顶部半导体管芯。 底部半导体管芯设置在与插入器相同的平面中并且互连到顶部半导体管芯。
-
4.发明授权Method of forming a substrate core with embedded capacitor and structures formed thereby 有权用嵌入式电容器形成衬底芯的方法和由此形成的结构公开(公告)号：US09572258B2
公开(公告)日：2017-02-14
申请号：US11027386
申请日：2004-12-30
申请人： Sriram Srinivasan , John S. Guzek , Cengiz A. Palanduz , Victor Prokofiev , Joel A. Auernheimer
发明人： Sriram Srinivasan , John S. Guzek , Cengiz A. Palanduz , Victor Prokofiev , Joel A. Auernheimer
CPC分类号： H05K1/162 , H01G4/10 , H01G4/1209 , H01G4/33 , H05K3/429 , H05K3/4611 , H05K2201/0175 , H05K2201/0179 , H05K2201/09309 , Y10T29/43 , Y10T29/49147 , Y10T29/49155 , Y10T29/49165
摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.
摘要翻译： 描述形成微电子结构的方法。 这些方法的实施例包括通过将第一电介质层附着到薄膜电容器的第二导电层并且将第二电介质层附接到薄膜电容器的第一导电层来形成衬底芯。
-
5.发明申请公开(公告)号：US20160212272A1
公开(公告)日：2016-07-21
申请号：US14602246
申请日：2015-01-21
CPC分类号： H04M3/567 , G06F3/165 , G06F3/167 , G06T19/006 , H04M3/568 , H04N7/147 , H04N21/41407 , H04N21/42202 , H04N21/439 , H04S1/00 , H04S7/303 , H04S7/304 , H04S2400/11 , H04S2420/01
摘要： A user device for generating a scene, the user device comprising: an object determiner configured to determine an object for the scene, the object being associated with at least one audio signal; a relative position/orientation determiner configured to determine a relative position/orientation between the user device's user and the object; an audio position processor configured to spatially audio signal process the at least one audio signal to generate at least two channel audio signal based on the relative position/orientation.
摘要翻译： 一种用于生成场景的用户设备，所述用户设备包括：对象确定器，被配置为确定所述场景的对象，所述对象与至少一个音频信号相关联; 配置为确定用户设备的用户与对象之间的相对位置/取向的相对位置/方向确定器; 配置为空间音频信号的音频位置处理器处理所述至少一个音频信号以基于所述相对位置/取向产生至少两个声道音频信号。
-
公开(公告)号：US09118143B2
公开(公告)日：2015-08-25
申请号：US13729261
申请日：2012-12-28
CPC分类号： H01R43/205 , H01R12/73 , H01R13/6205 , H01R43/26 , Y10T29/4913 , Y10T29/49146 , Y10T29/49149
摘要： A mechanism is described for facilitating and employing a magnetic grid array according to one embodiment. A method of embodiments may include engaging, via magnetic force of a magnet, magnetic contacts of a magnetic grid array to substrate lands of a package substrate of an integrated circuit package of a computing system, and disengaging, via a removal lever, the magnetic contacts from the substrate lands.
摘要翻译： 描述了根据一个实施例的用于促进和采用磁栅阵列的机构。 实施例的方法可以包括通过磁体的磁力使磁栅阵列的磁触点与计算系统的集成电路封装的封装衬底的衬底焊盘接合，并且经由去除杆将磁触头 从衬底。
-
公开(公告)号：US08726679B2
公开(公告)日：2014-05-20
申请号：US13058725
申请日：2009-08-11
CPC分类号： F04B7/00 , F04B1/02 , F04B1/0452
摘要： A reciprocating piston compressor for use in a refrigerant compression circuit comprises first and second intake manifolds, first and second reciprocating piston compression units, an outlet manifold and a first pulsing valve. The intake manifolds segregate inlet flow into the compressor. The first and second reciprocating piston compression units receive flow from the first and second intake manifolds, respectively. The outlet manifold collects and distributes compressed refrigerant from the compression units. The first pulsing valve is mounted externally of the first intake manifold to regulate refrigerant flow into the first intake manifold. In another embodiment, a second valve is mounted externally of the second intake manifold to regulate flow into the second intake manifold, and the first and second valves are operated by a controller. The controller activates the first valve with variable width pulses having intervals less than an operating inertia of the refrigerant compression circuit.
摘要翻译： 用于制冷剂压缩回路的往复活塞式压缩机包括第一和第二进气歧管，第一和第二往复活塞压缩单元，出口歧管和第一脉动阀。 进气歧管隔离进入压缩机的入口流。 第一和第二往复活塞压缩单元分别接收来自第一和第二进气歧管的流量。 出口歧管从压缩单元收集和分配压缩的制冷剂。 第一脉冲阀安装在第一进气歧管的外部以调节进入第一进气歧管的制冷剂流。 在另一个实施例中，第二阀安装在第二进气歧管的外部以调节进入第二进气歧管的流量，并且第一和第二阀由控制器操作。 控制器以可变宽度脉冲激活具有小于制冷剂压缩回路的操作惯性的间隔的第一阀。
-
公开(公告)号：US20130262101A1
公开(公告)日：2013-10-03
申请号：US13993100
申请日：2011-12-07
申请人： Sriram Srinivasan
发明人： Sriram Srinivasan
IPC分类号： G10L21/0208
CPC分类号： G10L21/0208 , G10L2021/02165
摘要： Noise reduction system with remote noise detector The present invention relates to a noise reduction system with at least one remote noise detector placed close to at least one noise source, which transmits relevant information to a primary device where it is used for noise reduction. Thereby, acoustic signal enhancement can be achieved via the at least one remote noise detector in that a noise estimate is transmitted to controller for noise reduction in the signal obtained from a primary source.
摘要翻译： 具有远程噪声检测器的降噪系统技术领域本发明涉及一种降噪系统，该系统具有至少一个靠近至少一个噪声源的远程噪声检测器，其将相关信息发送到用于降噪的主要装置。 因此，可以经由至少一个远程噪声检测器来实现声信号增强，因为噪声估计被发送到控制器以用于从主源获得的信号中的噪声降低。
-
公开(公告)号：US07689576B2
公开(公告)日：2010-03-30
申请号：US11372516
申请日：2006-03-10
CPC分类号： G06F9/4486
摘要： A method for dilating a sub-flow operator in a data flow is provided. The data flow is traversed to locate sub-flow operators. The data flow bound to a sub-flow operator is retrieved. The sub-flow operators are then injected into the data flow.
摘要翻译： 提供了一种用于在数据流中扩展子流程操作符的方法。 遍历数据流以查找子流操作符。 检索绑定到子流程操作符的数据流。 然后将子流程操作符注入到数据流中。
-
10.发明申请Refrigerant System with Pulse Width Modulated Components and Variable Speed Compressor 审中-公开具有脉宽调制元件和变速压缩机的制冷剂系统公开(公告)号：US20080223057A1
公开(公告)日：2008-09-18
申请号：US12088022
申请日：2005-10-26
CPC分类号： F25B49/025 , F04C28/08 , F04C28/26 , F04C29/042 , F25B1/04 , F25B41/043 , F25B2400/13 , F25B2600/0253 , F25B2600/0261 , F25B2600/2521 , Y02B30/741
摘要： A variable speed drive is provided for operating a compressor motor in a refrigerant system. When a low load situation has been determined by the refrigerant system controls, the variable speed drive operates the compressor motor at lower speed mode of operation. Further, the operation of the variable speed drive is combined with a pulse width modulation control of different system components. In particular, at least one valve or compressor can be can be rapidly cycled by the control to regulate amount of refrigerant passing through the valve or compressor. Example valves would include a shut-off valve for an economizer cycle, an unloader valve, or a suction modulation valve.
摘要翻译： 提供了用于在制冷剂系统中操作压缩机电动机的变速驱动器。 当由制冷剂系统控制确定低负载情况时，变速驱动器以较低速运行模式操作压缩机马达。 此外，变速驱动器的操作与不同系统部件的脉宽调制控制相结合。 特别地，至少一个阀门或压缩机可以通过控制器快速循环，以调节通过阀门或压缩机的制冷剂量。 示例性阀门将包括用于节能循环的截止阀，卸载阀或抽吸调节阀。
-
-
-
-
-
-
-
-
-
搜索结果
69 条记录 (耗时 0.035 秒)
