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公开(公告)号：US11407202B2
公开(公告)日：2022-08-09
申请号：US17266476
申请日：2019-08-05
申请人： TOYO KOHAN CO., LTD
发明人： Yusuke Hashimoto , Teppei Kurokawa
IPC分类号： B32B15/20 , B32B15/01 , B23K20/04 , B23K20/24 , B32B3/30 , C23F4/00 , B23K103/04 , B23K103/12
摘要： This invention provides a roll-bonded laminate composed of a hard copper layer and a stainless steel layer, which is sufficient both in radiation performance and strength. A roll-bonded laminate 1A is composed of a copper layer 10A and a stainless steel layer 20A, in which thickness of the roll-bonded laminate 1A is 0.02 mm to 0.4 mm, hardness of the copper layer 10A is 70 Hv or higher, and 180° peel strength of the roll-bonded laminate 1A is 6 N/20 mm or more.
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公开(公告)号：US10748678B2
公开(公告)日：2020-08-18
申请号：US15522378
申请日：2015-10-23
发明人： Teppei Kurokawa , Yusuke Hashimoto , Hironao Okayama , Tatsuoki Nagaishi , Kotaro Ohki , Genki Honda
摘要： This invention provides a substrate for a superconducting wire used for manufacturing a superconducting wire with excellent superconductivity and a method for manufacturing the same. Such substrate for a superconducting wire exhibits the crystal orientation of metals on the outermost layer, such as a c-axis orientation rate of 99% or higher, a Δω of 6 degrees or less, and a percentage of an area in which the crystal orientation is deviated by 6 degrees or more from the (001) [100] per unit area of 6% or less.
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公开(公告)号：US20180297327A1
公开(公告)日：2018-10-18
申请号：US15768902
申请日：2016-10-21
摘要： It is an object to provide a method for producing a substrate for epitaxial growth having a higher degree of biaxial crystal orientation without forming an irregular part a3. The method for producing a substrate for epitaxial growth comprising a step of laminating a metal base material and a copper layer having an fcc rolling texture by surface-activated bonding, a step of applying mechanical polishing to the copper layer, and a step of carrying out orientation heat treatment of the copper layer, wherein the copper layer is laminated in such a way that, when ratios of the (200) plane of the copper layer before laminated and of the copper layer after laminated when measured by XRD are I0Cu and I0CLAD, respectively and ratios of the (220) plane of the copper layer before laminated and of the copper layer after laminated are I2Cu and I2CLAD, respectively, I0Cu
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公开(公告)号：US20180265990A1
公开(公告)日：2018-09-20
申请号：US15764398
申请日：2016-09-30
申请人： Toyo Kohan Co., Ltd.
发明人： Kouji Nanbu , Yusuke Hashimoto , Hironao Okayama
CPC分类号： C23F4/00 , B23K20/04 , B23K2103/05 , B23K2103/15 , B32B15/01 , B32B15/013 , B32B37/06 , B32B37/18 , B32B38/0008 , B32B2309/02 , B32B2309/105 , B32B2311/00 , C21D1/26 , C21D9/0068 , C21D9/46 , C21D2251/02 , C22C23/00 , C22C38/18 , C22F1/06
摘要： This invention provides a magnesium laminate material with high heat radiation performance, reduced weight, higher strength, and excellent molding processability. Such metal laminate material has a three-layer-structure of a first stainless steel layer, a magnesium layer and a second stainless steel layer, wherein tensile strength (TS) is 200 to 430 MPa, elongation (EL) is 10% or more, and the surface hardness (Hv) of the first stainless steel layer and the second stainless steel layer is 300 or less.
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5.发明申请METHOD FOR FORMING OXIDE LAYER, LAMINATED SUBSTRATE FOR EPITAXIAL GROWTH, AND METHOD FOR PRODUCING THE SAME 审中-公开用于形成氧化层的方法，用于外延生长的层压基板及其制造方法公开(公告)号：US20160194750A1
公开(公告)日：2016-07-07
申请号：US14916363
申请日：2014-08-25
发明人： Yusuke Hashimoto , Teppei Kurokawa , Takashi Koshiro , Hironao Okayama , Tatsuoki Nagaishi , Kotaro Ohki , Genki Honda
CPC分类号： C23C14/35 , C23C14/08 , C23C14/083 , C23C14/541 , C23C28/321 , C23C28/322 , C23C28/3455 , C30B23/02 , C30B29/16 , C30B29/22 , H01L39/2461
摘要： This invention provides a method for forming an oxide layer on a metal substrate, which enables manufacture of an oxide layer with improved crystal orientation in comparison with that of the outermost layer of a metal substrate. The method for forming an oxide layer on a metal substrate 20 via RF magnetron sputtering comprises a step of subjecting the crystal-oriented metal substrate 20 exhibiting a c-axis orientation of 99% on its outermost layer to RF magnetron sputtering while adjusting the angle α formed by a perpendicular at a film formation position 20a on the metal substrate 20 and a line from the film formation position 20a to a point 10a at which the perpendicular magnetic flux density is zero on the target 10 located at the position nearest to the film formation position 20a to 15 degrees or less.
摘要翻译： 本发明提供一种在金属基板上形成氧化物层的方法，与金属基板的最外层相比，能够制造具有改善的晶体取向的氧化物层。 通过RF磁控溅射在金属基板20上形成氧化物层的方法包括以下步骤：在最外层将表现出99％的c轴取向的晶体取向金属基板20进行RF磁控溅射，同时调节角度α 由位于金属基板20上的成膜位置20a处的垂直线和从成膜位置20a到位于最靠近膜形成位置的靶10上的垂直磁通密度为零的点 位置20a至15度或更小。
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公开(公告)号：US11999131B2
公开(公告)日：2024-06-04
申请号：US16977672
申请日：2019-03-12
申请人： TOYO KOHAN CO., LTD.
发明人： Yusuke Hashimoto
IPC分类号： B32B15/01 , B21B1/22 , B21D39/03 , B23K20/04 , B32B15/04 , B32B15/18 , B32B15/20 , C23C30/00 , C23F17/00 , C23G5/00
CPC分类号： B32B15/01 , B21B1/22 , B21D39/031 , B23K20/04 , B32B15/013 , B32B15/015 , B32B15/018 , B32B15/04 , B32B15/043 , B32B15/18 , B32B15/20 , C23C30/00 , C23C30/005 , C23F17/00 , C23G5/00 , Y10T428/12438 , Y10T428/12493 , Y10T428/12556 , Y10T428/12569 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722 , Y10T428/12729 , Y10T428/1275 , Y10T428/12757 , Y10T428/12806 , Y10T428/12819 , Y10T428/12826 , Y10T428/12847 , Y10T428/12854 , Y10T428/12861 , Y10T428/12868 , Y10T428/12875 , Y10T428/12882 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903 , Y10T428/1291 , Y10T428/12917 , Y10T428/12931 , Y10T428/12937 , Y10T428/12944 , Y10T428/2495 , Y10T428/24959 , Y10T428/24967 , Y10T428/26 , Y10T428/263 , Y10T428/264 , Y10T428/265
摘要： The present invention is intended to provide a roll-bonded laminate, in which an ultrathin metal layer is laminated on another metal without generation of wrinkles, cracks and the like. A roll-bonded laminate formed by lamination of at least three layers, which comprises a peelable carrier layer 10, an ultrathin metal layer 20 and a metallic foil 30, wherein the thickness of the ultrathin metal layer 20 is 0.5 μm or more and 20 μm or less.
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公开(公告)号：US10174420B2
公开(公告)日：2019-01-08
申请号：US14916363
申请日：2014-08-25
申请人： Toyo Kohan Co., Ltd.
发明人： Yusuke Hashimoto , Teppei Kurokawa , Takashi Koshiro , Hironao Okayama , Tatsuoki Nagaishi , Kotaro Ohki , Genki Honda
IPC分类号： C23C14/35 , C30B29/16 , C23C14/08 , C30B23/02 , H01L39/24 , C23C14/54 , C23C28/00 , C30B29/22
摘要： This invention provides a method for forming an oxide layer on a metal substrate, which enables manufacture of an oxide layer with improved crystal orientation in comparison with that of the outermost layer of a metal substrate. The method for forming an oxide layer on a metal substrate 20 via RF magnetron sputtering comprises a step of subjecting the crystal-oriented metal substrate 20 exhibiting a c-axis orientation of 99% on its outermost layer to RF magnetron sputtering while adjusting the angle α formed by a perpendicular at a film formation position 20a on the metal substrate 20 and a line from the film formation position 20a to a point 10a at which the perpendicular magnetic flux density is zero on the target 10 located at the position nearest to the film formation position 20a to 15 degrees or less.
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公开(公告)号：US12070923B2
公开(公告)日：2024-08-27
申请号：US17984371
申请日：2022-11-10
IPC分类号： B32B15/01 , B23K20/02 , B32B15/18 , B32B15/20 , C22F1/08 , C30B1/02 , C30B25/18 , C30B29/02 , H10N60/01
CPC分类号： B32B15/015 , B23K20/023 , B32B15/18 , B32B15/20 , C22F1/08 , C30B1/02 , C30B25/18 , C30B29/02 , H10N60/0576
摘要： It is an object to provide a substrate for epitaxial growth having a metal base material laminated with a copper layer. On a surface of the copper layer, an area occupied by crystal grains having crystal orientations other than a (200) plane present within 3 μm from the surface can be less than 1.5%. A surface roughness along a same direction as a rolling direction per unit length of 60 μm when measured by AFM can be Ra1
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公开(公告)号：US11878363B2
公开(公告)日：2024-01-23
申请号：US17043867
申请日：2019-04-01
申请人： TOYO KOHAN CO., LTD
IPC分类号： B23K20/00 , B23K20/04 , B21B1/22 , B23K103/10 , B32B15/01
CPC分类号： B23K20/04 , B21B1/22 , B21B2001/221 , B23K2103/10 , B32B15/015
摘要： It is an object of the present invention to provide a roll-bonded laminate controlled in warping and a method for producing the same. The method produces the roll-bonded laminate having a two-layer structure of a first metal layer and a second metal layer, by roll-bonding a first metal plate and a second metal plate, wherein the surface hardness Hv of the first metal plate is lower than the surface hardness Hv of the second metal plate; and the method comprises roll-bonding so as to satisfy the following expression (1):
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公开(公告)号：US11840045B2
公开(公告)日：2023-12-12
申请号：US16498167
申请日：2018-03-29
申请人： TOYO KOHAN CO., LTD
IPC分类号： B32B15/00 , B32B15/01 , B23K20/04 , B32B15/20 , C23F4/00 , B23K103/10 , B23K103/04
CPC分类号： B32B15/012 , B23K20/04 , B32B15/20 , C23F4/00 , B23K2103/05 , B23K2103/10
摘要： This invention provides a relatively thick roll-bonded laminate that exhibits a high Erichsen value and excellent molding workability. Such roll-bonded laminate is composed of a stainless steel layer and a non-stainless steel metal layer, and it is characterized in that thickness T is 0.2 mm to 3 mm and a correlation between a proportion PSUS of thickness TSUS of the stainless steel layer relative to thickness T and a half width FWHM200 of a peak exhibiting a crystal plane orientation (200) determined by X-ray diffraction analysis of the stainless steel layer side satisfies the correlation represented by the formula: FWHM200≤0.0057PSUS+0.4.
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