摘要:
A net detecting unit detects a set of component terminal interconnection information showing a critical net from a component terminal interconnection information list. A conductor detecting unit detects a conductor corresponding to the critical net. A component detecting unit detects two components from the set of component terminal interconnection information. A terminal detecting unit detects a power and/or ground terminal of each of the detected components. A power/ground layer detecting unit detects at least one layer, among power and ground layers, to which the detected power and/or ground terminals are connected. A layer detecting unit specifies a layer, among the detected layers, that is nearest to a signal layer on which the conductor is placed. A prohibition area generating unit generates a via prohibition area on the specified layer. As a result, vias are placed on the specified layer, avoiding the via prohibition area.
摘要:
A design aiding apparatus and a method, and a storage medium storing a design aiding program enable the efficient layout design of components in a multilayer wiring board formed by laminating a plurality of wiring layers. The design aiding apparatus includes (a) a first acquiring unit for acquiring information showing a first location in a lamination direction of the wiring layers, (b) a second acquiring unit for acquiring information showing a second location on a two-dimensional plane that is orthogonal to the lamination direction, and (c) a placement unit for generating information showing a space to be occupied when the component is placed in such a manner that a placement reference point of the component coincides with the second location that is on the two-dimensional plane including the first location. According to the above construction, the present invention is capable of aiding layout design of components in the wiring board.
摘要:
A signal line, being in a six-layer board and connecting terminal 102 of component 101 with terminal 115 of component 114, requires tamper-resistance. The signal line is composed of foil 103 on an outside layer, a via 104, foil 111 on the third layer, via 105, foil 112 on the fourth layer, via 106, and foil 113 on the sixth layer. Portions of the signal line that exist on outside layers are all hidden under circuit components. Foil 103 and an end of via 104 are placed under component 101 on first layer 116, an end of via 105 is placed under component 107 on layer 116, an end of via 106 is placed under component 108 on layer 116, the other end of via 104 is placed under component 109 on sixth layer 121, the other end of via 105 is placed under component 110 on layer 121, and foil 113 and the other end of via 106 are placed under component 114 on layer 121.
摘要:
A bidirectional transmission circuit for inputting/outputting a signal from/onto a bidirectional transmission line includes: a transceiver for transmitting/receiving a signal; a first element having an impedance; a second element being a short line; and a switching unit for coupling the transceiver to the bidirectional transmission line via the first element when the transceiver transmits a signal, and coupling the transceiver to the bidirectional transmission line via the second element when the transceiver receives a signal.
摘要:
According to the present invention, the setting height position of a first terminal is set to be lower than the setting height position of a second terminal on the terminal formation surface of a printed substrate, so that the protection of an internal circuit and the transmission of a high-speed signal can be both achieved.
摘要:
A method of evaluating noise immunity of a semiconductor device is provided. An actual circuit including the semiconductor device is represented by an equivalent circuit which has a target equivalent circuit, a noise source equivalent circuit, and an external equivalent circuit connected in parallel. The target equivalent circuit represents the semiconductor device. The noise source equivalent circuit represents a noise source outside the semiconductor device, and supplies noise to the target equivalent circuit. The external equivalent circuit represents a circuit outside the semiconductor device. The noise immunity is evaluated based on a voltage or current which arises in the target equivalent circuit by the noise. In this way, the immunity of the semiconductor device against extraneous noise can be evaluated in consideration of the effects of the circuitry outside the semiconductor device.
摘要:
According to the printed-circuit board of the preset invention, the circuit modification unit 120 adds a noise reduction component, based on circuit board information inputted to the design information input unit 106. Then, the layout unit 132 sets a layout after the design rule generation unit 133 generates a design rule. The rated value modification unit 124 determines rated values of noise reduction components in accordance with the layout. Thus, design rule generation, noise reduction component addition, and rated value determination are automatically performed to satisfy the electric characteristics of evaluation targets. Consequently, interactive process in designing is reduced and the efficiency of designing can be realized.
摘要:
A stacked device is disclosed which is easily manufactured while identifying a plurality of devices that are stacked in the stacked device. The stacked device includes a stack of a plurality of slave devices and a master device having identical terminal arrangements. Here, the master device includes command transmission unit configured to input an identification command to a terminal of an adjacent slave device. Furthermore, the slave device includes a through-wire for interconnecting at least one terminal of that same device and an adjacent slave device; command reception unit configured to receive the identification command; and ID (identifier) setting unit configured to set the ID of that same device based on the identification command; the positions of the terminals that are interconnected with the adjacent slave devices differing in each slave device, so that, in each slave device, the slave device command reception unit receive an identification command having a modified value as a result of transiting through-wires that are connected at differing positions in each slave device.
摘要:
A semiconductor device is disclosed in which resistance to the influence of external noise on internal power source network is improved. A semiconductor device operating at any predetermined frequency among a plurality thereof, and having power source networks for supplying power from a power source to internal functional units in the semiconductor device comprises switches, a storage unit, and a control unit. The switches are provided in the power source networks, and switch ON/OFF the supply of power from the power source to the functional units. In the storage unit are mapped and stored a plurality of predetermined operating frequencies and switching information designating an ON state or an OFF state for the switches. The control unit reads, from the storage, switching information corresponding to a current operating frequency, and controls the ON/OFF switching of the switches in accordance with the read switching information.
摘要:
A connection member is provided which can be produced without a via-forming step. The connection member 100 includes an insulating substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10b and a side surface 10c which connects these surfaces; at least one wiring 20 which extends from the upper surface to the lower surface through the side surface.