公开(公告)号：US06838170B2

公开(公告)日：2005-01-04

申请号：US10351430

申请日：2003-01-27

申请人： Yuko Tanaka ,  Yasushi Shimada ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Keiji Sumiya

发明人： Yuko Tanaka ,  Yasushi Shimada ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Keiji Sumiya

IPC分类号： C08G59/34 ,  C08G59/68 ,  C08K5/00 ,  C08L63/00 ,  C09J7/02 ,  C09J133/00 ,  C09J133/06 ,  C09J163/00 ,  H01L21/52 ,  H01L21/58 ,  H01L23/14 ,  H05K3/32 ,  H05K3/34 ,  B32B27/38

CPC分类号： H01L24/83 ,  C08G59/027 ,  C08G59/686 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/04 ,  C08L2666/22 ,  C09J7/22 ,  C09J7/26 ,  C09J7/35 ,  C09J133/068 ,  C09J163/00 ,  C09J2203/326 ,  C09J2427/006 ,  C09J2433/00 ,  C09J2463/00 ,  C09J2477/006 ,  C09J2479/086 ,  C09J2481/006 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/50 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83855 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  Y10S428/901 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/0532 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/29298 ,  H01L2924/00012 ,  H01L2224/05599

摘要： An adhesive which comprises (1) 100 parts by weight of an epoxy resin and a hardener therefor, (2) 75 to 300 parts by weight of an epoxidized acrylic copolymer having a glycidyl (meth)acrylate unit content of 0.5 to 6 wt. %, a glass transition temperature of −10° C. or higher and a weight average molecular weight of 100,000 or more and (3) 0.1 to 20 parts by weight of a latent curing accelerator; an adhesive member having a layer of the adhesive; an interconnecting substrate for semiconductor mounting having the adhesive member; and a semiconductor device containing the same.

摘要翻译： 一种粘合剂，其包含（1）100重量份的环氧树脂及其硬化剂，（2）75〜300重量份具有0.5〜6重量％的（甲基）丙烯酸缩水甘油酯单元含量的环氧化丙烯酸共聚物。 ％，玻璃化转变温度为-10℃以上，重均分子量为100,000以上，（3）为0.1〜20重量份的潜伏性固化促进剂; 具有粘合剂层的粘合构件; 用于半导体安装的互连衬底，具有所述粘合构件; 以及包含该半导体器件的半导体器件。

公开(公告)号：US06673441B1

公开(公告)日：2004-01-06

申请号：US09979979

申请日：2001-11-29

申请人： Yuko Tanaka ,  Yasushi Shimada ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Keiji Sumiya

发明人： Yuko Tanaka ,  Yasushi Shimada ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Keiji Sumiya

IPC分类号： B32B2738

CPC分类号： H01L24/83 ,  C08G59/027 ,  C08G59/686 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/04 ,  C08L2666/22 ,  C09J7/22 ,  C09J7/26 ,  C09J7/35 ,  C09J133/068 ,  C09J163/00 ,  C09J2203/326 ,  C09J2427/006 ,  C09J2433/00 ,  C09J2463/00 ,  C09J2477/006 ,  C09J2479/086 ,  C09J2481/006 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/50 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83855 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  Y10S428/901 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/0532 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/29298 ,  H01L2924/00012 ,  H01L2224/05599

摘要： An adhesive which comprises (1) 100 parts by weight of an epoxy resin and a hardener therefor, (2) 75 to 300 parts by weight of an epoxidized acrylic copolymer having a glycidyl (meth)acrylate unit content of 0.5 to 6 wt. %, a glass transition temperature of −10° C. or higher and a weight average molecular weight of 100,000 or more and (3) 0.1 to 20 parts by weight of a latent curing accelerator; an adhesive member having a layer of the adhesive; an interconnecting substrate for semiconductor mounting having the adhesive member; and a semiconductor device containing the same.

摘要翻译： 一种粘合剂，其包含（1）100重量份的环氧树脂及其硬化剂，（2）75〜300重量份具有0.5〜6重量％的（甲基）丙烯酸缩水甘油酯单元含量的环氧化丙烯酸共聚物。 ％，玻璃化转变温度为-10℃以上，重均分子量为100,000以上，（3）为0.1〜20重量份的潜伏性固化促进剂; 具有粘合剂层的粘合构件; 用于半导体安装的互连衬底，具有所述粘合构件; 以及包含该半导体器件的半导体器件。

公开(公告)号：US06265782B1

公开(公告)日：2001-07-24

申请号：US09284131

申请日：1999-08-30

申请人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

发明人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

IPC分类号： H01L2348

CPC分类号： H01L23/49827 ,  C09J163/00 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/15159 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

摘要翻译： 本发明旨在提高半导体器件中的封装后的耐温循环性，并且提高吸湿回流焊性，并提供在25℃下的储能弹性模量为10〜2000MPa的粘合剂和 使用动态粘弹性光谱仪测量的260℃下的储存弹性模量为3至50MPa，以及使用粘合剂的双面粘合膜，半导体器件和半导体芯片安装基板，以及它们的生产 处理。

公开(公告)号：US6090468A

公开(公告)日：2000-07-18

申请号：US925440

申请日：1997-09-09

申请人： Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Kazunori Yamamoto

发明人： Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Kazunori Yamamoto

IPC分类号： H01L21/48 ,  H01L23/13 ,  H01L23/498 ,  H05K1/00 ,  H05K1/18 ,  H05K3/38 ,  H05K3/46 ,  H05K1/02 ,  C09J4/00

CPC分类号： H05K3/4626 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/183 ,  H05K2201/0133 ,  H05K3/386 ,  H05K3/4697 ,  Y10S428/901 ,  Y10T156/1093 ,  Y10T29/49117 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/24942

摘要： A multilayer wiring board for mounting a semiconductor device, which has a multi-bonding-deck cavity, comprises at least two wiring boards and an insulation adhesive layer having an elastic modulus of 1,400 MPa or lower having a coefficient of thermal expansion of 450 ppm/.degree. C. or lower in a direction of thickness and being a cured product of an adhesive film which is a semi-cured product of an adhesive composition comprising (a) 71 to 100 parts by weight of an epoxy group-containing acrylic rubber having a glass transition point of -10.degree. C. or above and a weight average molecular weight of 100,000 or above, (b) 50 to 70 parts by weight of an epoxy resin having a weight average molecular. weight of less than 10,000 and a curing agent, (c) 10 to 60 parts by weight of a high-molecular weight resin being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above and (d) 0.1 to 5 parts by weight of a cure accelerator.

摘要翻译： 一种用于安装具有多粘接层空腔的半导体器件的多层布线板，包括至少两个布线板和具有1400ppm或更低的弹性模量为1400ppm或更低的绝缘粘合剂层， ℃或更低的厚度方向，并且是作为粘合剂组合物的半固化产物的粘合剂膜的固化产物，所述粘合剂组合物包含（a）71至100重量份的含环氧基的丙烯酸橡胶，其具有 玻璃化转变点为-10℃以上，重均分子量为100,000以上，（b）50〜70重量份具有重均分子量的环氧树脂。 重量小于10,000的固化剂和（c）10至60重量份与环氧树脂相容的高分子量树脂，其重均分子量为30,000或以上，（d）为0.1至5 重量份的固化促进剂。

公开(公告)号：US06621170B2

公开(公告)日：2003-09-16

申请号：US09842441

申请日：2001-04-26

申请人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

发明人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

IPC分类号： H01L2348

CPC分类号： H01L23/49827 ,  C09J163/00 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/15159 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

摘要翻译： 本发明旨在提高半导体器件中的封装后的耐温循环性，并且提高吸湿回流焊性，并提供在25℃下的储能弹性模量为10〜2000MPa的粘合剂和 使用动态粘弹性光谱仪测量的260℃下的储存弹性模量为3至50MPa，以及使用粘合剂的双面粘合膜，半导体器件和半导体芯片安装基板，以及它们的生产 处理。

公开(公告)号：US5965269A

公开(公告)日：1999-10-12

申请号：US930512

申请日：1997-10-03

申请人： Teiichi Inada ,  Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro

发明人： Teiichi Inada ,  Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro

IPC分类号： B32B7/12 ,  B32B15/08 ,  C09J163/00 ,  H05K3/38 ,  B32B27/38

CPC分类号： B32B15/08 ,  B32B7/12 ,  C09J163/00 ,  H05K3/386 ,  Y10S525/93 ,  Y10T428/31511 ,  Y10T428/31529

摘要： An adhesive comprising (1) 100 parts by weight of a combination of an epoxy resin having a weight average molecular weight of less than 5,000 and a curing agent, (2) 10 to 40 parts by weight of a high-molecular weight component being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above, (3) 20 to 100 parts by weight of a high-molecular weight component being incompatible with the epoxy resin and having a weight average molecular weight of 30,000 or above, and (4) 0.1 to 5 parts by weight of a cure accelerator. The adhesive is excellent not only in moisture resistance, heat resistance, adhesive strength at high temperature, heat dissipation, reliability of insulation, crack resistance and flexibility but also in circuit filling and tight adhesion, and exhibits suitable flow properties.

摘要翻译： PCT No.PCT / JP96 / 00798 Sec。 371日期1997年10月3日第 102（e）日期1997年10月3日PCT 1996年3月27日PCT公布。 出版物WO96 / 31574 日期：1996年10月10日粘合剂包含（1）100重量份的重均分子量小于5,000的环氧树脂和固化剂的组合，（2）10至40重量份的高分子量聚合物， 分子量成分与环氧树脂相容，重均分子量为30,000以上，（3）20〜100重量份与环氧树脂不相容的高分子量成分，重均分子量 30,000以上，（4）0.1〜5重量份的固化促进剂。 粘合剂不仅在耐湿性，耐热性，高温粘合强度，散热性，绝缘可靠性，抗裂性和柔韧性以及电路填充和紧密粘合方面都是优异的，并且表现出合适的流动性能。

公开(公告)号：US06184577B2

公开(公告)日：2001-02-06

申请号：US09308525

申请日：1999-08-30

申请人： Kenzo Takemura ,  Itsuo Watanabe ,  Akira Nagai ,  Osamu Watanabe ,  Kazuyoshi Kojima ,  Akishi Nakaso ,  Kazunori Yamamoto ,  Yoshiyuki Tsuru ,  Teiichi Inada ,  Yasushi Shimada

发明人： Kenzo Takemura ,  Itsuo Watanabe ,  Akira Nagai ,  Osamu Watanabe ,  Kazuyoshi Kojima ,  Akishi Nakaso ,  Kazunori Yamamoto ,  Yoshiyuki Tsuru ,  Teiichi Inada ,  Yasushi Shimada

IPC分类号： H01L2363

CPC分类号： H05K1/0271 ,  H01L21/563 ,  H01L23/145 ,  H01L23/5383 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83851 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/07811 ,  H01L2924/1301 ,  H01L2924/13034 ,  H05K3/323 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0133 ,  H05K2201/068 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00014

摘要： In regard to a packaging substrate on which a semiconductor chip is mounted, the surface copper foil of a double-sided copper-clad glass epoxy resin laminated sheet is subjected to circuit formation and inner-layer bonding, then an epoxy resin adhesive film with copper foil is bonded to the surface of the inner-layer circuit by press lamination, and a through hole is formed through the sheet, followed by electroless copper plating, outer-layer circuit formation by the subtractive process, and solder coating to obtain the packaging substrate. The bump electrode of the semiconductor chip and the packaging substrate are connected through an adhesive film.

摘要翻译： 对于其上安装有半导体芯片的封装基板，双面覆铜玻璃环氧树脂层压片的表面铜箔进行电路形成和内层结合，然后将具有铜的环氧树脂粘合膜 箔通过压力叠层结合到内层电路的表面，并且通过片形成通孔，接着进行无电镀铜，通过减法处理形成外层电路，并获得焊料涂层以获得封装基板 。 半导体芯片的凸起电极和封装基板通过粘合膜连接。

公开(公告)号：US08119737B2

公开(公告)日：2012-02-21

申请号：US13084773

申请日：2011-04-12

申请人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

发明人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

IPC分类号： C08L33/14 ,  C08L63/02 ,  C08L63/04 ,  H05K1/03 ,  H05K3/46

CPC分类号： H01L23/14 ,  C08G59/18 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3737 ,  H01L23/564 ,  H01L2224/50 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0271 ,  Y10T156/1089 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/31511

摘要： Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor.

摘要翻译： 公开了一种粘合剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）与所述环氧树脂不相容的高分子化合物，并且还可任选地包括（d）填料和/或（e）固化 加速器。 还公开了一种制备粘合剂组合物的方法，包括将（a）环氧树脂和（b）固化剂与（d）填料混合，然后将所得混合物与（c）与环氧树脂不相容的高分子化合物混合 树脂; 包括形成为膜的上述粘合剂组合物的粘合膜; 用于安装包括布线板的半导体的基板和设置在其上的上述粘合膜在其上将要安装芯片的一侧; 以及包括上述粘合膜或用于安装半导体的基板的半导体器件。

公开(公告)号：US20060106166A1

公开(公告)日：2006-05-18

申请号：US11319069

申请日：2005-12-28

申请人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka

发明人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka

IPC分类号： C08L63/00 ,  B32B27/38

CPC分类号： H01L23/14 ,  C08G59/18 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3737 ,  H01L23/564 ,  H01L2224/50 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0271 ,  Y10T156/1089 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/31511

摘要： The present invention provides an adhesive composition which comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator; a process for producing an adhesive composition, comprising: mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film comprising the above-mentioned adhesive composition formed into a film; a substrate for mounting semiconductor comprising a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which comprises the above-mentioned adhesive film or the substrate for mounting semiconductor.

公开(公告)号：US20070036971A1

公开(公告)日：2007-02-15

申请号：US11476725

申请日：2006-06-29

申请人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

发明人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

IPC分类号： B32B27/38 ,  C09J163/00 ,  C08L63/00 ,  C09J7/02

CPC分类号： H01L23/14 ,  C08G59/18 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3737 ,  H01L23/564 ,  H01L2224/50 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0271 ,  Y10T156/1089 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/31511

摘要： The present invention provides an adhesive composition which comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator; a process for producing an adhesive composition, comprising: mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film comprising the above-mentioned adhesive composition formed into a film; a substrate for mounting semiconductor comprising a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which comprises the above-mentioned adhesive film or the substrate for mounting semiconductor.

摘要翻译： 本发明提供了一种粘合剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）与所述环氧树脂不相容的高分子化合物，并且还任选地包含（d）填料和/或（e） 固化促进剂; 一种制备粘合剂组合物的方法，包括：（a）环氧树脂和（b）固化剂与（d）填料混合，然后将所得混合物与（c）与环氧树脂不相容的高分子化合物混合; 包含形成为膜的上述粘合剂组合物的粘合膜; 一种用于安装半导体的基板，包括布线板和其上安装有芯片的侧面上的粘合膜; 以及包括上述粘合膜或用于安装半导体的基板的半导体器件。