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公开(公告)号：US4889275A
公开(公告)日：1989-12-26
申请号：US266470
申请日：1988-11-02
CPC分类号： G02B6/4442 , B23K1/20 , G02B6/4471 , H01L41/29 , H01R43/0221 , H05K3/3457 , H05K3/363 , B23K2201/36 , B23K2201/40 , H05K2201/09709 , H05K2201/10666 , H05K2203/0278 , H05K2203/043 , H05K2203/107 , H05K3/3494
摘要： A method for effecting high density solder interconnects between a substrate and at least one metalized film having through holes therein is provided. Solder is first applied to metalized portions of the substrates and the solder is then subject to a reflow process to provide reflowed solder. Pressure is applied to the reflowed solder during a second reflow process to provide prestressed or shaped solder. The metalized film is then positioned with at least one metalized portion adjacent to the shaped solder. Heat, as from a laser, is directed through the through holes in the film to melt the solder and form solder interconnections between the substrate and the metalized film.
摘要翻译： 提供了一种用于在衬底和其中具有通孔的至少一个金属化膜之间实现高密度焊料互连的方法。 首先将焊料应用于基板的金属化部分，然后对焊料进行回流工艺以提供回流焊料。 在第二回流过程中，对回流焊料施加压力以提供预应力或成形焊料。 金属化膜然后与邻近成形焊料的至少一个金属化部分定位。 来自激光器的热被引导通过膜中的通孔以熔化焊料并在基底和金属化膜之间形成焊料互连。
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2.发明授权Apparatus for selectively applying solder paste to multiple types of printed circuit boards 失效用于选择性地将焊膏施加到多种类型的印刷电路板的装置
公开(公告)号：US5452656A
公开(公告)日：1995-09-26
申请号：US238284
申请日：1994-05-05
CPC分类号： B41F15/0818 , H05K3/1216 , Y10S101/30 , Y10S209/939
摘要： According to the present invention, a screen printer (200) selectively applies solder paste to multiple types of printed circuit boards. The screen printer (200) includes mobile placement equipment (210), which receives and transports the boards, and application equipment, which includes first and second stencils (225), frames for holding the stencils (225) in fixed positions, and an applicator (415) for applying solder paste to a board through either the first or second stencil (225). A controller (215) determines the type of a board received by the mobile placement equipment (210), then, when the board is of a first type, directs the mobile placement equipment (210) to a location aligned with the first stencil. When the board is of a second type, the mobile placement equipment (210) is directed to a location aligned with the second stencil.
摘要翻译： 根据本发明，丝网印刷机（200）选择性地将焊膏施加到多种类型的印刷电路板上。 丝网印刷机（200）包括移动放置设备（210），其接收和运输板，以及包括第一和第二模板（225）的应用设备，用于将模板（225）保持在固定位置的框架和施加器 （415），用于通过所述第一或第二模版（225）将焊膏施加到板。 控制器（215）确定由移动放置设备（210）接收的板的类型，然后当板是第一类型时，将移动放置设备（210）引导到与第一模板对准的位置。 当电路板是第二类型时，移动放置设备（210）被引导到与第二模板对准的位置。
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公开(公告)号：US5164022A
公开(公告)日：1992-11-17
申请号：US656385
申请日：1991-02-19
CPC分类号： B23K3/082 , H05K3/3489
摘要： In an apparatus for depositing flux onto a solder work surface, a chamber having a plurality of openings therein is heated by means of a U-shaped current conducting heating element within which the flux chamber resides. This heating element heats the flux within the chamber until it vaporizes and is forced from the chamber through the openings onto the solder work surface.
摘要翻译： 在用于将焊剂沉积到焊料工作表面上的设备中，其中具有多个开口的室通过其中助焊剂室所在的U形导电加热元件加热。 该加热元件加热室内的通量，直到其蒸发并且被迫从腔室通过开口到焊接工作表面上。
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公开(公告)号：US5336931A
公开(公告)日：1994-08-09
申请号：US115971
申请日：1993-09-03
CPC分类号： H01L23/3121 , H01L23/24 , H01L24/97 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/01013 , H01L2924/01027 , H01L2924/01038 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/18301
摘要： A flow formed encapsulated integrated circuit package (100) includes a printed circuit substrate (160) having upper and lower opposed surfaces and one or more anchor holes (150). The one or more anchor holes (150) have an upper aperture in the upper surface and a lower aperture in the lower surface. One or more integrated circuit die (130) are electrically and mechanically attached to the upper surface of the substrate (160). In addition, a solder resist mask (190) is attached to the lower surface of the substrate which covers the aperture of the one or more anchor holes (150). Flow formed material (110) is formed around the integrated circuit die (130) so as to encapsulate the one or more integrated circuits (150), the flow formed material (110) covering at a least a portion of the upper surface of the printed circuit substrate (160) and extending substantially into the anchor hole (150).
摘要翻译： 流形成的封装集成电路封装（100）包括具有上下相对表面和一个或多个锚定孔（150）的印刷电路基板（160）。 一个或多个锚定孔（150）在上表面具有上孔，在下表面具有下孔。 一个或多个集成电路管芯（130）电和机械地附接到衬底（160）的上表面。 此外，阻焊掩模（190）附着到覆盖一个或多个锚定孔（150）的孔的基板的下表面。 形成流体的材料（110）围绕集成电路管芯（130）形成，以封装一个或多个集成电路（150），流动形成的材料（110）覆盖在印刷的上表面的至少一部分 电路基板（160）并且基本上延伸到锚定孔（150）中。
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公开(公告)号：US5716760A
公开(公告)日：1998-02-10
申请号：US810272
申请日：1997-03-03
CPC分类号： H05K3/243 , H05K3/3452 , H05K2201/2081 , H05K2203/0315 , H05K3/184
摘要： A novel process for plating a substrate without solder mask wherein the substrate is coated with a polymer catalyst to assist adhesion of conductive metal to the substrate. Next, a first plating mask photopolymer, or plating resist, is coated over the polymer catalyst, a circuit pattern is imaged onto the first plating mask and the first plating mask is developed to reveal windows, or circuit traces, in the first plating mask corresponding to the circuit pattern to be embodied on the substrate. Thereafter, a first conductive material such as copper is plated into the windows, and, thereafter, a second conductive material such as nickel may be plated into the windows on top of the first conductive material. Then, the first plating mask is removed from the substrate, leaving behind the conductive material in the form of the desired circuit pattern. Next, a second plating mask photopolymer is formed over the substrate and conductive materials, and an I/O interconnect mask corresponding to the I/O interconnect pads is photo-optically imaged onto the second plating mask and the second plating mask is developed to remove portions thereof, creating "interconnect voids," corresponding to the interconnect pads. Thereafter, a third conductive material such as gold is plated into the interconnect voids to create conductive I/O pads.
摘要翻译： 一种用于电镀不具有阻焊掩模的衬底的新方法，其中衬底涂覆有聚合物催化剂以辅助将导电金属粘附到衬底上。 接下来，将第一电镀掩模光聚合物或电镀抗蚀剂涂覆在聚合物催化剂上，将电路图案成像到第一电镀掩模上，并且将第一电镀掩模显影以在第一电镀掩模中显示相应的窗口或电路迹线 涉及要在基板上体现的电路图案。 此后，将诸如铜的第一导电材料电镀到窗口中，此后可以将第二导电材料如镍电镀在第一导电材料顶部的窗口中。 然后，从基板去除第一电镀掩模，以期望的电路图案的形式留下导电材料。 接下来，在基板上形成第二电镀掩模光聚合物和导电材料，并且对应于I / O互连焊盘的I / O互连掩模被光学成像到第二电镀掩模上，并且第二电镀掩模被显影以除去 其部分，产生对应于互连焊盘的“互连空隙”。 此后，将诸如金的第三导电材料电镀到互连空隙中以产生导电I / O焊盘。
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6.发明授权
公开(公告)号：US5001038A
公开(公告)日：1991-03-19
申请号：US121326
申请日：1987-11-16
申请人： Dale W. Dorinski , M. William Branan, Jr. , Glenn F. Urbish , Anthony B. Suppelsa , Martin J. McKinley , Douglas W. Hendricks
发明人： Dale W. Dorinski , M. William Branan, Jr. , Glenn F. Urbish , Anthony B. Suppelsa , Martin J. McKinley , Douglas W. Hendricks
CPC分类号： G03F7/70283 , G03F7/20 , G03F7/2022 , G03F7/70333 , G03F7/70466 , H05K3/0082 , H05K1/0284 , H05K2203/056 , H05K3/0002
摘要： Printed circuit patterns are photolithographically defined on a three dimensional "projection" surface (204) of a printed circuit substrate (202) using a projection image aligner and a photomask (210) having a planar image (210A). The geometry of the projection is restricted such that the slope of the projection surface, as measured at any point on the projection surface and relative to a reference plane which is parallel to the focal plane of the projection image aligner, is less than 90 degrees. A solution of photoresist includes a photoresist solvent, a fluorosurfactant and an aromatic hydrocarbon solvent, and is preferably sprayed over the projection surface. In one method of manufacture, the printed circuit substrate is moved from one position to another during the exposure of the photoresist layer (206). In another method, after a first portion of the projection surface is exposed by a first photomask (502), a second photomask (504) is substituted and the remainder of the projection surface exposed. In still another method, a photomask having a plurality of planar images (604A, 604B and 606A) each image being positioned parallel to the others but separated by a small distance, is used to simultaneously exposed the entire projection surface.
摘要翻译： 使用投影图像对准器和具有平面图像（210A）的光掩模（210）将印刷电路图案光刻地限定在印刷电路基板（202）的三维“投影”表面（204）上。 突起的几何形状受到限制，使得投影表面的倾斜度（在投影表面上的任何点上相对于平行于投影图像对准器的焦平面的参考平面）测得的小于90度。 光致抗蚀剂溶液包括光致抗蚀剂溶剂，含氟表面活性剂和芳族烃溶剂，并且优选地喷射在投影表面上。 在一种制造方法中，在光致抗蚀剂层（206）的曝光期间，印刷电路基板从一个位置移动到另一个位置。 在另一种方法中，在投影表面的第一部分被第一光掩模（502）暴露之后，替换第二光掩模（504），并且突出表面的其余部分被暴露。 在另一种方法中，使用具有多个平面图像（604A，604B和606A）的光掩模，每个图像平行于另一个平行而被分开一小段距离，以同时曝光整个投影表面。
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7.发明授权
公开(公告)号：US5679498A
公开(公告)日：1997-10-21
申请号：US540873
申请日：1995-10-11
CPC分类号： H01L21/4857 , G03F7/0035 , H05K3/184 , H05K3/4661 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15312 , H01L2924/1532 , H01L2924/3025 , H05K2203/1407 , H05K3/0023
摘要： A method of producing multi-layered chip carriers by coating the surface of a base layer with a photosensitive dielectric material which forms a dielectric layer; curing at least a portion of the dielectric layer by exposure to radiation; depositing a catalyst on the cured portion of the dielectric layer to form a sensitized dielectric layer; applying a photoresist layer upon the sensitized dielectric layer; curing at least a portion of the photoresist layer; developing the cured photoresist layer by removing uncured portions, thereby exposing corresponding portions of the underlying sensitized dielectric layer; forming conductors on the exposed dielectric layer; stripping the cured photoresist layer: coating a layer of photosensitive dielectric material upon the cured dielectric layer; and repeating the steps to produce successive layers which form a multi-layer chip carrier having a plurality of conductor layers separated by layers of insulating dielectric material.
摘要翻译： 一种通过用形成电介质层的感光介电材料涂覆基层的表面来生产多层芯片载体的方法; 通过暴露于辐射来固化介电层的至少一部分; 在所述电介质层的固化部分上沉积催化剂以形成致敏介电层; 在致敏介电层上施加光致抗蚀剂层; 固化光致抗蚀剂层的至少一部分; 通过去除未固化部分来显影固化的光致抗蚀剂层，从而暴露下面的敏化介电层的相应部分; 在暴露的电介质层上形成导体; 剥离固化的光致抗蚀剂层：在固化的介电层上涂覆感光介电材料层; 并且重复以下步骤以产生连续的层，其形成具有由绝缘介电材料层隔开的多个导体层的多层芯片载体。
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公开(公告)号：US5598967A
公开(公告)日：1997-02-04
申请号：US418132
申请日：1995-04-04
CPC分类号： B23K1/0016 , H05K1/111 , H05K3/3442 , H05K3/368 , B23K2201/38 , H05K1/141 , H05K2201/09381 , H05K2201/09663 , H05K2201/10727 , H05K2203/1178 , Y02P70/611 , Y02P70/613
摘要： A method of interconnecting circuit modules (30) to mother boards (50) each having a plurality of mating solder pads (32, 52) is available. The solder pads (32, 52) have respective pairs of arms (40, 42) and (54, 56) with a venting channel (36, 58) formed between each pair of arms to vent solder medium when the solder pads are reflowed to interconnect the circuit modules and mother boards.
摘要翻译： 将电路模块（30）互连到各自具有多个配合焊盘（32,52）的母板（50）的方法是可用的。 焊盘（32,52）具有相应的成对的臂（40,42）和（54,56），其中在每对臂之间形成有通气通道（36,58），以在焊料回流到 互连电路模块和母板。
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公开(公告)号：US5439162A
公开(公告)日：1995-08-08
申请号：US82568
申请日：1993-06-28
CPC分类号： H01L24/12 , H01L24/11 , H01L24/81 , H05K3/3436 , H01L2224/11003 , H01L2224/11822 , H01L2224/13099 , H01L2224/13111 , H01L2224/1357 , H01L2224/136 , H01L2224/16 , H01L2224/81801 , H01L2924/00013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H05K2201/035 , H05K2201/10734 , H05K2201/10984 , H05K2203/0278 , H05K2203/0338 , H05K2203/043 , H05K2203/0485 , H05K3/3484 , H05K3/3489 , Y02P70/613
摘要： An integrated circuit (70) is soldered to a printed circuit board (200) by first depositing flux (116) on bumps (75) of the integrated circuit. Solder (214) is deposited upon the bumps (75), and the integrated circuits is (70) placed in contact with pads (210) on the printed circuit board (200). After reflow, a solder joint (230) electrically and mechanically attaches the integrated circuit (70) to the printed circuit board (200).Alternatively, the solder tipped (214) bumps (75) may be placed in contact with a non-adhering flat plane (300) such as glass during the heating process. After reflow, each bump has a flat portion (350), and the flat portions of all the bumps form a plane (400) which further facilitates attaching the integrated circuit (70) to the printed circuit board (200).
摘要翻译： 通过首先在集成电路的凸块（75）上沉积焊剂（116）将集成电路（70）焊接到印刷电路板（200）。 焊料（214）沉积在凸块（75）上，并且集成电路（70）放置成与印刷电路板（200）上的焊盘（210）接触。 在回流之后，焊接接头（230）将集成电路（70）电气和机械地连接到印刷电路板（200）。 或者，在加热过程中，焊料尖端（214）凸块（75）可以与非粘附平面（300）如玻璃接触放置。 在回流之后，每个凸块具有平坦部分（350），并且所有凸块的平坦部分形成平面（400），这进一步有助于将集成电路（70）连接到印刷电路板（200）。
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10.发明授权Method and apparatus for selectively applying solder paste to multiple types of printed circuit boards 失效用于选择性地将焊膏施加到多种类型的印刷电路板的方法和装置
公开(公告)号：US5436028A
公开(公告)日：1995-07-25
申请号：US918741
申请日：1992-07-27
CPC分类号： B41F15/0818 , H05K3/1216 , Y10S101/30 , Y10S209/939
摘要： A single screen printer (200) holds at least two solder stencils (225). The screen printer (200) receives a printed circuit board (105) and determines a printed circuit board configuration. When the printed circuit board (105) is of a first configuration, the printed circuit board (105) is aligned with a first stencil (225) and solder paste is selectively applied to the printed circuit board (105) through the first stencil (225). When the printed circuit board (105) is of a second configuration, the printed circuit board is aligned with a second stencil (225) through which solder paste is selectively applied to the printed circuit board (105).
摘要翻译： 单个丝网印刷机（200）容纳至少两个焊锡模板（225）。 丝网印刷机（200）接收印刷电路板（105）并确定印刷电路板的结构。 当印刷电路板（105）具有第一种结构时，印刷电路板（105）与第一模板（225）对准，并且焊膏通过第一模板（225）选择性地施加到印刷电路板（105） ）。 当印刷电路板（105）具有第二配置时，印刷电路板与第二模板（225）对准，焊膏通过该第二模板选择性地施加到印刷电路板（105）。
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