Packaging silicon on silicon multichip modules
    2.
    发明授权
    Packaging silicon on silicon multichip modules 失效
    包装硅多芯片模块

    公开(公告)号:US06369444B1

    公开(公告)日:2002-04-09

    申请号:US09081448

    申请日:1998-05-19

    IPC分类号: H01L2334

    摘要: The specification describes interconnection assemblies for silicon-on-silicon multichip modules. The silicon-on-silicon MCMs are mounted on epoxy/glass laminates which have a coefficient of thermal expansion (CTE) that essentially matches the CTE of silicon. In the preferred embodiment the assembly is a PC card with card edge connectors, i.e. without fixed solder interlevel interconnections, so that the CTE of the epoxy laminate comprising the card can be modified without regard to potential mismatch with a mother board.

    摘要翻译: 该规范描述了硅上硅多芯片模块的互连组件。 硅上硅MCM安装在具有基本上与硅的CTE匹配的热膨胀系数(CTE)的环氧树脂/玻璃层压板上。 在优选实施例中,组件是具有卡边缘连接器的PC卡,即没有固定的焊料层间互连,使得可以修改包含卡的环氧树脂层压体的CTE,而不考虑与母板的潜在不匹配。

    Manufacture of printed circuit cards
    7.
    发明授权
    Manufacture of printed circuit cards 失效
    印刷电路卡的制造

    公开(公告)号:US06370766B1

    公开(公告)日:2002-04-16

    申请号:US08807266

    申请日:1997-02-28

    IPC分类号: H05K330

    摘要: The specification describes methods for the manufacture of printed circuit cards which allow for final testing, including burn-in if required, of multiples of printed circuit cards as an integrated process panel prior to final packaging and singulation. This desired sequence of operations is made possible by the addition of arrays of test contacts at the edge of the integrated process panel where the test contacts can be accessed with an insertion test apparatus.

    摘要翻译: 本说明书描述了用于制造印刷电路卡的方法,其允许最终测试,包括如果需要,在最终包装和分割之前作为集成处理面板的多个印刷电路卡进行最终测试。 通过在集成处理面板的边缘添加测试触点的阵列,可以使用插入测试装置访问测试触点,从而可以实现所需的操作顺序。

    Interconnecting micromechanical devices
    9.
    发明授权
    Interconnecting micromechanical devices 有权
    互连微机械设备

    公开(公告)号:US06396711B1

    公开(公告)日:2002-05-28

    申请号:US09588336

    申请日:2000-06-06

    IPC分类号: H05K702

    摘要: The specification describes interconnection strategies for micro-electronic machined mechanical systems (MEMS). Typical MEMS device array comprise a large number of individual mechanical devices each electrically driven by multi-chip modules (MCMs). High density interconnection is achieved by mounting the MCMs mounted on both sides of a system interconnection substrate. Overall interconnection length is reduced by locating the MCMs in a common circuit driving a given mechanical element on opposite sides of the system interconnection substrate and interconnecting them using vias through the substrate. Rapid replacement/repair is facilitated by mounted all active elements in sockets using contact pin arrays for electrical connections. In service reliability is obtained by providing spare sockets for redundant MCMs.

    摘要翻译: 该规范描述了微电子加工机械系统(MEMS)的互连策略。 典型的MEMS器件阵列包括大量由多芯片模块(MCM)电驱动的各个机械装置。 通过安装安装在系统互连基板两侧的MCM来实现高密度互连。 通过将MCM定位在驱动系统互连基板的相对侧上的给定机械元件的公共电路中并且使用通孔穿过基板将它们互连来减小总互连长度。 通过将所有有源元件安装在插座中,使用接触针阵列进行电气连接,便于快速更换/维修。 通过为冗余MCM提供备用插座来获得服务可靠性。