摘要:
A semiconductor device, a semiconductor package, and an electronic device are provided. The electronic device includes a first semiconductor package disposed on a circuit substrate. A second semiconductor package is provided on the circuit substrate and spaced apart from the first semiconductor package. An insulating electromagnetic shielding structure is provided on the top and the lateral surfaces of the first semiconductor package. A conductive electromagnetic shielding structure is provided on the circuit substrate to cover the first and second semiconductor packages and the insulating electromagnetic shielding structure.
摘要:
A semiconductor device, a semiconductor package, and an electronic device are provided. The electronic device includes a first semiconductor package disposed on a circuit substrate. A second semiconductor package is provided on the circuit substrate and spaced apart from the first semiconductor package. An insulating electromagnetic shielding structure is provided on the top and the lateral surfaces of the first semiconductor package. A conductive electromagnetic shielding structure is provided on the circuit substrate to cover the first and second semiconductor packages and the insulating electromagnetic shielding structure.
摘要:
A semiconductor package having improved EMI and crosstalk characteristics is provided. The semiconductor package includes a semiconductor package including a substrate, at least one first semiconductor chip formed on a top surface of the substrate and electrically connected to the substrate, and at least one second semiconductor chip formed on a top surface of the first semiconductor chip and electrically connected to the first semiconductor chip, wherein first and second conductive layers are formed on the top surfaces of the first semiconductor chip and the second semiconductor chip, respectively, and the first conductive layer and the second conductive layer are connected to a ground portion.
摘要:
A semiconductor device is disclosed including a through electrode. The semiconductor device may include a first semiconductor chip including a transceiver circuit formed on a first surface, a first coupling conductive pattern which is formed on a second surface opposite the first surface, and a through electrode which connects the transceiver circuit and the first coupling conductive pattern. There may be a transceiver located on a second semiconductor chip and including a second coupling conductive pattern facing the first coupling conductive pattern which communicates wirelessly with the first coupling conductive pattern.
摘要:
A delay locked loop includes a closed loop circuit configured to generate preliminary delay information, a control unit configured to update the preliminary delay information into delay information in response to a control signal, and a first delay unit configured to delay an input clock signal by a first delay value determined by the delay information and generate an output clock signal.
摘要:
An internal clock signal generation circuit is capable of controlling a unit delay time depending on a frequency of an external clock signal. The internal clock signal generation circuit includes an internal clock signal generation unit configured to generate an internal clock signal corresponding to a plurality of unit delay cells enabled in response to a control signal, and a unit delay time control unit configured to detect a frequency of an external clock signal and control a unit delay time of each of the plurality of unit delay cells.
摘要:
An electronic information system comprises an external storage device and an application processor. The external storage device stores boot code and the application processor is adapted to receive the boot code from the external storage device and to perform a system booting operation during a power-up operation by executing the boot code.