公开(公告)号：US20240162113A1

公开(公告)日：2024-05-16

申请号：US17985476

申请日：2022-11-11

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Dong Hyeon Park ,  Yun Ah Kim ,  Seok Ho Na ,  Won Ho Choi ,  Dong Su Ryu ,  Jo Hyun Bae ,  Min Jae Kong ,  Jin Young Khim ,  Jae Yeong Bae ,  Dong Hee Kang

IPC分类号： H01L23/42 ,  H01L21/52 ,  H01L21/56 ,  H01L23/00 ,  H01L23/053 ,  H01L23/367 ,  H01L23/498

CPC分类号： H01L23/42 ,  H01L21/52 ,  H01L21/563 ,  H01L23/053 ,  H01L23/3672 ,  H01L23/49822 ,  H01L23/562 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204

摘要： In one example, an electronic device comprises a substrate comprising a conductive structure and an inner side and an outer side, a first electronic component over the inner side of the substrate and coupled with the conductive structure, a lid over the substrate and the first electronic component and comprising a first hole in the lid, and a thermal interface material between the first electronic component and the lid. The thermal interface material is in the first hole. Other examples and related methods are also disclosed herein.

公开(公告)号：US20240363470A1

公开(公告)日：2024-10-31

申请号：US18765853

申请日：2024-07-08

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Yeong Beom Ko ,  Dong Jin Kim ,  Se Woong Cha

IPC分类号： H01L23/31 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538

CPC分类号： H01L23/3185 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73209 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/92124 ,  H01L2224/92242 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/18162

摘要： A semiconductor product in the form of a stack chip package and a method of manufacturing the same, where a plurality of semiconductor chips are stacked one on another so as to enable the exchange of electrical signals between the semiconductor chips, and where a conductive layer is included for inputting and outputting signals to and from individual chips. A stack chip package having a compact size may, for example, be manufactured by stacking, on a first semiconductor chip, a second semiconductor chip having a smaller surface area by means of interconnection structures so as to enable the exchange of electrical signals between the first and second semiconductor chips, and by using a conductive layer for inputting and outputting signals to and from individual semiconductor chips, in lieu of a thick substrate. Furthermore, heat dissipation effects can be enhanced by the addition of a heat dissipation unit.

公开(公告)号：US12131982B2

公开(公告)日：2024-10-29

申请号：US17315674

申请日：2021-05-10

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Tae Kyung Hwang ,  Eun Sook Sohn ,  Won Joon Kang ,  Gi Jeong Kim

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L23/498

CPC分类号： H01L23/49503 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49861 ,  H01L23/49816 ,  H01L2224/16245 ,  H01L2924/181 ,  H01L2924/181 ,  H01L2924/00012

摘要： A method for providing an electronic package structure includes providing a substrate having a die pad having a die pad top surface and an opposing die pad bottom surface, leads laterally spaced apart from the die pad, and a substrate encapsulant interposed between the die pad and the leads and includes a substrate top surface and an opposing substrate bottom surface. The substrate encapsulant is provided such that the die pad and the leads protrude outward from the substrate bottom surface. The method includes providing an electronic device having opposing major surfaces and a pair of opposing outer edges. The method includes connecting the electronic device to the substrate such that one major surface of the electronic device is spaced apart from the die pad top surface and upper surfaces of the leads, and the outer edges overlap an opposing pair of the leads.

公开(公告)号：US12119319B2

公开(公告)日：2024-10-15

申请号：US17549810

申请日：2021-12-13

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Ki Yeul Yang ,  Eun Taek Jeong ,  Du Young Lee

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L24/16 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204

摘要： In one example, an electronic device includes a substrate, which has a dielectric structure includes a dielectric structure top side and a dielectric structure bottom side opposite to the dielectric structure top side, and a conductive structure comprising a protruded via that extends from the dielectric structure bottom side. An electronic component is coupled to the conductive structure at the dielectric structure top side, and a terminal is coupled to the protruded via such that the protruded via extends into the terminal. Other examples and related methods are also disclosed herein.

公开(公告)号：US20240332159A1

公开(公告)日：2024-10-03

申请号：US18733459

申请日：2024-06-04

申请人： Amkor Technology Singapore Holding Pte Ltd.

发明人： Jae Ung Lee ,  Yung Woo Lee ,  EunNaRa Cho ,  Dong Hyun Bang ,  Wook Choi ,  KooWoong Jeong ,  Byong Jin Kim ,  Min Chul Shin ,  Ho Jeong Lim ,  Ji Hyun Kim ,  Chang Hun Kim

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/13 ,  H01L23/31 ,  H01L23/50 ,  H01L23/538 ,  H01L25/065 ,  H01L25/16

CPC分类号： H01L23/49838 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L25/16 ,  H01L23/3128 ,  H01L23/50 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19106

摘要： A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.

公开(公告)号：US20240304583A1

公开(公告)日：2024-09-12

申请号：US18606973

申请日：2024-03-15

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Jong Sik Paek ,  Doo Hyun Park

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H01L25/10

CPC分类号： H01L24/17 ,  H01L21/56 ,  H01L21/568 ,  H01L23/3135 ,  H01L24/19 ,  H01L24/85 ,  H01L25/105 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/85 ,  H01L2224/92125 ,  H01L2225/1011 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/19107 ,  H01L2924/3511

摘要： A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise forming a back end of line layer on a dummy substrate, completing at least a first portion of an assembly, and removing the dummy substrate.

公开(公告)号：US20240304558A1

公开(公告)日：2024-09-12

申请号：US18668210

申请日：2024-05-19

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Young Ju LEE ,  Young Jae CHO ,  Ji Yeon RYU

IPC分类号： H01L23/538 ,  H01L23/522 ,  H01L23/532

CPC分类号： H01L23/5384 ,  H01L23/5223 ,  H01L23/53204 ,  H01L23/5329

摘要： In one example, an electronic device includes a substrate with a substrate front side, a substrate rear side opposite to the substrate front side, a substrate body, and conductive vias extending through the substrate body from the substrate front side to the substrate rear side. A first construct is over the substrate front side and includes a first dielectric structure and first conductors embedded in the first dielectric structure and coupled to the conductive vias. A second construct is over the substrate rear side and includes a second dielectric structure and second conductors embedded in the second dielectric structure and coupled to the conductive vias. One or more of the first conductors or the second conductors define one or more passive devices. Other examples and related methods are also disclosed herein.

公开(公告)号：US20240274445A1

公开(公告)日：2024-08-15

申请号：US18587291

申请日：2024-02-26

申请人： Amkor Technology Singapore Holding Pte. Ltd. ,  Amkor Technology Portugal, S.A.

发明人： Bora Baloglu ,  Suresh Jayaraman ,  Ronald Huemoeller ,  Andre Cardoso ,  Eoin O'Toole ,  Marta Sa Santos ,  Luis Alves ,  Jose Moreira da Silva ,  Fernando Teixeira ,  Jose Luis Silva

IPC分类号： H01L21/67 ,  H01L21/56 ,  H01L21/683

CPC分类号： H01L21/67092 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6836

摘要： A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide an apparatus for manufacturing an electronic device, where the apparatus is operable to, at least, receive a panel to which a subpanel is coupled, cut around a subpanel through a layer of material, and remove such subpanel from the panel. The apparatus may also, for example, be operable to couple to an upper side of the subpanel, and remove the subpanel from the panel by, at least in part, operating to rotate the subpanel relative to the panel.

公开(公告)号：US20240266238A1

公开(公告)日：2024-08-08

申请号：US18594321

申请日：2024-03-04

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Kyeong Tae Kim ,  Yi Seul Han ,  Jae Beom Shim ,  Tae Yong Lee

IPC分类号： H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/48 ,  H01L23/522 ,  H01L23/528

CPC分类号： H01L23/3128 ,  H01L21/56 ,  H01L23/481 ,  H01L23/5226 ,  H01L23/5283 ,  H01L24/09

摘要： In one example, a semiconductor device can comprise (a) an electronic device comprising a device top side, a device bottom side opposite the device top side, and a device sidewall between the device top side and the device bottom side, (b) a first conductor comprising, a first conductor side section on the device sidewall, a first conductor top section on the device top side and coupled to the first conductor side section, and a first conductor bottom section coupled to the first conductor side section, and (c) a protective material covering the first conductor and the electronic device. A lower surface of the first conductor top section can be higher than the device top side, and an upper surface of the first conductor bottom section can be lower than the device top side. Other examples and related methods are also disclosed herein.

公开(公告)号：US12057434B2

公开(公告)日：2024-08-06

申请号：US17977164

申请日：2022-10-31

申请人： Amkor technology Singapore Holding Pte. Ltd.

发明人： Jin Seong Kim ,  Edwin J. Adlam ,  Ludovico E. Bancod ,  Gi Jung Kim ,  Robert Lanzone ,  Jae Ung Lee ,  Yung Woo Lee ,  Mi Kyeong Choi

IPC分类号： H01L25/065 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L23/552 ,  H01L25/00

CPC分类号： H01L25/0652 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/31 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/552 ,  H01L25/50 ,  H01L21/561 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/97 ,  H01L2224/81 ,  H01L2224/97 ,  H01L2224/85 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00

摘要： A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.